Eighteen New Semiconductor Fabs to Start Construction in 2025, SEMI Reports
Jan 07, 2025 · By SEMI · Press Releases
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Apple selected substrate-like PCBs for its latest iPhones. Who’s next?
The semiconductor industry’s trends are affecting the semiconductor package and package-to-board interconnect level. Performance-driven applications like PCs and smartphones are... EV Group and IBM Sign License Agreement on Laser Debonding Technology
EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, and... MRSI Systems’ New MRSI-HVM3 Die Bonder System Has Entered Volume Production
North Billerica, MA, March 6, 2018 – MRSI Systems, a leading provider of fully automated, ultra-precision, high speed die bonding and... TechSearch International Analysis Shows Packaging for Cryptocurrency Provides a Windfall
Projections for PC growth are flat and shipments of smartphones show low growth rates. Demand for cryptocurrency devices in flip-chip... Well-established Advanced Packaging Manufacturer in Taiwan selects Trymax
NIJMEGEN, The Netherlands (March. 02, 2018) – Semiconductor equipment manufacturer Trymax announced today that a Taiwanese establishes advanced packaging manufacturer selects... Rudolph Technologies Expands Memory Customer Base with $21 Million in System Orders
Wilmington, Mass. (January 16, 2018)—Rudolph Technologies, Inc. (NYSE: RTEC) announced today that it has received over $21 million (USD) in... aveni® S.A. Announces Breakthrough Electrical Yield Results for 12:1 Aspect Ratio TSVs
MASSY, France – Jan. 23, 2018 – aveni S.A., developer and manufacturer of market-disrupting wet deposition technologies and chemistries for...
SEMI ISS 2018: AI, IoT, Automotive to Fuel Industry Growth
HALF MOON BAY, Calif. — January 17, 2018 — The SEMI Industry Strategy Symposium ( SEMI ISS) opened yesterday with the... Luc Van den hove to Receive SEMI Sales and Marketing Excellence Award
MILPITAS, CA — January 11, 2018 — SEMI today announced that Luc Van den hove, president and CEO of imec,...
TechSearch International Analyzes New Automotive Packaging Trends
More than 80 companies are developing autonomous vehicles and many more are involved in providing sensors and computational systems for... New SEMI Japan President to Drive SEMI 2.0 in Japan
SEMI today announced the appointment of Masahiko (Jim) Hamajima as president of SEMI Japan. Reporting to SEMI president and CEO...
EV Group Completes Latest Phase of Production Capacity Expansion at Corporate HQ
EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets,... EV Group Installs Low-temperature Plasma Activation System for Compound Semiconductor Research at the University of Tokyo
EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today... Trymax and AST China Partner to Distribute and Support Customers in China
NIJMEGEN, The Netherlands and Beijing, China (Oct. 10, 2017) – Trymax Semiconductor Equipment BV and AST China announced today that... TechSearch International Forecasts Growth for High-Density FO-WLP and Examines Panel Potential
Growth for high-density fan-out wafer level packages (FO-WLPs) continues unabated, with Apple’s continued use of TSMC’s InFO process in its...
Merck Brings Material Solutions to the Automotive Industry
Munich, Germany, November 14, 2017– Merck, a leading science and technology company, is offering material solutions to the next generation... Leti Demonstrates World’s First 300-mm Wafer-to-Wafer Direct Hybrid Bonding with 1-Micron Pitch on EV Group System
EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, and... The Memory Packaging Market Shows Steady Growth
The memory industry is experiencing a strong growth phase: the total memory market is expected to increase at a ~9%... MEMS Packaging Market is Growing Faster Than The MEMS Devices Market
According to Yole Développement (Yole), the MEMS packaging market will grow from US$2.56 billion in 2016 to US$6.46 billion in... 
