Press Releases

Indium Corporation Expert to Present on Gold Solder Solutions for Medical Applications at IMAPS 2025 Workshop

Indium Corporation Senior Product Specialist, Jason Farrell, will deliver a technical presentation at the IMAPS Advanced Packaging for Medical Microelectronics Workshop,...

StratEdge to Showcase its Latest Molded Ceramic Packages at Upcoming Industry Conferences

StratEdge Corporation, leader in the design, production, and assembly of high-frequency and high-power semiconductor packages, will reveal its newest molded...

Brewer Science to Present at SPIE Advanced Lithography + Patterning 2025

Brewer Science, Inc., an industry pioneer in advanced lithography and patterning innovation, will present its ground-breaking developments in addressing scaling...

ASE Expands its Chip Packaging and Testing Facility to Enable Next-Gen Applications

Advanced Semiconductor Engineering, Inc. (ASE) officially launched its fifth plant in Penang, Malaysia. The new plant will see improved manufacturing...

Speakers at Inaugural SEMIEXPO Heartland Event to Highlight Advancements in Smart Manufacturing and Smart Mobility

SEMIEXPO Heartland, SEMI’s first Midwestern U.S. exposition to be held April 1-2 at the Indiana Convention Center in Indianapolis, will...

Global Semiconductor Manufacturing Industry Reports Solid Q4 2024 Results, SEMI Reports

The global semiconductor manufacturing industry closed 2024 with strong fourth quarter results and solid year-on-year (YoY) growth across most of the...

EV Group Highlights Revolutionary Temporary Wafer Bonding and Debonding Solution for HBM and 3D DRAM at SEMICON Korea

EV Group (EVG), a leading provider of innovative process solutions and expertise serving leading-edge and future semiconductor designs and chip...

Nova Completes Acquisition of Sentronics

Nova announced that it completed the acquisition of Sentronics Metrology GmbH, a privately held company headquartered in Germany. The transaction...

Nordson Electronics Solutions Introduces the ASYMTEK Select Coat® SL-1040 Ultrasonic Cleaning Station

See this unique nozzle cleaning system and speak with our experts at IPC APEX booth 3200 Nordson Electronics Solutions, a...

Trymax Joins Accuron Technologies Group for Further Growth and Expansion

Accuron Technologies (Accuron), a global precision engineering and technology group, secured a controlling interest in Trymax Semiconductor Equipment (Trymax), a...

Brewer Science Welcomes New Chief Business Officer, Poupak Khobadandeh

Ms. Khobadandeh brings decades of industry experience to Brewer Science Brewer Science, Inc., a global leader in developing and manufacturing...

LQDX and Arizona State University Sign Semiconductor Packaging Collaboration Agreement

LQDX Inc., developer of high-performance materials and process IP for advanced semiconductor packaging,  announced that it has signed a formal...

ERS electronic Unveils Production, R&D Facility, and Competence Center for Advanced Packaging in Germany

ERS electronic, the industry leader of thermal management solutions for semiconductor manufacturing, celebrated the official opening of ERS Barbing, its...

MRSI-A-L Active Aligner Wins Infostone 2024 Award

On December 6, 2024, Infostone successfully held its 2024 Annual Summary and the 11th Heroes List Award live conference. MRSI...

Jabil Recognizes Nordson Electronics Solutions With 2024 Best Strategic Supplier Award

For superior performance in quality, delivery, innovation, and partnership related to fluid dispensing systems used in electronics manufacturing Nordson Electronics...

Circuits Integrated Hellas Selected as Laureate for Paris Space Week 2025 Innovation Challenge

CIH to Pitch Disruptive Technology to Global Leaders in the Space Industry Circuits Integrated Hellas (CIH), a pioneering innovator in...

Indium Corporation Expert to Address Thermal Challenges at TestConX 2025

Indium Corporation technical support engineer Carson Burt will deliver a technical presentation at TestConX 2025, taking place March 3-5 in...

Koh Young Partners with NTV USA to Expand its Advanced Packaging and Semiconductor Inspection Solutions in the United States

Koh Young, the global leader in True 3D measurement-based inspection and metrology solutions, announced its partnership with NTV USA (NexTex...