Press Releases

ZEISS Microscopy Showcases AI-Powered Failure Analysis

ZEISS announces involvement at 50th Annual ISTFA Conference Preview of new focused ion beam scanning electron microscopy (FIB-SEM) solutions Virtual...

Amkor and TSMC to Expand Partnership and Collaborate on Advanced Packaging in Arizona

Amkor Technology and TSMC announced today that the two companies have signed a memorandum of understanding to collaborate and bring advanced packaging and...

Brewer Science Presents Materials Innovation for Additive Electronics at InterPACK 2024

Building Circuits from the Ground Up: Domestic Advanced Packaging Relies on Additive Manufacturing Brewer Science, Inc., a global leader in...

ZEISS Microscopy Opens Semiconductor Applications Laboratory in Dresden

State-of-the-art innovation lab pushes the limits of advanced semiconductor applications ZEISS has announced it recently opened the ZEISS Microscopy semiconductor...

Nordson Electronics Solutions Manufacturing Facilities Maintain ISO 9001:2015 Quality Management System Certifications

Factories in Carlsbad, California, USA and Suzhou, China design and build fluid dispensing and conformal coating equipment used in electronics...

MRSI Mycronic Introduces Next Generation High Precision Epoxy Dispenser for Advanced Packaging

MRSI Mycronic, a leading manufacturer of fully automated, high-precision, high-speed, flexible die bonding, active alignment, and epoxy dispensing systems, proudly...

SEMI Consortium to Develop Cybersecurity Strategy and Roadmap for the Semiconductor Industry in NIST Framework

Seeking to strengthen the semiconductor industry’s resilience to cybersecurity threats, the global association SEMI today announced the creation of a...

Biden-Harris Administration Launches NSTC Workforce Center of Excellence with Expected $250 Million Investment

Includes an anticipated $11.5 million for the first workforce development awardees to address critical U.S. job and skill gaps across...

Siemens Extends Collaboration With TSMC to Advance Integrated Circuit and Systems Design

Siemens Digital Industries Software today announced it has extended its longstanding collaboration with TSMC through multiple new development projects, product...

Materials for Hybrid Bonding Presented by Brewer Science at IMAPS 2024

Experience higher integration density and improved performance through hybrid bonding techniques Brewer Science, Inc., a pioneer in temporary bonding and...

Lam Research Honors Global Suppliers with 2024 Excellence Awards

Lam Research Corp. today announced this year’s recipients of its annual Supplier Excellence Awards, recognizing nine companies from around the world for...

Indium Corporation Experts to Present Advanced Research at International Symposium on Microelectronics

Indium Corporation experts will lead three presentations and a poster presentation at the 57th International Symposium on Microelectronics, organized by...

NHanced Semiconductors President Robert Patti to Deliver Keynote at IEEE 3DIC Conference in Sendai, Japan

Patti’s keynote address will highlight the role of advanced packaging in extending the progress of Moore’s Law in semiconductor development...

Indium Corporation Earns Mexico Technology Award for High-Reliability Alloy for Solder Paste

Indium Corporation has earned a Mexico Technology Award for its high-reliability mixed-alloy for solder paste, Durafuse® HR. The award was presented during an awards ceremony on September 11 at...

Dr. Jason Cong to be Honored With 2024 Phil Kaufman Award

Recognized for Significant Contributions to FPGA Design Automation Technology and Electronic System Design Education and Industry Dr. Jason Cong, Distinguished...

Brewer Science Elevates Veteran Leader and Welcomes New Market Strategy Officer to Propel Future Growth in Semiconductor Industry

Corporate leadership developments to drive projected growth and innovation Brewer Science, Inc., a global leader in developing and manufacturing innovative...

MEMS & Imaging Sensors Summit to Highlight Innovations Driving the Next Generation of Connectivity

The SEMI MEMS & Imaging Sensors Summit, themed Sensor Revolution for a Connected Future, is set to bring together some of the...

StratEdge Semiconductor Packages Set to Take the Spotlight at European Microwave Week and IMAPS Symposium

StratEdge Corporation, leader in the design and production of high-performance semiconductor packages for microwave, millimeter-wave, and high-power devices, announces that it...

Indium Corporation Experts to Speak on Sustainable e-Mobility and PCB Supply Solutions at Productronica India

Indium Corporation Senior Sales and Business Development Manager, Chris Nash, will present at the e-Mobility Conference at Productronica India, on...