Siemens’ Solido SPICE Certified for Multiple Leading-edge Samsung Foundry Processes
Nov 27, 2024 · By Siemens Digital Industries Software · Press Releases
Latest Posts - Page 20
Smoltek Patent No. 77 Now Granted
Smoltek is awarded a new patent in Japan. This patent is the sixth one of the patent family in the direction...
U.S. Department of Commerce Appoints Brewer Science Executive to Chips Act Advisory Committee
Brewer Science commends Ken Joyce for appointment to the DOC Industrial Advisory Committee, advising CHIPS for America R&D efforts. ROLLA,...
Plan Optik Develops New Advanced Connectivity Technology (ACT) for 3D-Integration, 5G and Other Connectivity/High Frequency Applications
Plan Optik is the leading manufacturer of customized glass wafers. In sectors such as consumer electronics, automotive, aerospace, chemistry and...
CyberOptics to Feature Yield-Improving Auto Teaching Systems™ during SEMICON Europa
Minneapolis, Minnesota — October 7, 2022 — CyberOptics® Corporation (NASDAQ: CYBE), a leading global developer and manufacturer of high-precision 3D...
Siemens’ Aprisa Digital Implementation Solution Certified for Samsung Foundry’s Advanced 4nm Processes
Siemens Digital Industries Software today announced that Samsung Foundry has certified Siemens‘ Aprisa™ solution for the foundry’s advanced 4nm FinFET...
Cadence and Samsung Foundry Collaborate to Certify RFIC Design Reference Flow on 8nm Process Technology
Highlights: 8nm RFIC flow supports all stages of the RFIC design process, including modeling, electromagnetic-aware RF simulation and full signoff...
QP Technologies Boosts Process Capabilities, Expands Team to Target New and Growing Markets
Improvements Designed to Meet Escalating Demand for Packaging and Assembly Expertise BOSTON, Oct. 03, 2022 (GLOBE NEWSWIRE) — QP Technologies™...
KLA Announces Plans to Build a New R&D and Manufacturing Facility in Newport, Wales
MILPITAS, Calif., Sept. 29, 2022 /PRNewswire/ — KLA Corporation (NASDAQ: KLAC) has announced plans to build a new research-and-development (R&D)...
ASE Unveils Plans for the World’s First 5G mmWave NR-DC SA Smart Factory
A Strategic Collaboration with the Best-in-Class to craft the future of Smart Manufacturing for Semiconductor Assembly and Testing Taipei, Taiwan....
StratEdge Packaging and Assembly Services Expands for High-Frequency and High-Power Devices
Technical experts available at BCICTS 2022 and IMAPS 2022 to discuss packaging applications Santee, Calif. — 28 September 2022 — StratEdge Corporation, leader...
SEMICON Europa 2022 to Highlight Smart Mobility, Smart MedTech, Advanced Packaging, Fab Management, Materials, Sustainability and Talent
MUNICH, Germany ─ September 27, 2022 ─ Innovations in advanced technologies such as Smart Mobility, Smart MedTech, advanced packaging, fab management, materials,...
Mercury Introduces Flagship Model 5560 FPGA Co-processing Board Powered by AMD Xilinx Versal® Technology
ANDOVER, Mass., Sept. 27, 2022 — Mercury Systems, Inc. (NASDAQ: MRCY, www.mrcy.com), a leader in trusted, secure mission-critical technologies for...
ACM Research Launches New Furnace Tool for Thermal Atomic Layer Deposition to Support Advanced Semiconductor Manufacturing Requirements
Ultra Fn A Furnace Tool Shipped to China-Based Foundry Customer FREMONT, Calif., Sept. 27, 2022 (GLOBE NEWSWIRE) — ACM Research,...
Siemens Automates 2.5D and 3D IC Design-for-test with New Tessent Multi Die Solution
Siemens’ Tessent Multi-die software helps customers dramatically speed and simplify critical design-for-test (DFT) tasks for next-generation integrated circuits (ICs) based...
Henkel Unveils Semiconductor Capillary Underfill for Advanced Silicon Node Flip Chip Applications
Highly-filled, fast-flow material balances reliability and processability, extends company’s package-level underfill leadership with multi-format solutions SEOUL, South Korea, Sept. 14,...
MRSI Launches New Die Bonders with Improved Accuracy
MRSI Systems (Mycronic Group), a leading manufacturer of fully automated, high-precision, high-speed, flexible die bonding and epoxy dispensing systems is...
Brewer Science Presents Advanced Packaging Innovations at SEMICON Taiwan 2022
Heterogenous integration in microelectronics requires advanced materials Tapei, Taiwan – September 12, 2022 – Brewer Science, Inc., a global leader...
EV Group Revolutionizes 3D Integration from Advanced Packaging to Transistor Scaling with NanoCleave Layer Release Technology
IR laser cleave technology enables nanometer-precision layer transfer through silicon, eliminating glass substrates for advanced packaging and enabling thin-layer 3D...
StratEdge Offers Assembly Services for Die Attachment on CMC Tabs
Experts available at BCICTS 2022 and IMAPS 2022 to analyze your high-frequency packaging needs Santee, Calif. — 9 September 2022 — StratEdge...
