Siemens’ Solido SPICE Certified for Multiple Leading-edge Samsung Foundry Processes
Nov 27, 2024 · By Siemens Digital Industries Software · Press Releases
Latest Posts - Page 39
Unisem Advanced Technologies Selects Two Veeco Tools to Support Expansion of Fan-out Wafer-level Packaging Portfolio
Veeco Instruments Inc. (Nasdaq: VECO) announced today that Unisem Advanced Technologies Sdn Bhd (UAT) has purchased Veeco’s WaferStorm® single wafer...HPC, AI and Datacenters: the 2.5D & 3D Stacking Technologies Playground
“2.5D and 3D stacking technologies are the only solution that meet the required performance of applications like AI[1] and datacenter...
MRSI Systems Welcomes Dr. Limin Zhou as Senior Director of Strategic Marketing
MRSI Systems, part of the Mycronic Group is pleased to announce the appointment of Dr. Limin Zhou as the Senior...Megatrends are Changing the Future of the Lithography Equipment Market
The overall semiconductor equipment market is today worth several billion dollars. By contrast, the permanent bonding, temporary bonding and debonding...Fan-Out Packaging is Becoming Imperative to Stay Competitive in Advanced Packaging
“Fan-out packaging is now a must-have in the portfolio to stay competitive,” asserts Favier Shoo, Technology & Market Analyst and...
ERS electronic GmbH Takes the Lead in Fan-Out Panel Level Packaging Equipment Manufacturing
ERS electronic GmbH, the innovation leader in thermal management solutions for the semiconductor manufacturing industry, is taking the first ever...
Packaging: Consumer Solutions Adapted for Automotive Applications
“Automotive applications are the new El Dorado for microelectronics,” announces Emilie Jolivet, Director, Semiconductor & Software at Yole Développement (Yole)....Rudolph Technologies Receives Orders for Over $15 Million from Major Memory Manufacturer
Wilmington, Mass. (January 15, 2019)—Rudolph Technologies, Inc. (NYSE: RTEC) announced today that it has received orders for over $15 million of...
Rudolph Technologies Announces Rapid Adoption of the Dragonfly G2 System for Advanced Packaging Inspection
Wilmington, Mass. (January 8, 2019)—Rudolph Technologies, Inc. (NYSE: RTEC) announced today that it has received orders for 12 of its...
Fan-out Panel Production Becomes a Reality
Fan-out panel level production is underway at Powertech Technology, Inc. (PTI) for MediaTek’s power management integrated circuit (PMIC) for smartphone...
Polymeric Materials: Massive Adoption by the Advanced Packaging Industry
According to the market research and strategy consulting company, Yole Développement (Yole), the polymeric materials market revenue will double over... Advanced Packaging Technologies are Key for Semiconductor Innovation
“2017 was an unprecedented year for semiconductor industry”, comments Santosh Kumar, Director of Packaging, Assembly, and Substrates at Yole Korea, part...
Rudolph’s NovusEdge Selected by Leading Wafer Manufacturers for Bare Wafer Edge and Backside Inspection
Wilmington, Mass. (12/11/2018)—Rudolph Technologies, Inc. (NYSE: RTEC) today announced the receipt of over $12M in new orders for its recently-released NovusEdge™ system...
Amkor Offers Optical Package Solutions for Multiple Applications
TEMPE, Ariz. December 13, 2018 — Amkor Technology, Inc. (Nasdaq: AMKR), a leading provider of outsourced semiconductor assembly and test... TechSearch International Explores Power Device Packaging and Assembly Trends
Power devices are experiencing growth driven by demand in a variety of areas. TechSearch International projects a 4.3% growth in...
EV Group Unveils Next-Gen Fusion Wafer Bonder for “More Moore” Scaling and Front-End Processing
EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today... EV Group Partners with Plessey to Drive GaN-on-Silicon Monolithic microLED Technology for AR Applications
Plessey, a leading developer of award-winning optoelectronic technology solutions, announces a collaboration with EV Group (EVG), a leading supplier of... Innovations for High Performance Microelectronics Cooperates with EV Group on Low-Temp Covalent Wafer Bonding Technologies
EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today...
UnitySC Unveils New Inspection System for the Advanced Packaging and Wafer Processing Ecosystem
Grenoble, France (November 8, 2018)— UnitySC European leader and a key player in inspection and metrology solutions, today launched the...
