Press Releases

Lam Research Introduces the Semiconductor Industry’s First Collaborative Robot for Fab Maintenance Optimization

Lam Research Corp. today introduced Dextro™, the semiconductor industry’s first collaborative robot (cobot) designed to optimize critical maintenance tasks on wafer...

IBM Brings the Speed of Light to the Generative AI Era with Optics Breakthrough

New co-packaged optics innovation could replace electrical interconnects in data centers to offer significant improvements in speed and energy efficiency...

YES Announces Release of VertaCure XP G3 Systems for Advanced Packaging Applications

Yield Engineering Systems (YES) is a leading manufacturer of process equipment for AI and HPC semiconductor solutions. YES announced today...

Siemens & PhysicsX Collaborate to Build AI-Based Deep Physics Simulation

AI startup’s release of its latest pre-trained deep physics model is built on high-fidelity data generated with Siemens’ Simcenter simulation...

Glass-Driven Solutions for Advanced Packaging

As the demand for advanced interconnect solutions continues to grow, PLANOPTIK has developed Advanced Connectivity Technology (ACT), a cutting-edge solution...

Indium Corporation Announces Executive Leadership Appointments

Evans appointed executive chair of board of directors, Berntson named CEO Indium Corporation®, a leading materials refiner, smelter, manufacturer, and...

SEMI Publishes Recommendations for Semiconductor Policies in the 2024-2029 European Commission Legislative Term

SEMI, the industry association serving the global electronics design and manufacturing supply chain, today published recommendations for the European Union...

Brewer Science Presenting Innovations in Hybrid and Laser Debonding at EPTC in Singapore

3D Packaging and Thin Wafer Processing Research Co-Presented by Brewer Science Brewer Science, Inc., an industry leader in advanced packaging...

Siemens’ Solido SPICE Certified for Multiple Leading-edge Samsung Foundry Processes

Siemens Digital Industries Software announced today that its continued collaboration with longtime customer Samsung Foundry has established a host of...

Indium Corporation Honored by Electronics Era with Excellence in Electronics Assembly Materials Award

Indium Corporation is proud to announce its recent achievement of the Excellence in Electronics Assembly Materials Award from Electronics Era,...

Indium Corporation Technical Expert to Present at SiP Conference China

Indium Corporation Senior Area Technical Manager for East China, Leo Hu, is scheduled to deliver a presentation on low-temperature solder material in...

StratEdge Wins Prestigious IMAPS 2024 Corporate Recognition Award

StratEdge Corporation, leader in the design, production, and assembly of high-frequency and high-power semiconductor packages, is proud to announce that...

Cadence Unveils Arm-Based System Chiplet

Cadence has announced a groundbreaking achievement with the development and successful tapeout of its first Arm-based system chiplet. This innovation...

SEMI 20 under 30: Luca Sinkó, SEMILAB R&D Team Leader, Recognized as a 2024 Honoree

We are proud to announce that Luca Sinkó, R&D Team Leader of Semilab SRP Application Team, has been recognized as...

Indium Corporation Receives Global Technology Award at SMTA International

Indium Corporation was honored with a Global Technology Award during an award ceremony on October 22, 2024, at SMTA International...

ACM Research Announces Major Performance Breakthrough for Ultra C Tahoe Cleaning Tool

Latest Generation Front-end Cleaning Tool Reduces Chemical Use by 75% ACM Research, Inc., a leading supplier of wafer processing solutions...

Indium Corporation Receives Business/Industry Partnership Award by NYCCT

Indium Corporation is honored to announce that it has been awarded the Edward J. Pawenski Business/Industry Partnership Award by the...