Siemens’ Solido SPICE Certified for Multiple Leading-edge Samsung Foundry Processes
Nov 27, 2024 · By Siemens Digital Industries Software · Press Releases
Latest Posts - Page 12
Nordson ELECTRONICS SOLUTIONS Showcases New Products for Electronics Manufacturing at Productronica 2023
On display are exciting, new technologies for conformal coating, precision fluid dispensing, and selective soldering Carlsbad, CA, USA – 24...
ECG with a Patch: APPLAUSE European Collaborative Project Successfully Completed
Researchers from Fraunhofer IZM, together with 31 partners from industry and research, have developed a stretchable and wireless patch that...
Artificial Intelligence Confirms: AT&S Has the Highest Reputation in Austria’s Industry
Leoben, October 5, 2023 – The Styria-based technology group is economically successful in challenging times and has an excellent reputation...
Stanley Electric Selects Siemens’ Questa Advanced Verification Platform for its Newest MEMS IC Design
Siemens Digital Industries Software today announced that Stanley Electric (“Stanley”), a leading automotive electronics company, has adopted Siemens’ Questa™ Advanced...
Amkor’s Newest Factory Opens in Vietnam
Amkor Technology, Inc. (Nasdaq: AMKR), a leading provider of semiconductor packaging and test services, has scheduled the grand opening of its newest...
ASE Launches its Integrated Design Ecosystem™ to Enable Silicon Package Design Efficiencies that Reduce Cycle Time by Half
SUNNYVALE, Calif., Oct 3rd, 2023 – Advanced Semiconductor Engineering, Inc. (ASE), a member of ASE Technology Holding Co., Ltd. (NYSE:...
Dr. Kurt Schroder Receives Inventor of the Year Award by Austin Intellectual Property Law Association
AUSTIN, TEXAS – [October 5, 2023] – Dr. Kurt Schroder, a distinguished plasma physicist with degrees from both Massachusetts Institute...
CEA and Siemens Collaborate on Research to Expand Applications of Digital Twin for Industry
Research collaboration to bring greater use of artificial intelligence and cloud computation in the world’s most comprehensive digital twin across...
Smoltek’s Custom-ordered Carbon Nano-growth Tool is Ready to be Shipped from the Manufacturer
This press release is an English version of the previously published Swedish version, which has interpretive precedence. Smoltek Nanotech Holding...
Finetech Announces FINEPLACER® pico 2 Purchase by AmTECH Microelectronics
Finetech, a leading provider of precision die-bonders, announces the purchase of the FINEPLACER® pico 2 by AmTECH Microelectronics, a Silicon...
Siemens and TSMC Collaborate to Help Mutual Customers Optimize Designs Using Foundry’s Newest Advancements
Siemens Digital Industries Software today announced new certifications and collaborations with longtime partner TSMC, resulting in the successful qualification of...
SEMI North America Advisory Board Welcomes New Members From Axcelis, Edwards Vacuum, Lam Research and Teradyne
MILPITAS, Calif. — September 25, 2023 — SEMI today announced the election of four new members to the SEMI North America Advisory Board (NAAB):...
FIRST Global, Title Sponsor Lam Research to Host the World’s Most International Innovation Challenge to Inspire Kids in STEM, Future Solutions for Climate Change
Nearly 200 countries to compete in robotics at the 2023 FIRST Global Challenge in Singapore Washington, D.C. and Fremont, CA – Sept. 25, 2023 –...
PulseForge, Inc. Prepares for Innovative and Exciting Events in the Electronics and Semiconductor Space
In a world that is increasingly driven by technological innovation, the semiconductor space stands at the forefront of progress. Our...
Cadence Advances Hyperscale SoC Design with Expanded IP Portfolio for TSMC N3E Process Featuring Next-Generation 224G-LR SerDes IP
20 Sep 2023 Highlights: Proven interface IP architectures realized significant gains in performance and power efficiency on the TSMC N3E...
Packaging, Connecting, and Integrating: 30 years of Fraunhofer IZM – 30 years of packaging and interconnection excellence in microelectronics
September 20, 2023 The Fraunhofer Institute for Reliability and Microintegration IZM is marking its thirtieth year with a high-profile international...
Plasma-Therm Announces Acquisition of Thin Film Equipment SrL
ST. PETERSBURG, Fla. Sept. 19, 2023 – Plasma-Therm, a leading manufacturer of plasma-process equipment for the semiconductor and compound semiconductor...
Plasma-Therm Announces Acquisition of Thin Film Equipment SrL
Plasma-Therm expands European footprint and bolsters leadership in the power device market PETERSBURG, Fla. Sept. 19, 2023 – Plasma-Therm, a...
ACM Research Introduces Vacuum Flux Cleaning Platform for Chiplets
Third Generation Flux Cleaning Tool Meets Emerging Cleaning Requirements for Advanced 3D Packages FREMONT, Calif., September 12, 2023 (GLOBE NEWSWIRE)...
