Press Releases

Nordson Electronics Solutions Introduces the ASYMTEK Select Coat® SL-1040 Ultrasonic Cleaning Station

See this unique nozzle cleaning system and speak with our experts at IPC APEX booth 3200 Nordson Electronics Solutions, a...

Trymax Joins Accuron Technologies Group for Further Growth and Expansion

Accuron Technologies (Accuron), a global precision engineering and technology group, secured a controlling interest in Trymax Semiconductor Equipment (Trymax), a...

Brewer Science Welcomes New Chief Business Officer, Poupak Khobadandeh

Ms. Khobadandeh brings decades of industry experience to Brewer Science Brewer Science, Inc., a global leader in developing and manufacturing...

LQDX and Arizona State University Sign Semiconductor Packaging Collaboration Agreement

LQDX Inc., developer of high-performance materials and process IP for advanced semiconductor packaging,  announced that it has signed a formal...

ERS electronic Unveils Production, R&D Facility, and Competence Center for Advanced Packaging in Germany

ERS electronic, the industry leader of thermal management solutions for semiconductor manufacturing, celebrated the official opening of ERS Barbing, its...

MRSI-A-L Active Aligner Wins Infostone 2024 Award

On December 6, 2024, Infostone successfully held its 2024 Annual Summary and the 11th Heroes List Award live conference. MRSI...

Jabil Recognizes Nordson Electronics Solutions With 2024 Best Strategic Supplier Award

For superior performance in quality, delivery, innovation, and partnership related to fluid dispensing systems used in electronics manufacturing Nordson Electronics...

Circuits Integrated Hellas Selected as Laureate for Paris Space Week 2025 Innovation Challenge

CIH to Pitch Disruptive Technology to Global Leaders in the Space Industry Circuits Integrated Hellas (CIH), a pioneering innovator in...

Indium Corporation Expert to Address Thermal Challenges at TestConX 2025

Indium Corporation technical support engineer Carson Burt will deliver a technical presentation at TestConX 2025, taking place March 3-5 in...

Koh Young Partners with NTV USA to Expand its Advanced Packaging and Semiconductor Inspection Solutions in the United States

Koh Young, the global leader in True 3D measurement-based inspection and metrology solutions, announced its partnership with NTV USA (NexTex...

MRSI Mycronic Announces Advanced High-Speed 1µm Die Bonder MRSI-LEAP for Ultra-High-Volume Manufacturing of AI Optical Module Applications

MRSI Mycronic is proud to announce the launch of the MRSI-LEAP high-speed 1µm die bonder. This innovative equipment is designed...

StratEdge Corporation Partners with Vitale Engineering as Manufacturer’s Representative for Upstate New York

Advancing semiconductor packaging solutions with expertise in engineering and innovation. StratEdge Corporation, leader in the design, production, and assembly of...

Micross Acquires Integra Technologies, Creating the Leading U.S. Domiciled OSAT Provider

Micross Components, Inc., a leading provider of high-reliability microelectronic product and service solutions for aerospace, defense, space, medical and industrial...

Indium Corporation Experts to Present at Pan Pac 2025

Indium Corporation Senior Technologist Dr. Ronald Lasky and Senior Product Development Specialist Kevin Brennan will deliver a series of presentations at the Pan Pacific Strategic Electronics...

Onto Innovation Advances Process Control Suite for 3D Interconnect Yields

Announces orders for 3Di ™ technology on Dragonfly ® G3 system and release of EchoScan ™ void detection system Onto...

Lam Research Establishes 28nm Pitch in High-Resolution Patterning Through Dry Photoresist Technology

Lam Research Corporation announced that its innovative dry photoresist (dry resist) technology has been qualified for direct-print 28nm pitch back...

Indium Corporation to Showcase Power Electronics Products at NEPCON Japan

As one of the leading materials providers in the electronics assembly industry, Indium Corporation® is proud to feature its lineup of high-reliability...

Eighteen New Semiconductor Fabs to Start Construction in 2025, SEMI Reports

The semiconductor industry is expected to start 18 new fab construction projects in 2025*, according to SEMI’s latest quarterly World Fab...

IMAPS Device Packaging Conference and Advanced Packaging for Medical Microelectronics Workshop to Co-locate

Both events to take place March 3-7, 2025 in Phoenix, Arizona Device Packaging Conference – The event with the most...