Artificial Intelligence is Driving Panel Level Packaging
Mar 11, 2025 · By Dean Freeman · 3D In Context, Blogs
3D In Context View all
Meeting Sustainability Goals Hits Political and Technical Headwinds
Feb 26, 2025 · By Dean Freeman · 3D In Context
Sustainability goals and efforts are starting to hit some headwinds in the world. In the United States the Trump administration has yet again pulled out of the Paris agreement, and has a campaign promise of “Drill baby, drill!”. However, the United States is not alone in the challenges of keeping...
Heterogenous Integration at ISS: A Key Part of High-Performance Compute
Feb 11, 2025 · By Dean Freeman · 3D In Context
Heterogenous integration and AI are currently moving forward hand-in-hand as the demand for greater computing power in theory, reduces the energy and time needed to train models; (although, DeepSeek may now change some of the thinking along these lines). Larger more complex packages are being built to manage the learning...
Asia May Still Be the Hottest Spot for Advanced Packaging
Jan 27, 2025 · By Dean Freeman · 3D In Context
When the United States and Europe looked to re-shore semiconductor technology, the primary focus was restoring leading-edge manufacturing and creating more resilient supply chains throughout the ecosystem. Eventually, it emerged that nearly all of the leading-edge advanced packaging took place in Asia, and there was minimal packaging capability in either...
SEMI ISS 2025: Ready, Set, Ramp!
Jan 22, 2025 · By Dean Freeman · 3D In Context
The semiconductor industry has been discussing breaching the 1 trillion-dollar mark as it was coming out of COVID-19 and amid a boom year in 2022. The slowdown in 2023 had some resetting the dates for when the industry would crest the 1 trillion mark. The AI boom of 2024 has...
Francoise in 3D View all
Announcing the Winners of the 2025 3D InCites Awards
Feb 04, 2025 · By Francoise von Trapp · Blogs
As advanced interconnect and advanced packaging processes take the helm to drive advancements in next generation semiconductor devices, innovation and collaboration across the microelectronics supply chain becomes more important than ever. So, when the 3D InCites Member Advisory Board reviewed this year’s finalists for the 2025 3D InCites Technology Enablement...
Interconnectology Saves the World!
Jan 08, 2025 · By Francoise von Trapp · Blogs
In 2007, when I was managing editor at the now defunct Advanced Packaging Magazine, we went out on a limb in our January Industry Forecast to declare, as our cover story: Advanced Packaging Saves the World! In 2008, we tempered that declaration to Advanced Packaging Drives the Industry! By 2009,...
The 3D InCites Podcast Backtrack – 2024 in Review
Dec 18, 2024 · By Francoise von Trapp · Blogs
Buzzsprout, the platform where the 3D InCites podcast lives, does a cool thing at the end of the year. It provides the podcast backtrack – a recap of your stats, including the top performing episodes. So we thought we’d share it with you, our listeners and sponsors, to give you...
Catching Up on The Latest in Advanced Packaging at SEMICON Europa 2024
Dec 03, 2024 · By Francoise von Trapp · Blogs
Now that imec’s Luc Van den hove declared advanced packaging is key to the advancement of semiconductors, everyone in the industry needs to catch up to those who have been following the course of these technologies while they were in development. The Advanced Packaging Conference (APC) at SEMICON Europa 2024...
From Different Dimensions View all
Industry Trade Shows and Conferences Strengthen Partnerships and Influence Product Innovation
Mar 03, 2025 · By Ramachandran Trichur · Blogs
Conferences and industry trade shows have been the cornerstone of professional networking and educational advancement for as long as I can remember. More than 20 years ago, I attended my first semiconductor event, the Solid State Sensors & Actuators Conference (called Hilton Head 2002), and have been participating ever since....
February Member News: Expansion, Collaborations, and Events Galore
Feb 27, 2025 · By Camden McCrea · Blogs
February member news shows dynamic activity for semiconductor industry, with exciting advancements in technology, strategic expansions, key industry events, and notable leadership updates. From breakthrough product launches and major acquisitions to industry collaborations, here’s a look at what our members achieved this month. Technology Innovation and Product Developments Nordson Electronics...
Bridging the Semiconductor Talent Gap – The Role of the European Chips Act and Beyond
Feb 24, 2025 · By Isabella Drolz · Blogs
The European Chips Act (ECA) is pivotal to Europe’s strategy for technological sovereignty, aiming to strengthen the continent’s semiconductor supply chain and foster innovation. However, a key obstacle remains: the projected shortfall of 350,000 semiconductor professionals by 2030. Addressing this semiconductor talent gap is critical for the ECA’s success and...
What You Need to Know About PFAS
Feb 19, 2025 · By Julia Freer · Blogs
You have probably heard about health and environmental concerns related to per- or polyfluoroalkyl substances (PFAS). Companies are being pressured to replace PFAS with safer alternatives for nonstick coatings, water-resistant fabrics, firefighting foams, and more to meet upcoming restrictions. For manufacturers, including those in the semiconductor industry, PFAS replacement is...
