Siemens’ Solido SPICE Certified for Multiple Leading-edge Samsung Foundry Processes
Nov 27, 2024 · By Siemens Digital Industries Software · Press Releases
Latest Posts - Page 33
Vinod Mahendroo Joins YES as SVP Operations
FREMONT, Calif. – Dec 21, 2020YES (Yield Engineering Systems, Inc.), a leading manufacturer of process equipment for semiconductor advanced packaging,...
Onto Innovation Announces First Customer Qualification of New Aspect® IRCD System
Wilmington, Mass., December 16, 2020 – Onto Innovation Inc. (NYSE: ONTO) today announced the first customer acceptance and purchase of...
3D Packaging Pioneers Share 2020 IEEE Electronics Packaging Award
A big 3D InCites congratulations to Professor Mitsumasa Koyanagi of Tohoku University’s New Industry Creation Hatchery Center (NICHe) and Dr....
KLA Introduces Two New Systems that Take On Semiconductor Manufacturing’s Toughest Problems
PWG5™ attacks 3D NAND process issues while Surfscan® SP7XP tackles 3nm logic defectivity Today KLA Corporation (NASDAQ: KLAC) announced two new...
EV Group Unveils Hybrid Die-to-Wafer Bonding Activation Solution to Speed Up Deployment of 3D Heterogeneous Integration
EVG®320 D2W die preparation and activation system provides seamless integration with third-party die bonders; completes EVG’s equipment portfolio for end-to-end...YES EcoCoat Chosen by Leading Biotech Customer to Enable Rapid Point-of-Care Diagnostic Device for COVID-19
Scalability, uniformity, yield, and throughput were critical decision factors FREMONT, Calif. – Dec 10, 2020 YES (Yield Engineering Systems, Inc.),...Alex Chow Joins Yield Engineering Systems, Inc. as Asia Sales President & GM
YES (Yield Engineering Systems, Inc.), a leading manufacturer of process equipment for semiconductor advanced packaging, life sciences and AR/VR applications,...YES and Scientech Sign Strategic Alliance MOU
Scientech to provide local sales, manufacturing and support of YES products in Asia FREMONT, Calif. – Dec 7, 2020YES (Yield...
LPKF Starts Operations of Cleanroom Fab for Manufacturing Glass Microstructure Components
Garbsen, Germany 4 December 2020 – Yesterday, technology company LPKF has opened and started production in their newly built clean...
PDF Solutions Completes Acquisition of Cimetrix
Santa Clara, Calif. – December 1, 2020 – PDF Solutions, Inc. (NASDAQ: PDFS), today announced it has officially closed the...YES Partners with Singapore’s Gaia Science
Specialists in SEA, China science & biotech equipment market to expand YES’s global reach FREMONT, Calif. – Dec 3,...
Enabling Next Generation of FO-PLP and IC-Substrates
EVATEC AG, a leading supplier of thin film equipment and process solutions in Advanced Packaging, Semiconductor, Optoelectronics and Photonics applications,...TechSearch International Examines HBM Growth and Package Options for HBM + Logic
The market for high bandwidth memory (HBM) is projected to grow 49% in wafers, including DRAM and logic layers, from...
Global Semiconductor Company Selects Veeco MOCVD Platform for GaN-Based Power Electronic and 5G RF Devices
PLAINVIEW, N.Y., Nov. 30, 2020 — Veeco Instruments Inc. (NASDAQ: VECO) today announced that Transphorm, Inc. (OTCQB:TGAN), a global supplier...
Smoltek Extends License Agreement for Evaluation of its CNF-MIM Technology
Smoltek Nanotech Holding AB (“Smoltek”) announces that the company has come to an agreement to extend the license agreement signed...Rezwan Lateef Promoted to President of Yield Engineering Systems, Inc.
YES (Yield Engineering Systems, Inc.), a leading manufacturer of process equipment for semiconductor advanced packaging, life sciences and “More-than-Moore” applications,...CyberOptics to Present Fast, 100% Wafer Bump Metrology and Inspection at Virtual IEEE PAINE Conference
Minneapolis, Minnesota— November 18th, 2020 — CyberOptics® Corporation a leading global developer and manufacturer of high-precision 3D sensing technology solutions, will present...Xperi Licenses DBI to Canon for CMOS Image Sensors
Direct Bond Interconnect (DBI®) hybrid bonding portfolio licensed to Canon to enhance image sensors in its industry-leading products SAN JOSE,...
Rarified-Environment Technology Start-Up NoviSphere™ Emerges From Stealth Mode, Launches Pathogen-Eradication System
NoviSphere™ PE 254 uses germicidal UV-C light to kill 99.99% of airborne viruses, bacteria, and other contaminants, creating 24/7 ultraclean...
