Eighteen New Semiconductor Fabs to Start Construction in 2025, SEMI Reports
Jan 07, 2025 · By SEMI · Press Releases
Latest Posts - Page 16
Xpeedic Releases RF EDA Solution 2023 at IMS
RF EDA Solution Accelerates Design of RF Modules, Systems Using Chip-Package-System EDA tools and IPD IP Demonstrated Today Through Thursday...
Global 300mm Fab Equipment Spending Forecast to Reach Record $119 Billion in 2026, SEMI Reports
MILPITAS, Calif. — June 13, 2023 — Global 300mm fab equipment spending for front-end facilities next year is expected to begin a growth...
Amkor Advanced Packaging Enables the Car of the Future
TEMPE, Ariz.–Jun. 13, 2023– Amkor Technology, Inc. (Nasdaq: AMKR), a leading provider of semiconductor packaging and test services and the...
Xpeedic Ships Unprecedented Two-Billionth Integrated Passive Device
Adoption Driven by Need for Smaller, High-Performance, Cost-Effective, Reliable Electronic Systems Xpeedic IPDs, Development Platform Showcased Today Through Thursday at...
DSV Launches Internal Carbon Fee to Fund New Sustainability Initiatives
Global transport and logistics company DSV has launched a global funding programme to invest in sustainability initiatives across the organisation....
StratEdge Semiconductor Packages at IMS: Powering the Future of Technology
Santee, Calif. – 7 June 2023 – StratEdge Corporation, a leader in the design and production of high-performance semiconductor packages for microwave,...
Siemens Collaborates with SPIL to Deliver a 3D Verification Workflow for Fan-out Wafer-level Packaging
Siemens has collaborated with leading Outsourced Assembly and Test (OSAT) company Siliconware Precision Industries Co., Ltd. (SPIL) – (Image courtesy...
FormFactor Introduces High Throughput Panel Metrology and Inspection System for Advanced Packaging
FRT MicroProf® PT Automates Measurement to Reduce Processing Costs on Panels up to 600mm x 600mm LIVERMORE, CA – (Globe...
ASE VIPack™ FOCoS-Bridge Integrates Multiple ASICs and Silicon Bridges to Accelerate AI Innovation
SUNNYVALE, Calif., May 31, 2023 – Advanced Semiconductor Engineering, Inc. (ASE), a member of ASE Technology Holding Co., Ltd. (NYSE:...
Nordson Test & Inspection Unveils Next-Generation X-Ray Inspection System at Semicon China 2023
Aylesbury, United Kingdom — May 2023 — Nordson TEST & INSPECTION today announced that it will unveil the new Quadra...
Smoltek Inaugurates In-house Hydrogen Laboratory
Smoltek Nanotech Holding AB (“Smoltek”) announces that the group company Smoltek Hydrogen has inaugurated the new inhouse hydrogen laboratory. In...
EV Group and Dymek Company Form Joint Venture Company in Malaysia to Enhance Regional Customer Support
EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, and...
PulseForge and ERS electronic Collaborate to Bring Fully-Automated Photonic Debonding Tool to the Semiconductor Industry
Austin, Texas – May 2023 – PulseForge, Inc. and ERS electronic GmbH have announced a strategic alliance to bring a...
Global Semiconductor Packaging Materials Market to Near $30 Billion by 2027
SEMI, TECHCET and TechSearch International Highlight Diverse Growth Drivers in New Report MILPITAS, Calif. – May 23, 2023 – Powered by...TechSearch International Releases Market Forecast for BGAs and CSPs
Market Forecast Reveals the Downside of the Covid Spending Spree in Electronics, Provides an Update on Build-up Substrate Supply and...
EV Group Solutions for Heterogeneous Integration to be Highlighted at ECTC 2023
Papers to highlight breakthrough capabilities of EVG’s hybrid bonding, LITHOSCALE® maskless lithography and NanoCleave™ layer release technology for advanced packaging...
FormFactor Named One of THE BEST Suppliers in the Semiconductor Industry for Tenth Consecutive Year
Annual Customer Satisfaction Survey Gives FormFactor a Five Star Rating LIVERMORE, Calif., May 17, 2023 (GLOBE NEWSWIRE) — FormFactor, Inc. (NASDAQ: FORM), a leading...
IMAPS & IPC to Host On-Shoring Workshop July 10-12, 2023 in Washington, DC
The International Microelectronics Assembly and Packaging Society (IMAPS) and IPC will host a Workshop to discuss and promote strategies to...
ASE Recognized for Excellence by Texas Instruments
SUNNYVALE, Calif., Apr 28, 2023 – Advanced Semiconductor Engineering, Inc. (ASE), a member of ASE Technology Holding Co., Ltd. (NYSE:...
