Siemens’ Solido SPICE Certified for Multiple Leading-edge Samsung Foundry Processes
Nov 27, 2024 · By Siemens Digital Industries Software · Press Releases
Latest Posts - Page 13
ASMC 2024 Call for Abstract Submissions Opens
MILPITAS, Calif. — September 11, 2023 — The annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC) is now accepting abstract submissions...
Lam Research Recognizes 2023 Supplier Excellence Award Winners
FREMONT, Calif., Sept. 7, 2023 /PRNewswire/ — Lam Research Corp. (Nasdaq: LRCX) today announced the honorees of its 2023 Supplier Excellence Awards, recognizing 12 companies...
Henkel Highlights Portfolio of Enabling Materials for Next-gen Semiconductor Devices at SEMICON Taiwan 2023
Taipei, Taiwan – At this week’s SEMICON Taiwan, Henkel brings its extensive range of semiconductor packaging material solutions to customers...
Saras Micro Devices Completes Move to New Atlanta Facility
Large cleanroom and testing lab will serve as the innovation center of excellence for its power delivery solutions for semiconductor...
MRSI Introduces 705HF High-Force Die Bonder for Power Devices and Advanced Chip Packaging
MRSI Systems (a part of Mycronic Group), a leading manufacturer of fully automated, high-precision, high-speed, flexible die bonding and epoxy...
PulseForge, Inc. Agrees to Strategic Integration Partnership with Teikoku Taping System Co., Ltd.
[Austin, TX- August 30, 2023] – PulseForge, Inc., a leading innovator in equipment and materials for semiconductor debonding, micro-LED transfer,...
PulseForge and Applied Novel Devices Collaborate to Showcase Breakthrough in Photonic Debonding for Advanced Power Electronics Packaging
Austin, August 29, 2023 – PulseForge Inc., a recognized leader in applied thermal energy, and Applied Novel Devices (AND), a...
Brewer Science Unveils Innovative Advanced Packaging Solutions at SEMICON Taiwan and Advanced Packaging Summit 2023
Innovative bonding materials presented at leading Asia technology conferences Tapei, Taiwan – August 28, 2023 – Brewer Science, Inc., will...
EV Group Hybrid Bonding and Nanoimprint Lithography Solutions to be Highlighted at SEMICON Taiwan 2023
Papers to highlight breakthrough capabilities of EVG’s hybrid bonding and metrology solutions for heterogeneous integration, and NIL solutions for meta-optics...
Nordson TEST & INSPECTION Showcases State-of-the-art Inspection and Metrology Solutions at SEMICON Taiwan
Aylesbury, United Kingdom — August 2023 — Nordson TEST & INSPECTION today announced its participation in SEMICON Taiwan, one of...
Call for Papers: IMAPS DPC 2024
The 20th Annual Device Packaging Conference (DPC 2024) will be held at the WeKoPa Resort and Conference Center, from March 18-21, 2024. It is an...
IMAPS 2023 Symposium Planned for October 2-5, 2023 in San Diego, CA
The 56th International Symposium on Microelectronics (IMAPS 2023) will be held October 2-5, 2023, at the Town & Country Resort...
StratEdge Presents Hermetic Molded Ceramic Packages at European Microwave Week in Berlin
Santee, Calif. – 22 August 2023 – StratEdge Corporation, leader in the design and production of high-performance semiconductor packages for RF,...
MRSI Mycronic to Showcase and Present Innovative Die Bonder Solutions at CIOE 2023
MRSI, a part of Mycronic Group, will exhibit our family of die bonders and present at the 24th China International...
Kristie Bowman Joins IMAPS as Manager, Events and Programs
Kristie will manage and produce IMAPS meetings from conception through completion. Her event responsibilities will include organizing a wide range...
Global Semiconductor Industry on Track for 2024 Recovery but Near-Term Headwinds Remain, SEMI Reports
MILPITAS, Calif. – August 15, 2023 – With sequential IC sales declines beginning to moderate, the global semiconductor industry appears to...
Brewer Science Expands Vichy Manufacturing Center to Support Semiconductor Growth
Vichy, Missouri – August 16, 2023 – Brewer Science, a global leader in developing and manufacturing next-generation materials and products for...
MRSI Systems Wins Silver Honoree for Laser Focus World Innovators Award 2023
MRSI Systems, a part of Mycronic Group, a leading manufacturer of fully automated, high-precision, high-speed die bonding, and epoxy dispensing...
Kiterocket Acquires Action Mary to Bolster Leadership and Broaden Capabilities
PHOENIX AND SEATTLE—August 3, 2023—Kiterocket, a PR-forward, full-service communications and marketing agency, today announced it has acquired Action Mary, a...
