Siemens’ Solido SPICE Certified for Multiple Leading-edge Samsung Foundry Processes
Nov 27, 2024 · By Siemens Digital Industries Software · Press Releases
Latest Posts - Page 18
SurplusGLOBAL and EQ GLOBAL to Present a Global Parts Platform at SEMICON KOREA 2023
SurplusGLOBAL, a global semiconductor used equipment platform company, will participate in the SEMICON KOREA 2023 exhibition held at COEX for...
Leading Korean OSAT Purchases YES VertaCure™ XP for Higher Yield and Performance
LB Semicon to Use Next-Generation Vacuum Curing Technology in WLCSP Bump/RDL Application FREMONT, Calif., Jan. 23, 2023 — Yield Engineering Systems, Inc....
GEL-PAK Brings 40 Years of Device Handling Expertise to Photonics West; Will Showcase Latest Innovations for Protecting Valuable Photonics Components
Company Leverages Extensive Collaborations with Photonics Industry Leaders to Address Evolving Market Requirements for Device Handling and Protection HAYWARD, Calif.,...
FormFactor San Jose Demo Center Grand Opening
FormFactor invites you to the grand opening of our state-of-the-art demo center located in San Jose, CA. The demo center...
Micross to Acquire High-Reliability DC-DC Converter Business of Infineon Technologies AG
Acquisition Expands Micross’ High-Reliability Power Management Solution Capabilities Melville, NY – January 10, 2023 – Micross Components, Inc. (“Micross” or...
Chipletz Selects Siemens’ EDA Solutions for its Smart Substrate IC Packaging Technology
Siemens Digital Industries Software today announced that Chipletz, an innovative fabless substrate startup, has selected Siemens as its strategic electronic...
SurplusGLOBAL Hosts Semiconductor Equipment Cluster Completion Ceremony
Plans to invest about KRW 600 billion in assets with the cluster’s tenants by early next year Plans to expand...
IMAPS Device Packaging Conference Returns to Arizona in March 2023
The Most Comprehensive Program for Microelectronics and Advanced Packaging This Spring The 19th Annual Device Packaging Conference (DPC 2023) will be held March 13-16,...
AT&S At Two Advanced Packaging Conferences
At the invitation of TSMC (Taiwan Semiconductor Manufacturing Company), Rozalia Beica (VP Strategic Marketing & Business Development in Microelectronics Business Unit) participated in the IMPACT conference in Taipei...
Plasma-Therm Receives Follow-on Order for HeatPulse RTP System for SiC Power Devices
Innovative platform redesign enables device makers to make critical system upgrades for currently installed legacy systems without interrupting processes of...
YC Wong Joins YES as VP of Business Development, Asia Pacific
FREMONT, Calif., Dec. 12, 2022 — Yield Engineering Systems, Inc. (YES), a leading manufacturer of process equipment for semiconductor advanced...
Lam Research Continues ESG Momentum with Inclusion on the 2022 Dow Jones Sustainability Index for North America
Lam also extends focus on global impact by joining the United Nations Global Compact FREMONT, Calif., Dec. 12, 2022 – Lam...
Global Chip Industry Projected to Invest More Than $500 Billion in New Factories by 2024, SEMI Reports
MILPITAS, Calif. — December 12, 2022 — The worldwide semiconductor industry is projected to invest more than $500 billion in 84 volume chipmaking...
ACM Research Expands into Chemical Vapor Deposition Market to Support Logic & Memory Manufacturing
FREMONT, Calif., Dec. 12, 2022 (GLOBE NEWSWIRE) — ACM Research, Inc. (ACM) (NASDAQ: ACMR), a leading supplier of wafer processing solutions for...
Pre-Registration Opens for Chiplet Summit
SAN DIEGO, CA – December 9, 2022 — Chiplets Shorten Chip Design Cycles. Chiplet Summit opens pre-registration today for its...
SEMI Commends European Council’s Progress on Chips Act, Urges Swift Start of Trialogue Negotiations
BRUSSELS, Belgium — December 1, 2022 — SEMI, the industry association serving the global electronics design and manufacturing supply chain, today applauded the progress...
New Advanced Packaging Facility Coming To Indiana
Nov 21, 2022, saw the groundbreaking for WestGate One, a semiconductor campus that will house the first fab in the...
ACM Research Enters Coater/Developer Track Market to Support Lithography for Semiconductor IC Manufacturing
New Ultra Track Leverages ACM’s Extensive Coater and Developer Expertise; ArF Model Expected to Ship in the Fourth Quarter of...
