Siemens’ Solido SPICE Certified for Multiple Leading-edge Samsung Foundry Processes
Nov 27, 2024 · By Siemens Digital Industries Software · Press Releases
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EV Group Unlocks Agile and Efficient Production Scaling with Next-Generation Step-and-Repeat Nanoimprint Lithography System
EVG®770 NT enables large-area master stamp fabrication of complex micro- and nano-structures for augmented reality waveguides, wafer-level optics and advanced...
Brewer Science Achieves ISO 45001:2018
Global technology leader meets the world’s most widely recognized occupational health and safety management standard Rolla, MO – June 2021...IEEE International Electron Devices Meeting Announces 2021 Call for Papers
SAN FRANCISCO, CA (June 4, 2021) – Under the theme “Devices for a New Era of Electronics: From 2D Materials...TechSearch International’s BGA and CSP Market Analysis
TechSearch International’s BGA and CSP Market Analysis The industry saw strong production growth in 2020 and Q1 2021 was a...
LPKF Receives a Major Order from a Leading Chip Manufacturer for High Volume Manufacturing Equipment of Glass Wafers for Semiconductor Packaging
Garbsen, 1 June 2021 – LPKF Laser & Electronics has received a follow-up order for additional laser systems from the...
YES and SPEC Sign Strategic Alliance Agreement
Agreement covers design, manufacture and distribution of semiconductor equipment YES (Yield Engineering Systems, Inc.), a leading manufacturer of process equipment...CyberOptics Attributes Strong First Quarter to Robust Sales of 3D MRS™ Sensors and Semiconductor Products
CyberOptics Corporation (Nasdaq: CYBE) reported sales of $17.7 million for the first quarter of 2021 ended March 31, an increase...ESD Alliance Names 10-Member Governing Council to Two-Year Term
Arm’s Simon Segars Continues as Chair of the Governing Council MILPITAS, CALIF. –– May 20, 2021 –– The Electronic System...
Reno Sub-Systems Launches GenMatch™ Series of Integrated RF Power Systems for Semiconductor Manufacturing At 7nm or Below
Reno Sub-Systems (Reno), a developer of high performance radio frequency (RF) matching networks for leading-edge nanoscale semiconductor manufacturing, today introduced...
Brewer Science Recognized as Certified B Corporation
Global technology leader meets highest standards of corporate social and environmental performance, transparency, and accountability to all their stakeholders. Rolla,...
ASE Kaohsiung Achieves 20 million Tons of Water Savings Milestone in Line with its Water Management Strategy
Kaohsiung, Taiwan. May 10, 2021. ASE understands the vulnerability of water disruption to its operations and as such, is leading...
Veeco Announces Leading Semiconductor Company Orders Lithography Systems
Veeco Instruments Inc. (NASDAQ: VECO) announced that a world leader in semiconductor assembly and testing has placed a multi-system order...
Founding Member Brewer Science Announces Launch of the American Materials Technology Partnership
The Coalition Aims to Secure the Future of Materials Innovation ROLLA, Mo., May 11, 2021 /PRNewswire/ — Brewer Science, an international...
Boost Fluid Dispensing Throughput up to 100% with the New ASYMTEK Forte™ MAX System from Nordson Electronics Solutions
ASYMTEK Forte™ MAX offers dual jetting with real-time skew correction for faster, enhanced, automated fluid dispensing Carlsbad, CA, USA –27...
StratEdge SMK Surface Mount Packages Support DC to 26 GHz Devices
Santee, Calif. — 27 April 2021 —StratEdge Corporation, leader in the design and production of high-performance semiconductor packages for microwave,...
Empire State Development’s New York Ventures announces $250,000 investment in Rochester Based Mosaic Microsystems
Microelectronics and Photonics Packaging Company to Apply Additional Seed Investment to Continue Aggressive Growth Initiatives. New York Ventures Provides Capital to... YES Joins Forces with EV Group
YES EcoCoat™ to be installed at EVG’s NILPhotonics® Competence Center in Austria FREMONT, Calif. – Apr 19, 2021YES (Yield Engineering...Trymax Wafer Level Packaging DCP™ Plasma Treatment
As semiconductor device manufacturers further shrink the size and increase the reliability of packaging devices, plasma treatment is increasingly used...
ASE Wins Sustainability Award
Advanced Semiconductor Engineering, Inc. (ASE) announced today that it has received the 3D InCites 2021 Sustainability Award. This inaugural award... 