Interconnectology 101 View all
The Role of AI-Powered 3D X-Rays for Advanced Packaging Test Applications
Feb 18, 2025 · By Jillian McNichol · Interconnectology 101
Semiconductors power AI, AI powers semiconductor manufacturing, and the cycle continues indefinitely. But one area where AI is making a particularly noteworthy contribution is for the test phase of advanced packaging. With advancements in AI, manufacturers can find and address defects within their processes faster than ever, allowing them to...
Navigating the Shortage of Semiconductor Engineers: Tips from the Experts
Jan 29, 2025 · By Jillian McNichol · Interconnectology 101
You may have heard that for the semiconductor industry to reach $1 trillion, it needs around one million new workers globally. This includes entry level talent, technicians, supporting roles like accounting and human resources, and of course, semiconductor engineers. As it stands, no single industry has ever reached $1 trillion...
How Arizona is Growing its Advanced Packaging Capabilities
Jan 20, 2025 · By Jillian McNichol · Blogs
An inside look at how ASU, local governments, and private sector companies are working together to make Arizona a hub for advanced packaging innovation. The year 2022 was monumental for the semiconductor industry. That year, the Biden-Harris administration committed to making the U.S. a world leader in semiconductor manufacturing by...
It’s Time to Put AI’s Growth Into Perspective
Dec 16, 2024 · By Jillian McNichol · Interconnectology 101
These days, it seems like artificial intelligence (AI) is taking over the world. In the last two years alone, we’ve seen the rise of ChatGPT, autonomous vehicles, Google Gemini, deep fakes, and my least favorite – soulless AI art. With so many new applications coming into focus, it can feel...
Packaging IFTLE View all
IFTLE 620: Micross Acquires Integra; Hynix HBM booked through 2025
Feb 25, 2025 · By Phil Garrou · Blogs
Micross, a portfolio company of Behrman Capital, announced on January 15, that it has acquired Integra Technologies, headquartered in Wichita, KS. Since both are privately owned, the exact amount that Micross paid to acquire Integra Technologies hasn’t been publicly disclosed in the available sources. Micross Components makes microelectronic components for...
IFTLE 619: CHIP Flagship Facilities include Albany NY, Sunnyvale CA and Tempe AZ
Feb 12, 2025 · By Phil Garrou · Blogs
CHIPS for America has announced three anticipated CHIPS for America research and development (R&D) flagship facilities. These state-of-the-art CHIP flagship facilities will establish world-class advanced semiconductor R&D in the United States. “They will address critical gaps in the current ecosystem, offering unparalleled value to a diverse array of stakeholders across...
IFTLE 618: UCIe Standard vs. UCIe Advanced vs. UCIe 3
Jan 28, 2025 · By Phil Garrou · Blogs
Multi-die systems are driving the need for standardized die-to-die interconnects. Several industry alliances have come together to define such standards: Optical Interface Forum (OIF) – The XSR and USR physical layer specifications optimized for die-to-die connectivity Chips Alliance – The AIB specification which was originally introduced by Intel Open Compute...
IFTLE 617: SK Hynix considers 2.5D packaging business with Amkor
Jan 15, 2025 · By Phil Garrou · Blogs
Will TSMC, SK Hynix, and Amkor be an Onshore Source for Nvidia? SK Hynix learned to package its own stacked dynamic random access memories (DRAMs) for high bandwidth memory (HBM) components. According to reports, the company is now considering entering the OSAT market by way of a strategic partnership with...
Latest Posts - Page 80
A funny thing happened on the way to IMAPS 2009
Mar 11, 2009 · By Francoise von Trapp
This is not a story about 3D integration technologies (although I’m sure I can figure out a way to work...Alchimer: A Growing Concept
Mar 11, 2009 · By Francoise von Trapp
In an understated research lab and recently upgraded demo facility located just outside Paris in Massy, France, Alchimer scientists...
My 3D IC Blog-venture
Mar 02, 2009 · By Francoise von Trapp
While most of my blogging will be devoted to talking about what's happening in the world of 3D integration technologies,...Soitec Unleashes the Power of Three
Feb 11, 2009 · By Francoise von Trapp
A walk across the impressive Bernin, France campus that is home to two of Soitec Group’s three divisions takes...
What’s your semi lingo IQ?
Feb 06, 2009 · By Francoise von Trapp
I’ve long been fascinated with the vernacular of the semiconductor industry, which is riddled with acronyms that can often mean...Happy Birthday, IMEC!
Feb 03, 2009 · By Francoise von Trapp
I finally realized why I find the semiconductor industry so compelling, and why the people are so great to work...Interview with Steve Lerner: 3D Start-up Alchimer Poised for Success
Feb 02, 2009 · By Francoise von Trapp
Talk about good timing. It’s been a whirlwind year of accomplishments for Alchimer, a French semiconductor start-up whose product portfolio...Even the Magic 8 Ball couldn’t have called it
Jan 18, 2009 · By Francoise von Trapp
In my last editorial as managing editor of Advanced Packaging magazine, I suggested we should turn to the Magic...CEA-Leti: A visit to the mother ship
Jan 12, 2009 · By Francoise von Trapp
If your company is located in France, and/or is involved in micro and nanotechnologies for microelectronics, chances are it’s...
New Year Ramblings
Jan 09, 2009 · By Francoise von Trapp
Ok, I realize it’s not really the New Year, but for me, September is always about beginnings. The school year...
