YES Receives Multiple Orders of VertaCure PLP Systems for Advanced Packaging
Jan 09, 2025 · By YES · Press Releases, Uncategorized
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ACM Research Adds Metal Lift Off Capability to Ultra C pr Tool to Support Power Semiconductor Manufacturing and Wafer Level Packaging Applications
First system qualified at power semiconductor manufacturer in China FREMONT, Calif., Nov. 11, 2022 (GLOBE NEWSWIRE) — ACM Research, Inc. (ACM) (NASDAQ:...
Chris Mann Joins Mosaic Microsystems as Vice President of Business Development
November 9, 2022 — Mosaic Microsystems, a microelectronics and photonics packaging company providing thin glass substrates and through-glass vias (TGVs)...
ASE, EMD Electronics and KLA Corporation Representatives Appointed to SEMI Foundation Board of Trustees
MILPITAS, Calif. — November 8, 2022 — The SEMI Foundation has appointed Patricia MacLeod, Director of Marketing and Communications at Advanced Semiconductor...
EV Group Advances Leadership in Optical Lithography With Next-Generation EVG150 Resist Processing Platform
ST. FLORIAN, Austria, November 7, 2022—EV Group (EVG), a leading provider of wafer bonding and lithography equipment for the MEMS,...
Siemens Expands Industry-leading Integrated Circuit Verification Portfolio with Acquisition of Avery Design Systems
Acquisition will extend Siemens’ enterprise verification platform, adding Avery‘s Verification Protocol and Compliance Test Suite offerings Customers can optimize quality...
Lam Research’s Emissions Reduction Goals Approved by the Science Based Targets Initiative
Lam Continues Progress Towards Net Zero, Joining the Global Semiconductor Climate Consortium as a Founding Member FREMONT, Calif., Nov. 1,...
Worldwide Silicon Wafer Shipments Set New Record in Q3 2022, SEMI Reports
MILPITAS, Calif. — October 25, 2022 — Worldwide silicon wafer shipments reached a new record of 3,741 million square inches...
Cadence Digital and Custom/Analog Design Flows Achieve Certification for TSMC’s Latest N4P and N3E Processes
SAN JOSE, Calif.— Cadence Design Systems, Inc. (Nasdaq: CDNS) today announced that TSMC has certified the Cadence® digital and custom/analog...
Siemens Launches Innovative Cloud-native Software for Electrical Design
Siemens’ Capital™ Electra™ X is a new cloud-native electrical design software aimed at individual electrical designers or small teams that...
Federal Ministry of Education and Research Promotes Joint Project “B-cell immune“
Garbsen, October 24, 2022 – Since September 2022, inno-train Diagnostik GmbH, Medizinischen Hochschule Hannover (MHH), the Fraunhofer-Institut für Lasertechnik ILT...
Amkor Leverages Its Global Automotive Leadership to Support European Semiconductor Ecosystem
TEMPE, Ariz. — October 24, 2022 — Amkor Technology, Inc. (Nasdaq: AMKR), a leading provider of semiconductor packaging and test...
KLA Launches New Double-Sided Direct Imaging Platform Supporting Continued Innovation for PCBs and IC Substrates
The Orbotech Corus™ DI platform provides a fully automated and extendable solution for highly accurate and efficient patterning processes MILPITAS,...
Multinational Semiconductor Company Orders Veeco Wet Processing System for Advanced Wireless Applications
Customer Qualifies WaferStorm System for Essential Process Steps for RF Production Plainview, N.Y., October 19, 2022—Veeco Instruments Inc. (NASDAQ: VECO)...
Deca Technologies’ Founder and CEO Tim Olson Receives Founder’s Award at 55th IMAPS Symposium
Founder’s Award honors individuals who have made the most significant contributions to the microelectronics packaging industry Tempe, Ariz. – October...
Lam Research Pledges $10 Million to FIRST Global to Inspire Future Innovators in Semiconductor Technology and Beyond
FREMONT, Calif., Oct. 17, 2022 /PRNewswire/ — As part of the company’s commitment to enabling transformative learning around the world,...
Leading Research University Selects Veeco’s New Integrated Molecular Beam Epitaxy and Atomic Layer Deposition System for HyBrid Gallium Nitride Deposition Research
Justus Liebig University Giessen to Use the Dual Platform for Next Generation microLED and Photocatalysis Applications Plainview, N.Y., October 12,...
Smoltek Patent No. 77 Now Granted
Smoltek is awarded a new patent in Japan. This patent is the sixth one of the patent family in the direction...
U.S. Department of Commerce Appoints Brewer Science Executive to Chips Act Advisory Committee
Brewer Science commends Ken Joyce for appointment to the DOC Industrial Advisory Committee, advising CHIPS for America R&D efforts. ROLLA,...
Plan Optik Develops New Advanced Connectivity Technology (ACT) for 3D-Integration, 5G and Other Connectivity/High Frequency Applications
Plan Optik is the leading manufacturer of customized glass wafers. In sectors such as consumer electronics, automotive, aerospace, chemistry and...
