Siemens’ Solido SPICE Certified for Multiple Leading-edge Samsung Foundry Processes
Nov 27, 2024 · By Siemens Digital Industries Software · Press Releases
Latest Posts - Page 26
Top Tier Semiconductor Supplier Qualifies Veeco’s Wet Processing System for Next Generation High Bandwidth Memory Applications
Plainview, N.Y. — Veeco Instruments Inc. (NASDAQ: VECO) today announced that a world leading semiconductor supplier has qualified Veeco’s WaferStorm® Wet...EV Group Recognized by Bosch as a Preferred Supplier of Semiconductor Equipment
EVG is the first semiconductor equipment supplier ever to receive Preferred Supplier status EV Group (EVG), a leading supplier of...
Smoltek Patent No. 71 Now Granted
Smoltek is awarded a new patent in Korea. This patent is the fourth one of the patent family in the...
New Multi-Functional Micro- and Nanoimprint Solution from EV Group Offers Unprecedented Flexibility for High-Volume Optical Device Manufacturing
ST. FLORIAN, Austria, January 18, 2022—EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS,...
Gel-Pak to Showcase New Micro Textured Device Carrier at Photonics West
HAYWARD, CA January 14, 2022: Gel-Pak, a Delphon company and worldwide leader in protective carriers for optoelectronic devices, will showcase...
YES Announced that Victor Huang has Joined the Company as its First Vice President of Legal Affairs
YES (Yield Engineering Systems, Inc.), a leading manufacturer of process equipment for semiconductor advanced packaging, life sciences and “More-than-Moore” applications,...
Onto Innovation Announces Growing $500 Million Order Backlog, Including Solutions for Heterogeneous Packaging
Over $100 million in orders encompass solutions for 2.5D, 3D packaging and hybrid bonding applications WILMINGTON, Mass.–(BUSINESS WIRE)– Onto Innovation...
Smoltek Appoints Farzan Ghavanini as New CTO Effective April 1, 2022
Smoltek Nanotech Holding AB (“Smoltek”) announces that the company has recruited Farzan Ghavanini, with solid experience from leading positions in...
MRSI-H-TO 1.5 micron Die Bonder Won the Award for “Infostone 2022 Outstanding Technology”
On January 11, 2022, the Infostone 2022 Annual meeting and the 8th Heroes List awards ceremony were held. Infostone announced...
Deca Helps Nepes Laweh Set New Industry Benchmark With 600mm Large Panel M-Series Fan-Out Volume Production
Nepes Laweh corporation announced the successful production of the world’s first 600mm x 600mm large Panel Level Packaging (PLP) using...Delphon Appoints Joseph Montano as CEO
Hayward, CA, January 4, 2022: Delphon, a worldwide provider of engineered polymer and adhesive products for the semiconductor, photonics, medical...
Smoltek Extends Evaluation Agreement with Global Manufacturer of Capacitors
Smoltek Nanotech Holding AB (“Smoltek”) announces that the evaluation agreement that the company signed in April 2020 with a large...
YES Inc. Acquires SPEC
Yield Engineering Systems, Inc. (YES), a leading manufacturer of process equipment for semiconductor advanced packaging, life sciences, and “More-than-Moore” applications,...
Dr. Anirudh Devgan Honored With 2021 Phil Kaufman Award
Cadence President and CEO Recognized for Making a Significant Impact on the EDA Industry Through Pioneering Technical Contributions and Business...
Lam Research Unveils Syndion GP to Help Chipmakers Meet Demand for Advanced Power Devices
Expanding Company’s Leadership in Deep Silicon Etch Technology, New Semiconductor Manufacturing Solution Supports Development of Chips for Automotive and Smart...
Brewer Science Celebrates 20-year Anniversary of Establishing Asia Location
Tech company recognizes Asia presence is crucial to continuous growth Taipei, Taiwan–November 28, 2021– Brewer Science, a global leader in...
CyberOptics to Deliver Technical Presentation About the Importance of 3D Inspection for Advanced Packaging at SEMICON Taiwan
Paper Titled ‘3D Inspection Is Becoming Essential in Advanced Packaging (AP)’ Minneapolis, Minnesota — November 29, 2021 — CyberOptics® Corporation...
CyberOptics Wins Prestigious GLOBAL Technology Award for WX3000 Metrology and Inspection System
Minneapolis, Minnesota — November 17, 2021 — CyberOptics® Corporation (NASDAQ: CYBE), a leading global developer and manufacturer of high–precision 3D...
Veeco Ships First Laser Annealing System from New San Jose Manufacturing Facility Designed to Serve the Semiconductor Market
Plainview, N.Y., November 22, 2021—Veeco Instruments Inc. (NASDAQ: VECO) today announced they have shipped the first LSA101 Laser Spike Annealing...
