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SkyWater Signs Technology Transfer and License Agreement for Deca’s Gen 2 M-Series Fan-out and Adaptive Patterning Technology

Oct 13, 2021 · By DECA

Technology enables state-of-the-art onshore advanced packaging foundry services KISSIMMEE, Fla. and TEMPE, Ariz. – October 12, 2021 – SkyWater Technology (NASDAQ:...

Xperi Licenses Hybrid Bonding Technology to Yangtze Memory Technologies Co., Ltd. (YMTC)

Oct 12, 2021 · By Adeia

Direct Bond Interconnect (DBI®) hybrid bonding portfolio licensed to YMTC for its 3D NAND memory products SAN JOSE, Calif. –Xperi...

YES Acquires Kanthal’s Semiconductor Capital Equipment Business

Oct 07, 2021 · By YES

High-Temperature Technology Further Expands YES’s Thermal Processing Portfolio FREMONT, Calif. – Oct 7, 2021 – YES (Yield Engineering Systems, Inc.),...

StratEdge to Present Glass Sidewall for Power Semiconductors and Ceramic Packages for 5G at IMAPS 2021 Live

Sep 30, 2021 · By StratEdge

Santee, Calif. — 30 September 2021 — StratEdge Corporation, leader in the design, production, and assembly of high-frequency and high-power semiconductor packages...

Kimihiko Matsubara Selected as General Manager of YES Japan

Sep 29, 2021 · By YES

YES (Yield Engineering Systems, Inc.), a leading manufacturer of process equipment for semiconductor advanced packaging, life sciences and “More-than-Moore” applications,...

Smoltek Publishes Update on Operational Activities in the Group Company Smoltek Semi

Sep 29, 2021 · By Smoltek

Smoltek Nanotech Holding AB (“Smoltek”) hereby updates on the activities within the group company Smoltek Semi AB, which focuses on...

ACM Research Ships Its First 300mm, High-Temp Single-Wafer SPM Tool for Advanced Logic, DRAM and 3D-NAND Semiconductor Manufacturing

Sep 23, 2021 · By ACM Research

ACM Research, Inc. a leading supplier of wafer processing solutions for semiconductor and advanced wafer-level packaging (WLP) applications, today announced it...

CyberOptics Highlights the New SQ3000™+ Inspection and Metrology System at NEPCON Asia

Sep 16, 2021 · By Nordson Test and Inspection

Minneapolis, Minnesota — September 16, 2021 — CyberOptics® Corporation (NASDAQ: CYBE), a leading global developer and manufacturer of high-precision 3D...

Lam Research to Open New Semiconductor Equipment Manufacturing Facility in Oregon

Sep 09, 2021 · By Lam Research

Hiring is underway for hundreds of new roles in the City of Sherwood FREMONT, Calif., Sept. 09, 2021 – Lam Research Corp. (Nasdaq: LRCX) today...

Onto Innovation’s Dragonfly® Inspection Platform Projecting Record Annual Growth in 2021

Sep 01, 2021 · By Onto Innovation

Dragonfly system growth accelerated by tier 1 customer adoption WILMINGTON, Mass.–(BUSINESS WIRE)– Onto Innovation Inc. (NYSE: ONTO) (“Onto Innovation”, “Onto”,...

Smoltek Extends Evaluation License for its CNF-MIM Capacitor Technology to Increase Focus on Commercial Production Aspects

Aug 31, 2021 · By Smoltek

Smoltek Nanotech Holding AB (“Smoltek”) announces that the license agreement, signed with a global manufacturer of electronic components for its...

World’s Best Industrial Studio Featuring SurplusGLOBAL

Aug 30, 2021 · By SurplusGLOBAL

Collaborating with ELLE’s September edition. In September’s ELLE magazine issue, SurplusGLOBAL Semiconductor Equipment Cluster was used as the industrial studio...

ACM Research Launches Its First Plating Tool to Support Wafer-Level Packaging and Plating Applications in Compound Semiconductor Manufacturing

Aug 30, 2021 · By ACM Research

Automated system for flat or notched wafers; multiple orders to ship during third quarter of 2021 Fremont, Calif. – August 25,...

Cooperation of ZKW Group with Silicon Austrian Labs, Evatec, EV Group and TDK Electronics advances light projection technology

Aug 26, 2021 · By EV Group

WIESELBURG, Austria, August 25, 2021—Together with research partners Silicon Austrian Labs, Evatec, EV Group and TDK Electronics, ZKW is working...

ACM Research Enters Bevel Etch Market to Support Emerging Process Steps in 3D NAND, DRAM and Advanced Logic Manufacturing

Aug 25, 2021 · By ACM Research

Wet process offers edge etch and clean to improve wafer yield with high throughput and low chemical consumption; First tool...

CyberOptics to Showcase High-Precision Inspection and Metrology Solutions at the SEMI Connecting Heterogeneous Systems Summit

Aug 10, 2021 · By Nordson Test and Inspection

Minneapolis, Minnesota — August 4, 2021 — CyberOptics® Corporation (NASDAQ: CYBE), a leading global developer and manufacturer of high-precision 3D...

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