Siemens’ Solido SPICE Certified for Multiple Leading-edge Samsung Foundry Processes
Nov 27, 2024 · By Siemens Digital Industries Software · Press Releases
Latest Posts - Page 36
Mosaic Microsystems Secures $2 Million Seed Round from BlueSky Capital and Corning
Rochester, NY — Mosaic Microsystems, a microelectronics and photonics packaging company, providing thin glass substrates and through glass vias (TGVs) for...
Smoltek patent No. 57 now granted
Smoltek keep growing its proprietary technology platform. In March 2020, the 57th patent was granted. This is a Pan-European patent...
Smoltek signs evaluation license agreement with leading capacitor manufacturer
Smoltek announces that the company has signed an evaluation agreement with one of the world’s largest capacitor manufacturers. The agreement...
ERS Electronic is Celebrating 50 Years of Thermal Innovation!
Global leader in thermal management solutions We pioneered the thermal wafer testing and invented the AirCool® technology for cooling without...
Finetech Demos Flip-chip Bonding at MIT Bootcamp for Integrated Photonics
On January 17, Finetech participated in the Massachusetts Institute of Technology’s (MIT) Integrated Photonics bootcamp, a week-long, hands-on learning experience...
ACM Research Launches Stress-Free Polishing Tool for Advanced Packaging Applications; Delivers First Tool to Leading Chinese OSAT
Ultra SFP ap Provides Environmentally Friendlier Alternative to Conventional CMP for TSV and Fan-Out Wafer-Level Packaging Processes Fremont, California –...
New SEMI Job Skills Model for Growing Microelectronics Industry Talent Pipeline Released by U.S. Department of Labor – Employment and Training Administration
MILPITAS, Calif. – March 17, 2020 – SEMI today announced the release of a central feature of its workforce development...
NAMICS Receives Intel’s Preferred Quality Supplier Award
NAMICS Corporation has been recognized by Intel as a recipient of a 2019 Preferred Quality Supplier (PQS) Award. The PQS...
2020 IEEE International Reliability Physics Symposium Changed to Virtual Conference; New Date April 28
Due to Concerns Over Coronavirus (COVID-19) Outbreak, the 2020 IEEE International Reliability Physics Symposium Will Be Presented Online as a...
ZEISS Semiconductor Mask Solutions Receives Intel’s Preferred Quality Supplier Award
Jena, Germany, March 5, 2020 — ZEISS Semiconductor Mask Solutions has been recognized by Intel as a recipient of a...
Brewer Science Receives Intel’s Preferred Quality Supplier Award
Rolla, Missouri – March 5, 2020 – Brewer Science has been recognized by Intel as a recipient of a 2019...
Lam Research Breaks New Ground in Etch Technology and Productivity for Chipmaking Processes
FREMONT, Calif., March 03, 2020 (GLOBE NEWSWIRE) — Lam Research Corp. (Nasdaq: LRCX) today announced the launch of a completely...
EV Group Establishes Heterogeneous Integration Competence Center
New HI Competence Center to help customers accelerate new product development fueled by heterogeneous integration and advanced packaging EV Group...
StratEdge Features its High-frequency, High-power Semiconductor Packages and Assembly Services at Three Trade Shows in March
StratEdge Corporation, a leader in the design, production, and assembly of high-frequency and high-power semiconductor packages for microwave, millimeter-wave, and...
ASYMTEK Products Awarded Best New Product and Service Excellence at IPC APEX 2020
Awards Earned by ASYMTEK Products for Best New Product and Service Excellence at IPC APEX 2020 Carlsbad, CA, USA –...
Integrating Community for STEM Education
As we are in the midst of planning our 3D InCites 2020 Awards Ceremony and event to be held next...
Unisem Advanced Technologies Selects Two Veeco Tools to Support Expansion of Fan-Out Wafer-Level Packaging Portfolio
Veeco’s WaferStorm® Platform and AP300™ Lithography System Deliver Premier Process Performance, Platform Flexibility and Low Cost of Ownership PLAINVIEW, New...
Emerging Market for Low-Density Panel FO Analyzed
Large area fan-out (FO) remains a hot topic in the industry. There is some confusion over the term “panel” because...
ZEISS Accelerates Semiconductor Package Failure Analysis by Orders of Magnitude with Crossbeam Laser FIB-SEM
Pleasanton, Calif., and Oberkochen, Germany, February 4, 2020 — ZEISS today introduced the ZEISS Crossbeam Laser — a new family...
