Siemens’ Solido SPICE Certified for Multiple Leading-edge Samsung Foundry Processes Nov 27, 2024 · By Siemens Digital Industries Software · Press Releases
Indium Corporation Honored by Electronics Era with Excellence in Electronics Assembly Materials Award Nov 27, 2024 · By Indium Corporation · Press Releases
Indium Corporation Technical Expert to Present at SiP Conference China Nov 22, 2024 · By Indium Corporation · Press Releases
EV Group Secures Lithography Order from VTT Technical Research Centre for “More than Moore” ApplicationsMay 16, 2018 · By EV Group EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today...
UnitySC Opens New Asia Entity to Support Advanced Packaging and Power Device MarketsMay 08, 2018 · By UnitySC Hsinchu, Taiwan – May 8, 2018 – UnitySC, a leader in advanced inspection and metrology solutions, today announced the opening...
EV Group Begins Construction of New Manufacturing III Building to Expand Production CapacityMay 03, 2018 · By EV Group EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today...
Kamel Ait-Mahiout Appointed as CEO of UnitySCApr 17, 2018 · By UnitySC Grenoble, France – April 17, 2018 – UnitySC, a leader in advanced inspection and metrology solutions for the semiconductor and...
UnitySC Acquires HSEB Dresden GmbH to Become a Global Leader in Semiconductor Process ControlMar 20, 2018 · By UnitySC Grenoble, France – March 20, 2018 – UnitySC, a leader in advanced inspection and metrology solutions, today announced it acquired...
Apple selected substrate-like PCBs for its latest iPhones. Who’s next?Mar 15, 2018 · By Yole Development The semiconductor industry’s trends are affecting the semiconductor package and package-to-board interconnect level. Performance-driven applications like PCs and smartphones are...
EV Group and IBM Sign License Agreement on Laser Debonding TechnologyMar 15, 2018 · By EV Group EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, and...
MRSI Systems’ New MRSI-HVM3 Die Bonder System Has Entered Volume ProductionMar 07, 2018 · By MRSI Systems, Mycronic Group North Billerica, MA, March 6, 2018 – MRSI Systems, a leading provider of fully automated, ultra-precision, high speed die bonding and...
TechSearch International Analysis Shows Packaging for Cryptocurrency Provides a WindfallMar 05, 2018 · By TechSearch International, Inc. Projections for PC growth are flat and shipments of smartphones show low growth rates. Demand for cryptocurrency devices in flip-chip...
Well-established Advanced Packaging Manufacturer in Taiwan selects TrymaxMar 05, 2018 · By Trymax NIJMEGEN, The Netherlands (March. 02, 2018) – Semiconductor equipment manufacturer Trymax announced today that a Taiwanese establishes advanced packaging manufacturer selects...
Rudolph Technologies Expands Memory Customer Base with $21 Million in System OrdersJan 24, 2018 · By Onto Innovation Wilmington, Mass. (January 16, 2018)—Rudolph Technologies, Inc. (NYSE: RTEC) announced today that it has received over $21 million (USD) in...
aveni® S.A. Announces Breakthrough Electrical Yield Results for 12:1 Aspect Ratio TSVsJan 23, 2018 · By aveni MASSY, France – Jan. 23, 2018 – aveni S.A., developer and manufacturer of market-disrupting wet deposition technologies and chemistries for...
SEMI ISS 2018: AI, IoT, Automotive to Fuel Industry GrowthJan 19, 2018 · By SEMI HALF MOON BAY, Calif. — January 17, 2018 — The SEMI Industry Strategy Symposium ( SEMI ISS) opened yesterday with the...
Luc Van den hove to Receive SEMI Sales and Marketing Excellence AwardJan 11, 2018 · By SEMI MILPITAS, CA — January 11, 2018 — SEMI today announced that Luc Van den hove, president and CEO of imec,...
TechSearch International Analyzes New Automotive Packaging TrendsJan 03, 2018 · By TechSearch International, Inc. More than 80 companies are developing autonomous vehicles and many more are involved in providing sensors and computational systems for...
New SEMI Japan President to Drive SEMI 2.0 in JapanJan 02, 2018 · By SEMI SEMI today announced the appointment of Masahiko (Jim) Hamajima as president of SEMI Japan. Reporting to SEMI president and CEO...
EV Group Completes Latest Phase of Production Capacity Expansion at Corporate HQDec 20, 2017 · By EV Group EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets,...
EV Group Installs Low-temperature Plasma Activation System for Compound Semiconductor Research at the University of TokyoDec 13, 2017 · By EV Group EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today...
Trymax and AST China Partner to Distribute and Support Customers in ChinaDec 12, 2017 · By Trymax NIJMEGEN, The Netherlands and Beijing, China (Oct. 10, 2017) – Trymax Semiconductor Equipment BV and AST China announced today that...
TechSearch International Forecasts Growth for High-Density FO-WLP and Examines Panel PotentialNov 28, 2017 · By TechSearch International, Inc. Growth for high-density fan-out wafer level packages (FO-WLPs) continues unabated, with Apple’s continued use of TSMC’s InFO process in its...