IFTLE 599: Prismark’s 30-Year Perspective of the Electronics Industry
Jul 17, 2024 · By Phil Garrou · Blogs, Packaging IFTLE
Latest Posts - Page 74
Filled vs. conformal vias: the consensus
Dr. Zhang, I think we have reached a verdict.Bob Patti wrote in to confirm Anonymous Caller’s statement...
Sound Bites from IMAPS Global Business Council
Yesterday, a full line up of industry experts offered their perspective of supply chain developments for 3D packaging, in addition...Other 3Ds: The many uses for LCP
Last fall before SEMICON Europa, Andreas Ostmann, manager of the embedding and substrate technologies group, Fraunhofer IZM, spent some time...Pre-conference symposium reviews 3D integration
It’s always a challenge to adequately sum up several hours of detailed discussion on a topic, and this afternoon’s symposium...The TSV wave hits Asian shores
A wise industry executive once told me (ok, it was Wilfried Bair, of SUSS MicroTec) that we would know when...Is the industry ready for 3D ICs?
My favorite people to talk to in the 3D space are those who work in R&D. There is an energy...A final (?) word on filling TSVs
Now look what I’ve started. After posting Bob Patti’s solution for performing UBM with conformal TSVs, I got a phone...EVG’s partnership with Léti adds a third dimension
As the old saying goes, things usually happen in threes… and in this case 3D. Three years ago, EV Group...Breaking News from Global Business Council
I promised that as soon as I knew who NEXX’s new collaboration was with, I would let you all know....Collaborate, innovate, and get ready for the rebound
I know where many of the optimistic people in the semiconductor industry were today; giving presentations at the Global Business...
The Other 3D Packaging Technologies
While TSV developments continue to attract media attention as the rock star technology of 3D integration, it’s important to remember...Was Moore’s Law really meant to be a law or more of a guideline?
Before I joined the semiconductor industry, I was completely unaware of this guy Gordon Moore, whose observations and predictions set...Following the BrightSpots 3D IC Forum
Day One: I'm not sure if it’s because it was the Monday after a U.S. holiday weekend, or just...
3D InCites: Unveiled
Today, July 6, 2009, is the day a vision becomes a reality. When I first started Françoise in...More about UBM for conformal TSVs
In response to the previous post, Bob Patti of Tezzaron Semiconductors weighed in with a solution to performing under bump...TSV copper fill: is it necessary for UBM?
In response to a recent post about the whether/when it is necessary to completely fill TSVs, or sufficient to...June Events in 3D
As May rolls right into June, so do the 3D events; or should I say events in which 3D topics...“Francoise in 3D” resurfaces in AZ
For the past two weeks, I’ve been slightly preoccupied with relocating from Massachusetts to Arizona. For much of that time,...A Visit to Nexx Systems
It’s easy to see why NEXX is experiencing growth. It’s all about attitude, and the enthusiasm among NEXX’s team...
A Visit to SUSS MicroTec
It’s been...
