YES Receives Multiple Orders of VertaCure PLP Systems for Advanced Packaging
Jan 09, 2025 · By YES · Press Releases, Uncategorized
Latest Posts - Page 38
Smoltek patent No. 56 now granted
Smoltek is awarded a new patent. This Korean patent is the second of a patent family in the direction of...
Smoltek presents new improved electrical data for CNF-MIM
Smoltek has presented new and improved electrical data for CNF-MIM at EDAPS in Taiwan. The focal point has been on...
Advanced Packaging is Everyone’s Business!
“Changes in the semiconductor supply chain and shifting business models, as well as uncertainty related to US-china trade, creates a...
Air Force Research Laboratory Invests $7.5M in BRIDG efforts to develop secure semiconductor “digital twin”
The U.S. Air Force Research Laboratory (AFRL), the primary scientific research and development center for the Air Force, has awarded...
Vehicle Autonomy & Electrification Push Advanced Packaging for Automotive Applications
“Advanced packaging solutions will double their market shares within the automotive industry in the coming 5 years, reaching US$550 million”...
SUSS MicroTec and BRIDG to Establish a Production-Level Applications Center in North America
SUSS MicroTec, leading supplier of equipment and process solutions for the semiconductor industry, announced today a far-reaching collaboration agreement with...
Lam Research Offers New Capabilities in its Edge Yield Product Portfolio
Lam Research Corp. (Nasdaq: LRCX) is offering new capabilities in its semiconductor manufacturing systems portfolio to further improve device yield...
Cu-Interposer Drives Connectivity to the Next Level
Plan Optik AG, the leading manufacturer of customized wafers from glass, quartz or glass-silicon compound materials has launched its new...
Power Module Packaging: Innovation is Reshaping the Supply Chain
Yole Développement (Yole) power electronics team’s presents this year an optimistic analysis of the power electronics industry. The power device...
MRSI to offer Die bonding Demonstrations at Productronica
MRSI Systems (Mycronic Group) will be exhibiting with Mycronic at Productronica. Die bonding demonstrations will be offered at the Mycronic...
PROPHESEE Joins IRT Nanoelec 3D Integration Program
PROPHESEE Joins IRT Nanoelec 3D Integration Program Will Work with CEA-Leti, STMicroelectronics, Mentor, EVG, and SET to Develop New 3D...Hot Topic: 2020 3D InCites Yearbook Editorial and Advertising Opportunities
We are preparing content for our 2nd annual print edition! 3D InCites is Looking for: Executive viewpoints on today’s megatrends...
nepes Corporation to Acquire Deca Technologies Manufacturing Operations
Deca Technologies is pleased to announce that it has reached an agreement with nepes Corporation (nepes) whereby nepes will expand...
5G: The Battle Still Rages
Consumer demand for mobile phones weakened in 2018, resulting in a market decline. In this context, the competition has intensified,...
Is Fan-Out packaging still popular? Equipment +; material companies are the heartbeats of this ecosystem
“Although the inflated excitement has started to plunge after few years of hype, Fan-Out technologies are still very well established...
High-Performance IC Substrate Manufacturing Reaches an Inflection Point
Driven by advanced packaging substrate needs, the industry has reached an inflection point in IC substrate manufacturing. Increasing I/O counts...
New Sub-Micron Bonder FINEPLACER® lambda 2 to Make European Debut
At Laser World of Photonics in Munich, Finetech will present the successor of its acclaimed sub-micron bonder for research and...
Trymax Receives Order from a Leading-Edge Photonics Research Organization
NIJMEGEN, THE NETHERLANDS- Trymax Semiconductor Equipment BV (Trymax), a global leader in plasma solutions, today announced it has received an...
