Mycronic Global Technologies Division Acquires Hprobe
Mar 13, 2025 · By MRSI Systems, Mycronic Group · Press Releases
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Dragan Cekic Joins YES as VP of Sales, Americas & Europe
FREMONT, Calif. – Feb 16, 2021 YES (Yield Engineering Systems, Inc.), a leading manufacturer of process equipment for semiconductor advanced...
Siemens and ASE Introduce Enablement Technologies for Next-generation High Density Advanced Package Designs
Siemens Digital Industries Software today announced that its collaboration with Advanced Semiconductor Engineering, Inc. (ASE) has generated two new enablement...
Brewer Science Earns GreenCircle Certification for Zero Waste to Landfill for Sixth Consecutive Year
Brewer Science is the Only Company in the Semiconductor Industry with GreenCircle Certification Rolla, Mo.–February 2021–Brewer Science, a global technology...
Getting a Good Signal: StratEdge’s High-Performance Power Amplifier Packages on the Red Planet
Santee, Calif. — February 4, 2021 — StratEdge Corporation, a leader in the design and production of high-performance semiconductor packages...YES Receives Repeat, Volume VertaCure Order from Major Foundry
FREMONT, Calif. – Feb 3, 2021 YES (Yield Engineering Systems, Inc.), a leading manufacturer of process equipment for semiconductor advanced...
2020 Global Silicon Revenue Remains Stable as Wafer Area Shipments Edge Up Despite COVID-19 Disruption
MILPITAS, Calif. — Feb. 2, 2021 — Worldwide silicon wafer area shipments in 2020 increased while revenue remained unchanged from...MEMS Manufacturing: Trymax’ Most Flexible Plasma Ashing Platform
Meet Trymax’ most flexible Plasma Ashing system for running critical low-temperature descum processes and high-temperature bulk photoresist strip processes. These...ASM Pacific Technology and EV Group Join Forces to Enable Industry’s First Ultra Precision Die-to-Wafer Hybrid Bonding Solutions for 3D-IC Heterogeneous Integration
Joint Development Program will offer highly configurable, ultra-precision end-to-end hybrid bonding solutions to suit various applications, with optimal line balancing...
CyberOptics To Showcase High-Precision Inspection and Metrology Solutions at SEMI Technology Unites Global Summit
Minneapolis, Minnesota — January 29th, 2021 — CyberOptics® Corporation (NASDAQ: CYBE), a leading global developer and manufacturer of high-precision 3D...
Lam Research Advances Next Generation 3D Memory Manufacturing with Revolutionary New Etch Technology
Vantex™ redefines high aspect ratio etching with new innovations in technology and Equipment Intelligence® enabling chipmakers to progress 3D NAND...YES Adds Deca’s Rapid Cure Technology to its Product Line
Unique UV plus direct thermal exposure process brings throughput & performance advantages FREMONT, Calif. – Jan 25, 2021 YES (Yield...
EV Group Establishes State-of-the-Art Customer Training Facility at Corporate Headquarters
EVG Academy doubles the amount of training space and technical trainers; provides training on every class of EVG equipment and...
Key Taiwanese Influencer Names Veeco to International Consortium Aimed at Enabling Semiconductor Technology Roadmap
National Chiao Tung University to Utilize Propel MOCVD Platform for GaN Power and 5G Device Production Plainview, N.Y., Jan. 11,...
40 Years of Innovation – Brewer Science Celebrates Its 40th Anniversary, Daring to Innovate
Rolla, Mo.–January 1, 2021– Brewer Science is celebrating 40 years of being a global leader in developing and manufacturing advanced...
Onto Innovation Announces New Inspection Platform for Leading-Edge Process Control and Device Reliability
Onto Innovation’s latest inspection advances have resulted in multiple orders from a top 3 OSAT and a top 3 image...
Ajit Manocha Named to VLSI Research Semiconductor Industry Hall of Fame
VLSIresearch has added SEMI president and CEO Ajit Manocha to its Semiconductor Industry Hall of Fame for his work on behalf...Vinod Mahendroo Joins YES as SVP Operations
FREMONT, Calif. – Dec 21, 2020YES (Yield Engineering Systems, Inc.), a leading manufacturer of process equipment for semiconductor advanced packaging,...
Onto Innovation Announces First Customer Qualification of New Aspect® IRCD System
Wilmington, Mass., December 16, 2020 – Onto Innovation Inc. (NYSE: ONTO) today announced the first customer acceptance and purchase of...
3D Packaging Pioneers Share 2020 IEEE Electronics Packaging Award
A big 3D InCites congratulations to Professor Mitsumasa Koyanagi of Tohoku University’s New Industry Creation Hatchery Center (NICHe) and Dr....
