Eighteen New Semiconductor Fabs to Start Construction in 2025, SEMI Reports
Jan 07, 2025 · By SEMI · Press Releases
Latest Posts - Page 17
Micross Acquires Technograph Microcircuits Ltd., Expands Portfolio of Packaging and Substrate Capabilities for Multi-Chip-Modules, ASICs and PCBs
Melville, NY (May 2, 2023) – Micross Components (“Micross”), a leading provider of high-reliability microelectronic product and service solutions for...
Henkel Debuts Ultra-high Thermal Conductivity Pressure-less Sintering Die Attach Adhesive that Meets Automotive Grade Reliability Standards
Irvine, CA – Henkel today announced the addition of Loctite Ablestik ABP 8068TI to its growing portfolio of high thermal...
Brewer Science and PulseForge Bring Photonic Debonding to Semiconductor Advanced Packaging at Scale
Co-presenting “Photonic Debonding for Wafer–Level Packaging” at CS MANTECH, held May 15-18 in Orlando, FL. Orlando, Florida – April 25,...
Promex Bolsters Leadership Team with David Fromm as Vice President of Engineering
SANTA CLARA, Calif., Feb. 7, 2022 – Promex Industries, a Silicon Valley-based provider of advanced design, packaging and microelectronics assembly services, today...
Breaking the Limits: StratEdge Pushes High-Temperature Packaging Technology to the Extreme at Upcoming Events
Santee, Calif. – 14 April 2023 – StratEdge Corporation, leader in the design, production, and assembly of high-frequency and high-power semiconductor packages...
IMAPS Advanced SiP Conference is now CHIPcon
The top global event for Chiplet and Heterogeneous Integration Packaging (CHIP), covering advanced technology developments and solutions, device integration strategies,...
Henkel Delivers Versatile, High Thermal Die Attach Adhesive for Power IC Applications
Irvine, CA – As integrated circuits (ICs) become more dense and complex, particularly in the power device sector, new approaches...
New SEMI Europe-Led Consortium Wins Funding to Help Overcome Europe’s Microelectronics Industry Skills and Talent Shortage
BRUSSELS, Belgium — April 11, 2023 — SEMI, the industry association serving the global electronics design and manufacturing supply chain, today...
Plan Optik and 4JET Jointly Develop New Process for Advanced Packaging
• Process innovation for through-glass vias in the field of advanced packaging • Premiere at Touch Taiwan on April 19-21...
3D InCites Awards Program Recognizes Henkel Leadership in Die Attach and Underfill Materials Development
Henkel semiconductor packaging innovations earn Material Supplier of the Year Award Irvine, CA – Henkel today announced that it has...
Henkel Unveils Semiconductor Capillary Underfill for Advanced Silicon Node Flip Chip Applications
Irvine, CA – Henkel today announced the commercialization of its latest semiconductor-grade capillary underfill (CUF) formulation for advanced packaging applications....
MRSI Systems Launches Free Software Training Video Program
MRSI has produced immersive software training videos to optimize your company’s experience with our cutting-edge die bonding and epoxy dispensing...
The Drive to Silicon Carbide: Amkor Expands Power Solutions for Automotive Electrification
TEMPE, Ariz. — March 28, 2023 — Amkor Technology, Inc. (Nasdaq: AMKR), a leading outsourced semiconductor assembly and test (OSAT)...
Adeia Signs Long-Term Semiconductor Patent License Agreement with Kioxia
Agreement includes a license to Adeia’s Hybrid Bonding Portfolio SAN JOSE, Calif., March 28, 2023 — Adeia Inc. (Nasdaq: ADEA)... Adeia Signs Long-Term Semiconductor Patent License Agreement with Western Digital
Agreement includes a license to Adeia’s Hybrid Bonding Portfolio SAN JOSE, Calif., March 28, 2023 — Adeia Inc. (Nasdaq: ADEA)...
Henkel Non-conductive Die Attach Film Offers Broad Wirebond Package Flexibility for High-reliability Applications
Irvine, CA – Henkel today announced the commercialization of a high-performance non-conductive die attach film (ncDAF) engineered to address the...
Veeco Releases New Sustainability Report
Report Highlights Ongoing Commitment to Environmental, Social and Governance Goals PLAINVIEW, N.Y., March 21, 2023 – Veeco Instruments Inc. (NASDAQ:...
QP Technologies New TQFP and MQFP Offerings Increase Packaging Options for Mil-Aero, Automotive and Other Key Markets
ESCONDIDO, Calif. – March 16, 2023 – QP Technologies™, a leading provider of innovative microelectronic packaging and assembly solutions, today announced it has extended its...
MKS Instruments Introduces Industry Leading Integrated Approach to Creating Solutions for Complex Package Substrate Manufacturing Requirements and Roadmaps
Unveils significant investment in its Yokohama TechCenter (YTC) during the grand expansion ceremony Yokohama, Japan, March 14, 2023: MKS...
