YES Receives Multiple Orders of VertaCure PLP Systems for Advanced Packaging
Jan 09, 2025 · By YES · Press Releases, Uncategorized
Latest Posts - Page 35
Smoltek patent No. 62 now granted
Smoltek’s IP related to interposer technology keeps growing. This new US patent is covering energy storage devices embedded in an...
EV Group Brings Maskless Lithography to High-volume Manufacturing with LITHOSCALE
LITHOSCALE® incorporates EVG’s MLE™ (Maskless Exposure) technology to bring the benefits of digital lithography to a wide range of applications...
Innovative Micro Technology (IMT) Modernizes MEMS Foundry Services with Omega® Rapier™Plasma Etch Solution from SPTS Technologies
Addition of the Rapier™ Plasma Etch System adds industry leading DRIE capability to address growing demand for MEMS and Sensors...
KLA Announces Enhanced Portfolio of Systems for Advanced Packaging
New Tools Drive Innovation in Semiconductor Packaging with AI Solutions that Improve Yield and Quality MILPITAS, Calif., Sept. 21, 2020...Lam Research Introduces Advanced Dielectric Gapfill Technology to Enable Next-Generation Devices
New Striker® FE enhanced atomic layer deposition platform addresses semiconductor manufacturing challenges for 3D NAND, DRAM, and Logic chipmakers FREMONT,...
Solve your Semiconductor Packaging Problems with Nordson ELECTRONICS SOLUTIONS at SEMICON Taiwan 2020
Talk to the experts and see demonstrations of the latest equipment for test and inspection, fluid dispensing, and plasma treatment...TechSearch International Projects Growth in FO-WLP Market
The fan-out wafer level package (FO-WLP) market is projected to grow 15.5% in units from 2020 to 2024. Growth is...
Evatec Wins Innovation Prize
In a multi-stage process, the 13-person jury of experts of the Swiss Venture Club (SVC) chose Evatec as the winner...
FINETECH Debuts NEW FINEPLACER FEMTOBLU Micro Assembly Cell for Photonic Component Assembly
FINETECH, a leading provider of precision bonders and advanced rework equipment, announces the latest addition to the FINEPLACER® family, the FINEPLACER® femtoblu...
Helplayer IP-family expands with new granted patent
The constantly expanding Smoltek IP-portfolio is divided into several different patent families. One of them is named Helplayer, a method...
Smoltek Announces Extended License Agreement for Evaluation of CNF-MIM Technology
Smoltek announces that the agreement signed in the spring with a leading capacitor manufacturer for technical and commercial evaluation of...
SEMICON Taiwan 2020 Hybrid to Lead the Way in AI and 5G Era
HSINCHU, Taiwan – September 10, 2020 – Advanced, smart, and green manufacturing will take center stage on-site and online September...
Samsung VP to Keynote IWLPC
San Jose, California – USA – The International Wafer-Level Packaging Conference and Expo announces Dan Oh, Ph.D., Engineering VP of...
ZEISS Adds Advanced Reconstruction Intelligence to 3D Non-destructive X-ray Imaging for Improved Semiconductor Package Failure Analysis
New iterative and deep learning reconstruction algorithms significantly enhance throughput and image quality for ZEISS Xradia Versa and Context microCT...
Smoltek Patent No. 60 Now Granted
Smoltek’s proprietary platform keeps growing as we have been awarded another approved patent. This new US patent covers energy storage...
Scientech Corporation and Trymax Partner to Distribute Resist Ashing and UV Products in Taiwan
NIJMEGEN, The Netherlands and SANTA CLARA, California (Aug. 24, 2020) — Trymax Semiconductor Equipment BV, a global leader in semiconductor...Smoltek Goes Beyond Silicon
At the virtual IEEE NANO 2020 conference in Montreal, Canada Smoltek presented that the CNF-MIM capacitor concept isn’t restrained to...
Get your copy of LAYERS – Thin-film Technology News in Advanced Packaging
LAYERS 5, from Evatec, is your guide to all the latest thin-film technology news across advanced packaging, semiconductor, 0ptoelectronics, and...
Onto Innovation Announces Multiple Orders for JetStep® Panel Lithography System
Three customers select JetStep lithography to interconnect high-performance computing chips within system-in-package products Wilmington, Mass., August 3, 2020 – Onto...
