Press Releases

Latest Posts - Page 34

EV Group’s MLE Technology Revolutionizes Lithography

Jul 05, 2019 · By EV Group

EV Group (EVG) today unveiled its maskless exposure technology (MLE™), a revolutionary next-generation lithography technology developed to address future back-end...

Analysis Highlights Impact of Trade Friction on Electronics Industry

Jul 01, 2019 · By TechSearch International, Inc.

The impact of the ban on selling components to Huawei combined with generally lower shipments for PCs and mobile phones...

EV Group Invests 30 Million Euros for Capacity Expansion at Corporate Headquarters in Austria

Jun 25, 2019 · By EV Group

Construction of an additional, large cleanroom in St. Florian am Inn creates additional development, demo and pilot production capacity ...

Advanced Substrates: The Winds of Change

Jun 12, 2019 · By Yole Development

Historically, the integrated circuit (IC) substrate and board industry have assumed a passive role, especially when it comes to innovation....

TechSearch International Analysis Predicts Growth for Fan-in WLP and FO-WLP

Jun 11, 2019 · By TechSearch International, Inc.

TechSearch International predicts strong market growth for fan-in wafer level packages (WLPs) and fan-out WLPs (FO-WLPs). Despite lower growth for...

EV Group Wafer Bonding Solutions for Heterogeneous Integration and Wafer-Level Packaging to be Highlighted at ECTC 2019

May 21, 2019 · By EV Group

Technical papers and interactive poster to highlight the breakthrough capabilities of EVG’s ComBond® high-vacuum bonding system and low-temp laser debonding...

Trymax Receives Multi-System Orders from a Top Ten OSAT

May 17, 2019 · By Trymax

NIJMEGEN, THE NETHERLANDS – May 15, 2019. Trymax Semiconductor Equipment BV (Trymax), a global leader in plasma solutions, today announced...

Trymax Launches New UV Curing and Charge-Erase Product Line

Mar 28, 2019 · By Trymax

Trymax Semiconductor Equipment BV, a global leader in plasma solutions for semiconductor manufacturers, announces the addition of an ultraviolet (UV)...

EV Group Partners with NSI to Enable First Wafer-level Heterogeneous Integration of GaAs on Silicon for RF Front-end Module Manufacturing

Mar 22, 2019 · By EV Group

EV Group (EVG), a leading supplier of wafer bonding and lithography equipment, today announced that it has partnered with Ningbo...

Rudolph Technologies Introduces New JetStep Lithography Systems at SEMICON China 2019

Mar 19, 2019 · By Onto Innovation

Rudolph Technologies, Inc. (NYSE: RTEC) today announced the immediate availability of its new JetStep® lithography systems for advanced packaging processes...

Trymax Signs Strategic Financial Partnership with NIBC Bank

Mar 19, 2019 · By Trymax

Trymax Semiconductor Equipment BV (Trymax), a global leader in plasma-based equipment and solutions for semiconductor manufacturers, is pleased to announce...

EV Group and Panasonic Team Up on Resist Processing Solution for Plasma Dicing

Mar 14, 2019 · By EV Group

EV Group (EVG) and Panasonic Smart Factory Solutions Co., Ltd. announced today that both companies have teamed up to provide...

KLA Completes Acquisition of Orbotech Ltd.

Feb 20, 2019 · By KLA

MILPITAS, Calif., Feb. 20, 2019—KLA-Tencor Corporation (NASDAQ: KLAC) today announced the completion of the acquisition of Orbotech Ltd. (NASDAQ: ORBK). “We...

Advanced Packaging: at the Heart of Innovation

Feb 14, 2019 · By Yole Development

The semiconductor industry showed impressive figures in 2017: +21.6% year-over-year growth to reach about US$ 412 billion. Without any doubt,...

Unisem Advanced Technologies Selects Two Veeco Tools to Support Expansion of Fan-out Wafer-level Packaging Portfolio

Feb 14, 2019 · By Veeco

Veeco Instruments Inc. (Nasdaq: VECO) announced today that Unisem Advanced Technologies Sdn Bhd (UAT) has purchased Veeco’s WaferStorm® single wafer...

HPC, AI and Datacenters: the 2.5D & 3D Stacking Technologies Playground

Feb 13, 2019 · By Yole Development

“2.5D and 3D stacking technologies are the only solution that meet the required performance of applications like AI[1] and datacenter...

MRSI Systems Welcomes Dr. Limin Zhou as Senior Director of Strategic Marketing

Feb 13, 2019 · By MRSI Systems, Mycronic Group

MRSI Systems, part of the Mycronic Group is pleased to announce the appointment of Dr. Limin Zhou as the Senior...

Megatrends are Changing the Future of the Lithography Equipment Market

Jan 31, 2019 · By Yole Development

The overall semiconductor equipment market is today worth several billion dollars. By contrast, the permanent bonding, temporary bonding and debonding...

Fan-Out Packaging is Becoming Imperative to Stay Competitive in Advanced Packaging