Siemens’ Solido SPICE Certified for Multiple Leading-edge Samsung Foundry Processes
Nov 27, 2024 · By Siemens Digital Industries Software · Press Releases
Latest Posts - Page 42
Merck Brings Material Solutions to the Automotive Industry
Munich, Germany, November 14, 2017– Merck, a leading science and technology company, is offering material solutions to the next generation...
Leti Demonstrates World’s First 300-mm Wafer-to-Wafer Direct Hybrid Bonding with 1-Micron Pitch on EV Group System
EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, and... The Memory Packaging Market Shows Steady Growth
The memory industry is experiencing a strong growth phase: the total memory market is expected to increase at a ~9%... MEMS Packaging Market is Growing Faster Than The MEMS Devices Market
According to Yole Développement (Yole), the MEMS packaging market will grow from US$2.56 billion in 2016 to US$6.46 billion in... aveni® S.A. Raises EUR 8.9M ($10.5M) to Commercialize its Innovative Metallization Technologies
PARIS, FRANCE–(Marketwired – Oct 24, 2017) – aveni S.A., developer and manufacturer of market disrupting wet deposition technologies and chemistries...
UnitySC Opens Global Software Development Center and Customer Demo Lab in the U.S.
Austin, Texas – Oct. 23, 2017 – UnitySC today announced at the International Wafer Level Packaging Conference (IWLPC) in San... imec and Analog Devices Sign Strategic Research Partnership for Development of Next-Generation IoT Devices
LEUVEN, Belgium, and NORWOOD, MA —October 12, 2017—Imec, the world-leading research and innovation hub in nanoelectronics and digital technologies and... EV Group and SwissLitho to Develop Joint Nanoimprint Lithography Solution for 3D Optical Structures with Single-Nanometer Accuracy
EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, and... CEA-Leti Orders KOBUS Solution To Pursue Long-Term Partnership for Advanced CVD
Montbonnot, France, 20th of September 2017 ̶ KOBUS, a leading equipment supplier in advanced deposition solutions, and Leti, a technology...
Samsung’s 8GB HBM2 Becomes a Standard for Innovative Graphic Cards
In the AMD-NVIDIA battle, System Plus Consulting’s experts continue to pursue innovation and monitor progress. At the beginning of the... EV Group Receives Multiple Lithography and Metrology System Orders for Wafer-Level Optics Manufacturing
EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today... Rudolph Announces Multiple Customers’ Acceptance of its Firefly Inspection System
Wilmington, Mass. (September 12, 2017)—Rudolph Technologies, Inc. (NYSE: RTEC) announced today that its Firefly™ Inspection Systems, shipped to fulfill previously...
Rudolph Technologies Launches New Truebump Technology at SEMICON Taiwan 2017
Wilmington, Mass. (September 11, 2017)—Rudolph Technologies, Inc. (NYSE: RTEC) announces new Truebump™ Technology on the Dragonfly™ Inspection System. Truebump Technology...
Technology Showcase Finalists Revealed for European MEMS & Sensors Summit
GRENOBLE, France ─ August 28, 2017 – SEMI®, with its Strategic Association partner MEMS & Sensors Industry Group® (MSIG), today... MRSI Systems Demonstrates MRSI-HVM3 and Sponsors the 1st Laser Executive Forum at CIOE
North Billerica, MA, August 25, 2017 – MRSI Systems, a leading provider of fully automated, ultra-precision, high speed die bonding and... Plasma-Therm and Trymax Partner to Distribute Resist Ashing Products in North America
ST. PETERSBURG, Florida and NIJMEGEN, The Netherlands (Aug. 15, 2017) – Plasma-Therm LLC, and Trymax Semiconductor Equipment BV, announced today... MRSI Systems Launches High-Speed Die Bonder for Photonics High-Volume Manufacturing
BILLERICA, Mass., August 14, 2017 – MRSI Systems, a leading manufacturer of fully automated, ultra-precision, high speed die bonding and epoxy... EV Group Celebrates 20 Years of Supporting Micro- and Nano-Technology Development in Japan
EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today...
TechSearch International Analysis Examines FO-WLP Developments and Sensor Packaging Trends
Mobile devices, specifically smartphones, represent the single greatest volume driver for MEMS and other sensors today. Sensors found in these...
