Press Releases

2025 IEEE Electronic Components and Technology Conference Announces Student Competition

Student Competition Proposals Must be Submitted by November 30, 2024 The IEEE Electronic Components and Technology Conference (ECTC), the premier...

Siemens’ Tessent In-System Test Software Enables Advanced, Deterministic Testing Throughout the Silicon Lifecycle

Siemens Digital Industries Software today introduced Tessent™ In-System Test software, a groundbreaking design-for-test (DFT) solution that enhances in-system test capabilities...

Indium Corporation Announces InnoJoin as Exclusive Global Sales Partner for NanoFoil®

Indium Corporation today announced that InnoJoin GmbH will be the exclusive global sales partner for NanoFoil® in component mounting applications. NanoFoil® is a leading nanotechnology material...

First Annual SEMIEXPO Heartland Event to Assemble Leaders in Smart Manufacturing and Smart Mobility

With automotive electronics and Industry 4.0 serving as key semiconductor industry growth drivers, SEMI Americas’ inaugural SEMIEXPO Heartland event will gather key...

Nordson Test & Inspection’s New SpinSAM™ AMI System Wins Prestigious Global Technology Award

Nordson Test & Inspection today announced that its SpinSAM Acoustic Microimaging (AMI) system has been honored with the prestigious 2024...

Coastal RF Systems Joins StratEdge’s Network as Manufacturer’s Representative for Southern California

Collaborative Effort Aims to Support Growing Demand in Defense and Aerospace Industries  StratEdge is excited to announce it has appointed Coastal...

Leading University Selects Veeco’s Molecular Beam Epitaxy System for Next-Generation Infrared Detector Device Research

Ohio State University’s MBE Research Team Developing IR Devices to Serve a Range of Consumer, Automotive, Defense, and Industrial Applications....

Nordson Electronics Solutions Wins Global Technology Award for the ASYMTEK Select Coat SL-1040 Conformal Coating System

The SL-1040 pairs new process control and new maintenance features, ideal for conformal coating in high-volume electronics manufacturing. Nordson Electronics...

ZEISS Launches New Crossbeam 550 Samplefab FIB-SEM

New TEM preparation platform with industry-leading automation yield Hands-free lamella preparation from bulk to thinned – create 10 lamellae in...

Henkel and Teca-Print Partner to Drive Novel Pad Printing Solutions in Printed Electronics

Henkel and Teca-Print today have announced a partnership in the pad printing field of printed electronics. The collaboration aims to...

2024 IEEE International Electron Devices Meeting Spotlights Advances in Critical Semiconductor Technologies

Shaping Tomorrow’s Semiconductor Technology Since it began in 1955, the IEEE International Electron Devices Meeting (IEDM) has been where the...

SEMI Energy Collaborative Releases Recommendations for Expanding Low Carbon Energy in Taiwan

SEMI, the global industry association representing the semiconductor and electronics design and manufacturing supply chain, today released a report by...

Indium Corporation Experts to Present at International Electronics Manufacturing Technology Conference

Indium Corporation is proud to announce its participation in the upcoming International Electronics Manufacturing Technology Conference (IEMT), taking place October 16-18 in Penang,...

SEMICON Europa 2024 to Explore Innovations in Advanced Packaging and Fab Management for a Sustainable Future

Semiconductor industry experts will convene at SEMICON Europa 2024, November 12-15 at Messe München in Munich, to explore the latest trends...

Senior Leaders at Brewer Sciences to Serve as Co-CEOs

Corporate leadership developments to drive projected growth and innovation Brewer Science, Inc., a global leader in developing and manufacturing innovative...