Siemens’ Solido SPICE Certified for Multiple Leading-edge Samsung Foundry Processes
Nov 27, 2024 · By Siemens Digital Industries Software · Press Releases
Latest Posts - Page 17
Henkel Non-conductive Die Attach Film Offers Broad Wirebond Package Flexibility for High-reliability Applications
Irvine, CA – Henkel today announced the commercialization of a high-performance non-conductive die attach film (ncDAF) engineered to address the...
Veeco Releases New Sustainability Report
Report Highlights Ongoing Commitment to Environmental, Social and Governance Goals PLAINVIEW, N.Y., March 21, 2023 – Veeco Instruments Inc. (NASDAQ:...
QP Technologies New TQFP and MQFP Offerings Increase Packaging Options for Mil-Aero, Automotive and Other Key Markets
ESCONDIDO, Calif. – March 16, 2023 – QP Technologies™, a leading provider of innovative microelectronic packaging and assembly solutions, today announced it has extended its...
MKS Instruments Introduces Industry Leading Integrated Approach to Creating Solutions for Complex Package Substrate Manufacturing Requirements and Roadmaps
Unveils significant investment in its Yokohama TechCenter (YTC) during the grand expansion ceremony Yokohama, Japan, March 14, 2023: MKS...
Lam Research Named as One of Ethisphere’s 2023 World’s Most Ethical Companies
Prestigious recognition honors company’s commitment to business integrity FREMONT, Calif., March 13, 2023 — Lam Research Corp. (NASDAQ: LRCX) today announced...
IMAPS Advanced System-in-Package Conference is now CHIPcon
The top global event for advanced Chiplet and Heterogeneous Integration Packaging (CHIP) technologies to be held in July 2023 IMAPS...
StratEdge to Display Molded Ceramic Semiconductor Packages at the IMAPS Device Packaging, APEC, and GOMACTech Conferences
Santee, Calif. — StratEdge Corporation,leader in the design, production, and assembly of high-frequency and high-power semiconductor packages for RF, microwave, and...
Xpeedic Takes 2023 3D InCites Herb Reiter Design Tool Provider of the Year Award
CUPERTINO, CALIF. –– March 10, 2023 –– Xpeedic today was named the 2023 Herb Reiter Design Tool Provider of the...
SurplusGLOBAL Announces Executive Promotion, Recruitment, and Establishment of Equipment Technology Team
SurplusGLOBAL, the leading global platform company for pre-owned semiconductor equipment (www.SurplusGLOBAL.com) announced on the 27th a major organizational restructuring to...TechSearch International Examines Chiplet Strategies and Markets, North American OSAT Capability, and Provides an Update on the Build-up Substrate Supply and Demand
TechSearch International’s latest analysis examines strategies for the adoption of chiplets and current products. While the market is small today...
State-of-the-art Finetech FINEPLACER® Sigma Advanced Sub-micron Bonder Installed at Promex Santa Clara Facility
Finetech FINEPLACER® sigma bonder targets range of application-specific projects SANTA CLARA, Calif., Feb. 02, 2023 (GLOBE NEWSWIRE) — Promex Industries,...
Amkor Technology and GlobalFoundries to Provide At-scale Semiconductor Test and Assembly Services in Europe
Partnership expands European and transatlantic semiconductor supply chain TEMPE, Ariz. and DRESDEN, Germany, February 16, 2023 — Amkor Technology, Inc. (Nasdaq:...
Adeia and Qorvo Enter into Hybrid Bonding License Agreement
SAN JOSE, Calif., Feb. 15, 2023 (GLOBE NEWSWIRE) — Adeia Inc. (Nasdaq: ADEA) (“Adeia” or the “Company”), the company whose...
MRSI-H-HPLD 1.5 micron Die Bonder Wins Award for “Infostone 2022 Outstanding Technology”
On December 29, 2022, Infostone 2022 Annual meeting and the 9th Heroes List award live conference was successfully held. During...
Veeco Acquires Epiluvac AB to Accelerate Penetration Into High Growth Silicon Carbide Epitaxy Equipment Market
PLAINVIEW, N.Y., Feb. 01, 2023 — Veeco Instruments Inc. (NASDAQ: VECO) today announced that on January 31, 2023, it acquired...
StratEdge Improves Performance of Leaded Power Amplifier Packages, Now Supporting DC to 28GHz Devices
Santee, Calif. — StratEdge Corporation, leader in the design, production, and assembly of high-frequency and high-power semiconductor packages for RF,...
Global Leader in microLED Manufacturing Orders Repeat Solstice® S8 Single-Wafer Electroplating System from ClassOne Technology
Order for multi-chamber Solstice® GoldPro™ electroplating system selected for superior process and performance in high-volume manufacturing of microLED devices KALISPELL,...
Smoltek and YAGEO Present Technology for Ultra-thin Capacitors
Smoltek Nanotech Holding AB (“Smoltek”) announces that the group company Smoltek Semi and its partner YAGEO will present their joint...
FormFactor Opens Silicon Valley Demo Center
LIVERMORE, CA– (Globe Newswire – January 26, 2023) – FormFactor, Inc. (NASDAQ: FORM), a leading semiconductor test and measurement supplier,...
