Siemens’ Solido SPICE Certified for Multiple Leading-edge Samsung Foundry Processes
Nov 27, 2024 · By Siemens Digital Industries Software · Press Releases
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EV Group Highlights 3D Integration Process Solutions at SEMICON Taiwan 2024
Presentations to highlight breakthrough capabilities of EVG’s maskless lithography, hybrid bonding and IR laser release solutions for heterogeneous integration; EVG...
Indium Corporation to Showcase Innovative Materials Powering AI Technology
As a proven leader in innovative materials solutions for future-forward technologies, Indium Corporation will proudly showcase its heterogeneous integration and...
IMAPS Device Packaging Conference 2025 Call for Abstracts
The 21st Annual IMAPS Device Packaging Conference (DPC 2025) will be held in Phoenix, Arizona, on March 3-6, 2025. As...
Global Semiconductor Manufacturing Industry Strengthens in Q2 2024, SEMI Reports
The global semiconductor manufacturing industry in the second quarter of 2024 continued to show signs of improvement with significant growth of...
MULTI-DOF Technology From HEIDENHAIN Gives Hybrid Bonding a Boost
To handle the development of artificial intelligence systems, semiconductor technology required a transition from monolithic chip structures to a chiplet...
2025 IEEE Electronic Components and Technology Conference Announces Call for Papers
The IEEE Electronic Components and Technology Conference (ECTC), the premier technical conference and product exhibition for the world’s semiconductor packaging industry,...
Veeco Announces Agreement With IBM to Explore WaferStorm Wet Processing System for Advanced Packaging Applications
Veeco’s WaferStorm® Wet Processing System to Enable Essential Cleaning Processes in Hybrid Bonding for IBM Veeco Instruments Inc. (NASDAQ: VECO) today...
StratEdge Brings Gold Medal Performance with its Post-fired and Molded Ceramic Packages and High-reliability Assembly Services
StratEdge Corporation is redefining the landscape of semiconductor packaging with its cutting-edge molded and post-fired ceramic packages, supported by industry-leading high-reliability...
SEMI Energy Collaborative Releases Analysis and Recommendations for Increasing Supply of Low Carbon Energy in South Korea
In an effort to help the global semiconductor value chain lower greenhouse gas (GHG) emissions, the industry association SEMI released today its...
Indium Corporation Awards Silver Quill Honor to Authors of Cutting-Edge Technical Content
Indium Corporation has honored nine of its employees for their technical industry contributions with its annual Silver Quill Award. While...
Kulicke & Soffa Announces Thermo-Compression Adoption & Milestones
Kulicke & Soffa announced the introduction of its latest APTURA™ thermo-compression platform in addition to three new milestones relating to industry...
ACM Research Strengthens its Fan-Out Panel Level Packaging Portfolio with Launch of Ultra ECP ap-p Tool
The system delivers superior uniformity, enabling performance and cost efficiencies for next-generation chip packaging ACM Research, Inc., a leading supplier...
SEMI Foundation and Policy Equity Group Collaboration Earns Funding to Address Semiconductor Industry Child Care Gaps
Program Targeting Increased Access to Affordable Care for Industry Workforce Supported by Kellogg and Packard Foundations Seeking to bolster the...
Lam Research Introduces Lam Cryo™ 3.0 Cryogenic Etch Technology to Accelerate Scaling of 3D NAND for the AI Era
Lam Research Corp. (Nasdaq: LRCX) today extended its leadership in 3D NAND flash memory etching with the introduction of Lam Cryo™...
Brewer Science Achieves Certified B Corporation™ Recertification
Certified B Corporation™ recertification and 2024 Impact Report accredit commitment to positive impact. Brewer Science, Inc., a global leader in semiconductor...
Nordson Electronics Solutions Completes Its European Relocation to State-of-the-art Facility
The new demonstration lab includes the latest equipment from three product lines, ASYMTEK, MARCH, and SELECT for electronics manufacturing Nordson... ACM Research Enters Fan-out Panel Level Packaging Market with Introduction of Ultra C vac-p Flux Cleaning Tool
Utilizes vacuum technology and IPA drying to enhance cleaning efficiency for cost-effective fan-out panel-level packaging ACM Research, Inc. (ACM) (NASDAQ:...
QP Technologies and Parent Company, Promex Industries Implement Sales and Marketing Reorganization
Rosie Medina named senior VP of sales and marketing Promex; Matt Hansen named VP of sales and marketing at QP...
Amkor Signs Preliminary Memorandum of Terms with US Department of Commerce for Arizona Advanced Packaging and Test Facility
Amkor Technology, Inc. (Nasdaq: AMKR), a leading provider of semiconductor packaging and test services, has signed a non-binding preliminary memorandum...
