Siemens’ Solido SPICE Certified for Multiple Leading-edge Samsung Foundry Processes
Nov 27, 2024 · By Siemens Digital Industries Software · Press Releases
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NXP and Nepes Create Value with their First FO PoP SiP for IoT
Advanced packaging is a key enabling technology that not only serves as packaging support but also offers more value and...
Three Patents Granted to Smoltek
Smoltek, a leading Swedish nanotech company in the semiconductor industry, has expanded its patent portfolio in Asia the last month....
EV Group Unveils Breakthrough Low-Temp Laser Debonding for FOWLP
EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today...
EV Group Brings Home Its Fifth Triple Crown in VLSIresearch Customer Satisfaction Survey
EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today... EV Group Optimizes Resist and Lithographic Processing for Plasma Dicing for Advanced Semiconductor Packaging Applications
EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today...
New Design Flow and OSAT Alliance Program Jump-Start High-density Advanced Packaging
Editor’s note: For several years now, Mentor Graphics has evangelized about the critical need for assembly design kits to enable... EV Group Expands Production Capacity at Corporate Headquarters in Austria
EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today... Rudolph JetStep S Lithography System Advances Panel-based Advanced Packaging
Wilmington, Mass. (May 23, 2017)—Rudolph Technologies, Inc. (NYSE: RTEC) announced today that it has received an order for its JetStep...
SMIC Signs License Agreement For Invensas’ DBI Technology
Semiconductor Manufacturing International Corporation, one of the leading semiconductor foundries in the world and the largest and most advanced foundry...
EV Group Achieves Industry Milestone With Over 1100 Wafer Bonding Chambers Installed Worldwide
Demand for EVG wafer bonding solutions driven by accelerated production ramp in advanced packaging, advanced MEMS devices, and CMOS image...
UnitySC Receives Multiple Orders for Wafer Thinning Inspection Systems
Grenoble, France, May 9, 2017 – UnitySC, a leader in advanced inspection and metrology solutions, today announced multiple orders from...
Multiple Orders for Rudolph’s Firefly Inspection System Marks Early Success
Wilmington, Mass. (May 1, 2017) Rudolph Technologies, Inc. (NYSE: RTEC) announced today that two of the industry’s leading suppliers of...
TechSearch International Analyzes High-Performance Package Trends
A variety of alternatives is challenging silicon’s role in advanced packaging interposers for high-performance package applications. The first applications using...
Equipment & Materials for Fan-out: What is the Impact of On Manufacturing Markets?
2016 was a turning point for fan-out (FO) packaging. With Apple’s entrance and its subsequent decision to package its A10...
Advanced Packaging Industry: What We Can Expect in 2017…
2016 was the year of strong consolidations in the semiconductor industry. Yole Développement (Yole) highlights many mergers and acquisitions with...
MRSI Systems Delivered 3-Micron Die Bonder to AIM Photonics Academy’s Education and Practice Factory at MIT
North Billerica, MA, USA, March 20, 2017 — MRSI Systems, a leading provider of fully automated, high-speed, high-precision die bonding...
UnitySC Pushes The Boundaries of Measurement with New Nanotopography Metrology Platform
Grenoble, France, March 14, 2017 – UnitySC, a wholly owned subsidiary of FOGALE Nanotech Group and a leader in inspection...
EV Group Breaks Speed and Accuracy Barrier in Mask Alignment Lithography for Semiconductor Advanced Packaging
FLORIAN, Austria, March 8, 2017—EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology...Rudolph Receives Multi-System Order from Leading Memory Manufacturer for Advanced Memory Ramp
Wilmington, Mass. (February 16, 2017)—Rudolph Technologies, Inc. (NYSE: RTEC) announced today that a leading memory manufacturer in Asia has placed orders...
