Eighteen New Semiconductor Fabs to Start Construction in 2025, SEMI Reports
Jan 07, 2025 · By SEMI · Press Releases
Latest Posts - Page 11
Saras Micro Devices Celebrates Grand Opening of New Headquarters and Manufacturing Center of Excellence in Chandler, Arizona
Company Seeks to Support and Leverage Growing Semiconductor and Advanced Packaging Ecosystem in the Region Chandler, Ariz. – Jan....
NHanced Semiconductors Opens Leading-Edge Advanced Package Assembly Facility, Reinforcing Indiana’s Position as a Major Semiconductor Hub
U.S. Senator Todd Young (R-IN) and NHanced Semiconductors President Robert Patti, at the ribbon-cutting at the Odon facility, announce new...
Demand for AI-Optimized Chipsets to Spur Requirements for Hybrid Bonding Technology
The rapid rise of new artificial intelligence (AI) applications — boosted recently by broad interest in generative AI (GenAI) —...
SEMI ISS Europe 2024 to Spotlight European Chips Act With Focus on Innovation and Supply Chain Resilience
Leading analysts, economists, policymakers, and technologists will gather at the SEMI Industry Strategy Symposium Europe (ISS Europe) 2024, March 6-8...
Amkor and GlobalFoundries Cut Ribbon on Strategic Cooperation in Portugal
Partnership to strengthen the European automotive supply chain and expand services for global customers Amkor Technology, Inc. (Nasdaq: AMKR), a...
NAMICS Technology Inc. Announces Mr. Tatsuhiro Fujiki as New CEO
NAMICS Technologies, Inc. has proudly welcomed Mr. Tatsuhiro Fujiki to its esteemed team as the newly appointed Chief Executive Officer....
Joseph Guiliano appointed Chief IP Officer of Adeia
San Jose, Calif.– January 4, 2024 – Adeia Inc. (Nasdaq: ADEA) today announced that Joseph Guiliano was appointed as Adeia’s...
Brewer Science Presents the Future of Water Quality Monitoring at CES 2024
Advancing the future of drinking water sensing for real-time detection of contaminants, such as lead, using printed sensors Las Vegas,...
SEMI Reports Global Semiconductor Capacity Projected to Reach Record High
MILPITAS, Calif. — January 2, 2024 — Global semiconductor capacity is expected to increase 6.4% in 2024 to top the 30 million *wafers...
SEMI Recognizes Edwards at SEMICON Europa 2023 for Exceptional Leadership, Diversity, and Inclusion
MUNICH, Germany ─ December 20, 2023 ─ SEMI Europe and the SEMI European Advisory Council for Diversity and Inclusion announced...
Fraunhofer IZM Manages to Automate Measuring Optical In-glass Waveguides
December 12, 2023 The use of glass as substrate in electronics manufacturing enables the additional transmission of optical signals through...
Monozukuri CEO Reveals Gordon Moore’s Advanced Package Vision
Chip/Package Co-Design May Fulfill a Second “Moore’s Law” Gordon Moore predicted the demise of Moore’s law and envisioned in its...
Mosaic Microsystems Awarded $1 Million from Defense Business Accelerator Microelectronics Challenge
Mosaic Microsystems LLC proudly announces its success in winning a $1.0 million award as one of the competitors in the...
PulseForge and nScrypt Partner to Revolutionize 3D Additive Fabrication
In a groundbreaking collaboration that traces its origins back to 2014, NovaCentrix, the then parent company of PulseForge, and nScrypt...
SEMI Honors Semiconductor Industry Sustainability Leaders
MILPITAS, Calif. — December 12, 2023 — SEMI, the global industry association representing the electronics manufacturing and design supply chain, today...
Amkor Technology Submits Net Zero Goal to Science Based Targets Initiative (SBTi)
TEMPE, Ariz. – Dec. 12, 2023 — Amkor Technology, Inc. (Nasdaq: AMKR), a leading provider of semiconductor packaging and test services, announced...
EV Group Brings Revolutionary Layer Transfer Technology to High-volume Manufacturing with EVG®850 NanoCleave™ System
Infrared laser cleave technology enables ultra-thin-layer transfer from silicon substrates with nanometer precision, revolutionizing 3D integration for advanced packaging and...
StratEdge Presents and Exhibits at the American Society of Mechanical Engineers (ASME) InterPACK 2023 Conference
Santee, Calif. – 30 November 2023 –StratEdge Corporation, leader in the design and production of high-performance semiconductor packages for RF,...
Amkor Announces US Advanced Packaging and Test Facility
Amkor enables a resilient domestic semiconductor supply chain with the construction of its new advanced packaging facility in Arizona TEMPE,...
