Siemens’ Solido SPICE Certified for Multiple Leading-edge Samsung Foundry Processes
Nov 27, 2024 · By Siemens Digital Industries Software · Press Releases
Latest Posts - Page 40
Trymax Turns 15 and Celebrates Success at SEMICON Europa 2018
NIJMEGEN, THE NETHERLANDS – November 08, 2018. Trymax Semiconductor Equipment BV (Trymax), a global leader in plasma solutions for semiconductor...
Rudolph Technologies Releases NovusEdge System for Edge, Notch and Backside Inspection of Unpatterned Wafers
Wilmington, Mass. (November 1, 2018)—Rudolph Technologies, Inc. (NYSE: RTEC) today announced the availability of its NovusEdge™ system for edge, notch and...
Trymax Receives Multi-System Orders from a Leading Chinese Compound Semiconductor Company
NIJMEGEN, THE NETHERLANDS – October 17, 2018 – Trymax Semiconductor Equipment BV (Trymax), a global leader in plasma solutions, today...
And the winners of the MEMS, Imaging and Sensors Summits tech showcases are…
The technology showcases at the European MEMS and Sensors and Imaging Sensors Summits give start-ups and established companies alike ten...
Veeco Announces Changes to Executive Leadership Team
PLAINVIEW, N.Y., September 4, 2018 —Veeco Instruments Inc. (NASDAQ: VECO) today announced that John Peeler, Chairman, and Chief Executive Officer,...
Brewer Science Unveils Dual-Layer Temporary Bonding System and Material for RDL-first Fan-Out Packaging
Rolla, Missouri – Sept. 4, 2018 – Brewer Science, Inc. today from SEMICON Taiwan introduced the latest additions to its... Rudolph Technologies Launches Second-Generation Dragonfly Inspection and Metrology System for Advanced Packaging
Wilmington, Mass. (August 29, 2018)—Rudolph Technologies, Inc. (NYSE: RTEC) today announced its new Dragonfly™ G2 platform, which incorporates many of the...
MRSI’s MRSI-H3TO Die Bonding Product Family Supports the 5G Wireless Network Supply Chain
MRSI Systems (Mycronic Group) is launching the MRSI-H3TO, a new 3μm high speed die bonder which will be the first... MRSI Targets MRSI-H3LD Die Bonder For The High Power Diode Laser Market
MRSI Systems (Mycronic Group), is launching the MRSI-H3LD, a new 3μm high speed die bonder, optimized for bonding large dies... MRSI Systems’ MRSI-HVM3P Extends The MRS-HVM3 Die Bonder Family to New Applications
BILLERICA, Massachusetts, USA, August 20, 2018 – MRSI Systems (Mycronic Group), is expanding its leading high-speed MRSI-HVM3 die bonder platform with...
TechSearch International Analyzes Trends in Packages for AI Applications
Artificial Intelligence (AI) combines both hardware and software. TechSearch International’s latest analysis explains the packages behind AI applications. AI accelerators found...
Xperi and UMC Partner to Produce Direct and Hybrid Bonding 3D Semiconductor Technologies
SAN JOSE, Calif. (August 2, 2018) – Xperi Corporation (Nasdaq: XPER) (“Xperi”) is pleased to announce a partnership with leading...
Leading Memory Chip Manufacturer Purchases Multiple Veeco AP300 Lithography Systems
PLAINVIEW, New York, July 9, 2018 – Veeco Instruments Inc. (Nasdaq: VECO) today announced that one of the world’s leading...
New Defect Inspection Systems Address Process and Tool Monitoring Challenges
MILPITAS, Calif., July 10, 2018—Today KLA-Tencor Corporation (NASDAQ: KLAC) announced two new defect inspection products, addressing two key challenges in... Latest Abatement System Installation Marks a Milestone of Success for Edwards
SAN FRANCISCO – SEMICON West (11 July 2018) – Edwards Vacuum, a leading manufacturer of vacuum and abatement solutions, announces a milestone of 10,000...
EV Group Accelerates 3D-IC Packaging Roadmap with Breakthrough Wafer Bonding Technology
EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today...
TechSearch International Analyzes Potential for 3D Sensing Modules
Structured light and time of flight (ToF) are the dominant types of 3D sensing used for augmented reality, motion detection,... TechSearch International Analyzes Trends in FO-WLP including Panel Activity
While Apple remains the main customer for TSMC’s Integrated Fan-Out WLP (InFO-WLP), an increasing number of companies are adopting a...
EV Group Earns Sixth Consecutive Triple Crown Win in VLSIresearch 2018 Customer Satisfaction Survey
EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today...
