Siemens’ Solido SPICE Certified for Multiple Leading-edge Samsung Foundry Processes
Nov 27, 2024 · By Siemens Digital Industries Software · Press Releases
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New Sub-Micron Bonder FINEPLACER® lambda 2 to Make European Debut
At Laser World of Photonics in Munich, Finetech will present the successor of its acclaimed sub-micron bonder for research and...
Trymax Receives Order from a Leading-Edge Photonics Research Organization
NIJMEGEN, THE NETHERLANDS- Trymax Semiconductor Equipment BV (Trymax), a global leader in plasma solutions, today announced it has received an...
MRSI Improves Accuracy of MRSI-H/HVM-Series Die Bonders To to 1.5µm
MRSI Systems (Mycronic Group) is pleased to announce the latest advancement in the MRSI-H/HVM-series line of die bonders. Placement accuracy...Advanced Packaging Industry: A Wonderful World
The semiconductor industry is at a turning point. The slowdown in CMOS scaling, coupled with escalating costs, has prompted the...
EV Group Earns Exceptional Seventh Consecutive Triple Crown Win in VLSIresearch 2019 Customer Satisfaction Survey
EVG continues win streak with 17th consecutive year listed among “THE BEST” suppliers in survey results; frequently cited by customers...
Amkor Leads 5G mmWave Smartphone, IoT and Emerging Applications with Antenna in Package Technology
TEMPE, Ariz., July 22, 2019 — Amkor Technology, Inc. (Nasdaq: AMKR), a leading provider of outsourced semiconductor assembly and test...
EV Group’s MLE Technology Revolutionizes Lithography
EV Group (EVG) today unveiled its maskless exposure technology (MLE™), a revolutionary next-generation lithography technology developed to address future back-end...
Analysis Highlights Impact of Trade Friction on Electronics Industry
The impact of the ban on selling components to Huawei combined with generally lower shipments for PCs and mobile phones...EV Group Invests 30 Million Euros for Capacity Expansion at Corporate Headquarters in Austria
Construction of an additional, large cleanroom in St. Florian am Inn creates additional development, demo and pilot production capacity ...
Advanced Substrates: The Winds of Change
Historically, the integrated circuit (IC) substrate and board industry have assumed a passive role, especially when it comes to innovation....
TechSearch International Analysis Predicts Growth for Fan-in WLP and FO-WLP
TechSearch International predicts strong market growth for fan-in wafer level packages (WLPs) and fan-out WLPs (FO-WLPs). Despite lower growth for...
EV Group Wafer Bonding Solutions for Heterogeneous Integration and Wafer-Level Packaging to be Highlighted at ECTC 2019
Technical papers and interactive poster to highlight the breakthrough capabilities of EVG’s ComBond® high-vacuum bonding system and low-temp laser debonding...
Trymax Receives Multi-System Orders from a Top Ten OSAT
NIJMEGEN, THE NETHERLANDS – May 15, 2019. Trymax Semiconductor Equipment BV (Trymax), a global leader in plasma solutions, today announced...
Trymax Launches New UV Curing and Charge-Erase Product Line
Trymax Semiconductor Equipment BV, a global leader in plasma solutions for semiconductor manufacturers, announces the addition of an ultraviolet (UV)...
EV Group Partners with NSI to Enable First Wafer-level Heterogeneous Integration of GaAs on Silicon for RF Front-end Module Manufacturing
EV Group (EVG), a leading supplier of wafer bonding and lithography equipment, today announced that it has partnered with Ningbo...
Rudolph Technologies Introduces New JetStep Lithography Systems at SEMICON China 2019
Rudolph Technologies, Inc. (NYSE: RTEC) today announced the immediate availability of its new JetStep® lithography systems for advanced packaging processes...
Trymax Signs Strategic Financial Partnership with NIBC Bank
Trymax Semiconductor Equipment BV (Trymax), a global leader in plasma-based equipment and solutions for semiconductor manufacturers, is pleased to announce...
EV Group and Panasonic Team Up on Resist Processing Solution for Plasma Dicing
EV Group (EVG) and Panasonic Smart Factory Solutions Co., Ltd. announced today that both companies have teamed up to provide...
