Press Releases

Indium Corporation Announces Executive Leadership Appointments

Evans appointed executive chair of board of directors, Berntson named CEO Indium Corporation®, a leading materials refiner, smelter, manufacturer, and...

SEMI Publishes Recommendations for Semiconductor Policies in the 2024-2029 European Commission Legislative Term

SEMI, the industry association serving the global electronics design and manufacturing supply chain, today published recommendations for the European Union...

Brewer Science Presenting Innovations in Hybrid and Laser Debonding at EPTC in Singapore

3D Packaging and Thin Wafer Processing Research Co-Presented by Brewer Science Brewer Science, Inc., an industry leader in advanced packaging...

Siemens’ Solido SPICE Certified for Multiple Leading-edge Samsung Foundry Processes

Siemens Digital Industries Software announced today that its continued collaboration with longtime customer Samsung Foundry has established a host of...

Indium Corporation Honored by Electronics Era with Excellence in Electronics Assembly Materials Award

Indium Corporation is proud to announce its recent achievement of the Excellence in Electronics Assembly Materials Award from Electronics Era,...

Indium Corporation Technical Expert to Present at SiP Conference China

Indium Corporation Senior Area Technical Manager for East China, Leo Hu, is scheduled to deliver a presentation on low-temperature solder material in...

StratEdge Wins Prestigious IMAPS 2024 Corporate Recognition Award

StratEdge Corporation, leader in the design, production, and assembly of high-frequency and high-power semiconductor packages, is proud to announce that...

Cadence Unveils Arm-Based System Chiplet

Cadence has announced a groundbreaking achievement with the development and successful tapeout of its first Arm-based system chiplet. This innovation...

SEMI 20 under 30: Luca Sinkó, SEMILAB R&D Team Leader, Recognized as a 2024 Honoree

We are proud to announce that Luca Sinkó, R&D Team Leader of Semilab SRP Application Team, has been recognized as...

Indium Corporation Receives Global Technology Award at SMTA International

Indium Corporation was honored with a Global Technology Award during an award ceremony on October 22, 2024, at SMTA International...

ACM Research Announces Major Performance Breakthrough for Ultra C Tahoe Cleaning Tool

Latest Generation Front-end Cleaning Tool Reduces Chemical Use by 75% ACM Research, Inc., a leading supplier of wafer processing solutions...

Indium Corporation Receives Business/Industry Partnership Award by NYCCT

Indium Corporation is honored to announce that it has been awarded the Edward J. Pawenski Business/Industry Partnership Award by the...

2025 IEEE Electronic Components and Technology Conference Announces Student Competition

Student Competition Proposals Must be Submitted by November 30, 2024 The IEEE Electronic Components and Technology Conference (ECTC), the premier...

Siemens’ Tessent In-System Test Software Enables Advanced, Deterministic Testing Throughout the Silicon Lifecycle

Siemens Digital Industries Software today introduced Tessent™ In-System Test software, a groundbreaking design-for-test (DFT) solution that enhances in-system test capabilities...

Indium Corporation Announces InnoJoin as Exclusive Global Sales Partner for NanoFoil®

Indium Corporation today announced that InnoJoin GmbH will be the exclusive global sales partner for NanoFoil® in component mounting applications. NanoFoil® is a leading nanotechnology material...

First Annual SEMIEXPO Heartland Event to Assemble Leaders in Smart Manufacturing and Smart Mobility

With automotive electronics and Industry 4.0 serving as key semiconductor industry growth drivers, SEMI Americas’ inaugural SEMIEXPO Heartland event will gather key...

Nordson Test & Inspection’s New SpinSAM™ AMI System Wins Prestigious Global Technology Award

Nordson Test & Inspection today announced that its SpinSAM Acoustic Microimaging (AMI) system has been honored with the prestigious 2024...