Siemens’ Solido SPICE Certified for Multiple Leading-edge Samsung Foundry Processes
Nov 27, 2024 · By Siemens Digital Industries Software · Press Releases
Latest Posts - Page 23
Taiwan Semiconductor Research Institute Selects Veeco MOCVD System for Advanced R&D and Technology Collaboration for Power and RF Applications
Plainview, N.Y., June 8, 2022—Veeco Instruments Inc. (NASDAQ: VECO) today announced that the Taiwan Semiconductor Research Institute, National Applied Research...
Tokyo Electron Introduces Ulucus™ L, a Laser Edge Trimming System for 300ｍｍ Wafer-Bonded Devices
Tokyo Electron (TEL; Head Office: Minato-ku, Tokyo; President: Toshiki Kawai) today announced the launch of Ulucus™ L, a laser edge...
Intelligent Sensing for Better and Smarter Living – MEMS & Imaging Sensors Summit Returns to Grenoble
GRENOBLE, France – June 7, 2022 – With MEMS and imaging sensor innovations driving an explosion in medical, mobility, communications and other Smart...
ClassOne Technology and Fraunhofer ENAS to Collaborate on Hybrid Bonding for Advanced Imaging Devices
Partnership will leverage firms’ respective heterogeneous-integration proficiencies to focus on development and optimization of full process-integration schemes for diverse high-density...
Yield Engineering Systems Signs Lease For Technology Center In Chandler
The facility will support U.S. semiconductor manufacturing, creating nearly 100 jobs CHANDLER, AZ (June 1, 2022) — Yield Engineering Systems, known...
ASE Introduces VIPack™ to Help Transform Packaging Solution Enablement
SUNNYVALE, Calif., June 1st, 2022 –Advanced Semiconductor Engineering, Inc. (ASE), a member of ASE Technology Holding Co., Ltd. (NYSE:ASX, TAIEX:...
SEMI Foundation Awarded $1.5 Million Grant to Bolster Michigan’s Semiconductor Industry Talent Pipeline
Foundation to develop semiconductor job training in Michigan under SEMI Career and Apprenticeship Network (SCAN) program MILPITAS, Calif. — May...
EV Group Lithography Solutions for Heterogeneous Integration and Wafer-level Packaging to Be Highlighted at ECTC 2022
Technical papers to highlight the breakthrough capabilities of EVG’s LITHOSCALE® maskless lithography solution and OmniSpray® resist coating technology for “More...
ERS electronic Introduces ProbeSense™ State-of-the-art Measurement Device for Automated Temperature Calibration in Wafer Test
ERS electronic, the industry leader in the market of thermal management solutions for semiconductor manufacturing, has developed a temperature calibration...
Technology Industry Veteran Joe Stockunas Joins SEMI as Americas President
MILPITAS, Calif. — May 24, 2022 — SEMI, the global industry association that unites the entire electronics manufacturing and design supply...
Glass Carrier for GaAs Wafer Processing
Gallium arsenide (GaAs) is used in the manufacture of devices such as microwave frequency integrated circuits, monolithic microwave integrated circuits,...
Getting a Reliable Signal: StratEdge’s High-Performance Power Amplifier Packages
Visit the experts at Space Tech Expo Booth 2019 Santee, Calif. — 18 May 2022 — StratEdge Corporation, leader in the...
SkyWater Enters License Agreement with Xperi for Hybrid Bonding Technology
Hybrid bonding capability strongly complements SkyWater’s developing portfolio of heterogeneous integration solutions including silicon interposer and fan-out packaging KISSIMMEE, Fla....
TechSearch International’s Analysis Examines Impact of World Events and Material Shortages on BGA and CSP Market Growth
TechSearch International’s Analysis Examines Impact of World Events and Material Shortages on BGA and CSP Market Growth 2021 was a...
UPVfab Adds Micro-Transfer Printing Technology for Hybrid Photonic Integration
Massively parallel pick-and-place of large arrays of III-V semiconductors bring new heterogeneous integration capabilities for silicon photonics Valencia, Spain, and...
Henkel Opens New Technical Application Center in Silicon Valley to Foster Next-Generation Electronics Development
Irvine, CA – Henkel today announced the opening of its Application Center in Santa Clara, CA designed to support product...
Xperi and LAPIS, a ROHM Group Company, Enter into Hybrid Bonding License Agreement
Technology transfer includes DBI® Ultra die-to-wafer hybrid bonding know-how SAN JOSE, Calif. & YOKOHAMA, Japan, May 04, 2022–(BUSINESS WIRE)–Adeia, the newly...
ACM Research Receives Purchase Contract for Ultra ECP ap High-Speed Plating Systems
10 ECP ap tools purchased by top-tier Chinese OSAT to support wafer-level packaging applications FREMONT, Calif., May 06, 2022: ACM...
Smoltek Updates on the Company’s Strategic Objectives
Smoltek Nanotech Holding AB (publ) (”Smoltek”) today announces an update and a clearer definition of the company’s strategic objectives, with...
