Press Releases

Indium Corporation Joins Virginia Tech Center for Power Electronics Systems (CPES) Industry Consortium

Indium Corporation®, a leading materials refiner, smelter, manufacturer, and supplier to the global electronics, semiconductor, thin-film, and thermal management markets, has...

SEMI Selects Kiterocket as Agency of Record

Kiterocket to support the global association’s communications strategy, amplify industry leadership, and advance cross-sector initiatives from advocacy to workforce development...

ASE Announces FOCoS-Bridge with TSV; Latest Package Technology Reduces Power Loss by 3x for Next-Generation AI and HPC Applications

Advanced Semiconductor Engineering, Inc. (ASE), a member of ASE Technology Holding Co., Ltd., announced Fan-Out Chip-on-Substrate-Bridge (FOCoS-Bridge) with Through Silicon...

Indium Corporation to Feature Precision Gold-Based Die-Attach Preforms at IMS 2025

Indium Corporation® will feature its high-reliability, gold-based precision die-attach preforms for critical laser and RF applications, as well as 5G...

Kuehne+Nagel Launches Air Freight Carrier Engagement Sustainability Programme

To lead the way to a more sustainable future, Kuehne+Nagel announces the launch of its carrier engagement sustainability programme. As...

Indium Corporation to Feature Materials Solutions for Semiconductor Packaging and Assembly at ECTC

Indium Corporation®, an industry leader in innovative materials solutions for semiconductor packaging and assembly, will feature its lineup of high-reliability...

EV Group Brings Digital Lithography to Heterogeneous Integration HVM Applications with LITHOSCALE® XT

LITHOSCALE XT provides up to five-fold increase in throughput versus previous industry benchmark LITHOSCALE system; EVG maskless exposure technology to...

Deca Announces Agreement with IBM to Bring High-Density Fan-Out Interposer Production to North America

Deca Technologies announced the signing of an agreement with IBM to implement Deca’s M-Series™ and Adaptive Patterning® technologies in IBM’s advanced...

EV Group Forms Subsidiary in Singapore to Strengthen Local Customer Support

Establishment of fully-owned subsidiary is the culmination of a decades-long commitment to the region supporting evolving needs in semiconductor wafer...

Indium Corporation to Feature Power Electronics Solutions at SEMICON Southeast Asia 2025

As a trusted leader in materials science for advanced electronics assembly, Indium Corporation® is proud to showcase its innovative power...

Circuits Integrated Hellas Launches Game-Changing Kythrion Satcom Chipset

Disruptive Chipset Platform Redefines Satellite Agility, Efficiency and Sustainability; Enables More than 60% Reductions in Size, Weight, and Cost of...

Brewer Science to Showcase Advanced Material Innovations at CS MANTECH and ECTC 2025

Enabling 3D integration requires strategic temporary bonding material selection Rolla, Mo. – May 14, 2025 – Brewer Science, Inc., a global...

Veeco Announces Over $35 Million in Advanced Packaging Lithography System Orders From IDM & OSAT Customers

Veeco Instruments Inc. announced its received over $35 million of orders for its AP300™ Lithography systems in recent quarters from...

Indium Corporation and Rio Tinto Announce Groundbreaking Milestone in Gallium Extraction Partnership

Indium Corporation and Rio Tinto announced the successful extraction of gallium from feed sourced at Rio Tinto’s Vaudreuil alumina refinery in Saguenay, Quebec,...

Excillum and Baker Hughes’ Waygate Technologies Announce Technology Collaboration for High-Resolution X-ray Computed Tomography

Excillum, the global leader in the field of advanced microfocus and nanofocus X-ray sources, and Waygate Technologies, a Baker Hughes business...

StratEdge LPA-Series Semiconductor Packages Take Center Stage at CS Mantech and Space Tech Expo USA

StratEdge Corporation, leader in the design, production, and assembly of high-frequency and high-power semiconductor packages for RF, microwave, and millimeter-wave...

Koh Young Invites You to the 2025 IEEE Electronic Components and Technology Conference

Koh Young, the industry leader in True3D™ measurement-based inspection solutions, invites you to join us at the 2025 IEEE Electronic...