Blogs Archives - Page 73 of 79

3D In Context View all

Asia May Still Be the Hottest Spot for Advanced Packaging

Jan 27, 2025 · By Dean Freeman · 3D In Context

When the United States and Europe looked to re-shore semiconductor technology, the primary focus was restoring leading-edge manufacturing and creating more resilient supply chains throughout the ecosystem. Eventually, it emerged that nearly all of the leading-edge advanced packaging took place in Asia, and there was minimal packaging capability in either...

SEMI ISS 2025: Ready, Set, Ramp!

Jan 22, 2025 · By Dean Freeman · 3D In Context

The semiconductor industry has been discussing breaching the 1 trillion-dollar mark as it was coming out of COVID-19 and amid a boom year in 2022. The slowdown in 2023 had some resetting the dates for when the industry would crest the 1 trillion mark. The AI boom of 2024 has...

Figure 4 Feature photo above: Ian Cutress of More than Moore moderated a panel discussion including Terrence Lee of Applied Materials, Johanna Swan of Intel, Deepak Kulkarni of AMD, and Kam Kittrell of Cadence. (Source Applied Materials).

3D Integration Themes Become a Reality at IEDM 2024

Jan 13, 2025 · By Dean Freeman · 3D In Context

The Transistor Wars are back, but they look a little different this time. I’ve been attending the IEDM conference off and on for 30ish years. If you are in the semiconductor process side of the world, this is one of the better conferences to attend to get up to speed...

Semiconductor Industry Forecast: Looking Forward to Balanced Growth in 2025

Dec 10, 2024 · By Dean Freeman · 3D In Context

As the semiconductor industry moves into the last month of 2024, industry pundits are looking back and then looking forward to seeing what they missed in 2024 and preparing their assumptions for 2025. This post looks at what they are predicting to bring you the 3D InCites Semiconductor Industry Forecast....

Francoise in 3D View all

Interconnectology Saves the World!

Jan 08, 2025 · By Francoise von Trapp · Blogs

In 2007, when I was managing editor at the now defunct Advanced Packaging Magazine, we went out on a limb in our January Industry Forecast to declare, as our cover story: Advanced Packaging Saves the World! In 2008, we tempered that declaration to Advanced Packaging Drives the Industry! By 2009,...

The 3D InCites Podcast Backtrack – 2024 in Review

Dec 18, 2024 · By Francoise von Trapp · Blogs

Buzzsprout, the platform where the 3D InCites podcast lives, does a cool thing at the end of the year. It provides the podcast backtrack – a recap of your stats, including the top performing episodes. So we thought we’d share it with you, our listeners and sponsors, to give you...

Catching Up on The Latest in Advanced Packaging at SEMICON Europa 2024

Dec 03, 2024 · By Francoise von Trapp · Blogs

Now that imec’s Luc Van den hove declared advanced packaging is key to the advancement of semiconductors, everyone in the industry needs to catch up to those who have been following the course of these technologies while they were in development. The Advanced Packaging Conference (APC) at SEMICON Europa 2024...

Making Connections at SEMICON Europa 2024

Nov 18, 2024 · By Francoise von Trapp · Blogs

Let’s be honest. When we get home from a trade show like SEMICON Europa 2024, it’s not all the presentations that we remember. It’s the connections we’ve made – new and old – with industry colleagues around the globe that stand out. You can go to any SEMICON Event around...

From Different Dimensions View all

January Member News: Technology Innovation, Strategic partnerships, Expansion and More

Jan 30, 2025 · By Camden McCrea · Blogs

January Member News celebrates major developments in semiconductor technology, strategic partnerships, industry expansions, and workforce growth. Companies introduced cutting-edge packaging, process control, and inspection solutions, while various acquisitions strengthened the U.S. semiconductor supply chain. There were various new hiring opportunities across the industry, upcoming conferences, and notable achievements. Innovation and...

Sustainability 101: 2025 and Progress Toward Sustainability Goals

Jan 22, 2025 · By Julia Freer · Blogs

Happy New Year 2025. How are those 2030 sustainability goals coming along? If you committed to 2025 goals, are you on target to reach them this year? If you feel behind, you have plenty of company. Speed and Scale by John Doerr, published in 2021, laid out a plan for...

2024: A Year of Growth and Innovation

Jan 15, 2025 · By Peter Dijkstra · Blogs

2024 was another year of significant growth for Trymax Semiconductor Equipment B.V. This year was marked by several pivotal developments, including the successful ramp-up of our new manufacturing facility, the establishment of a dedicated Quality Department, the expansion of our team with additional Field Service Engineers, and the growing momentum...

December Member News: Celebrating Progress and Achievements

Dec 30, 2024 · By Avery Gerber · Blogs

Despite being the holiday season for much of the world, many of our members have made remarkable progress and celebrated many achievements in December. From groundbreaking technological advancements and well-deserved industry awards to strategic collaborations and significant company developments, our members are continuing to lead the way in their fields....

Interconnectology 101 View all

Navigating the Shortage of Semiconductor Engineers: Tips from the Experts

Jan 29, 2025 · By Jillian McNichol · Interconnectology 101

You may have heard that for the semiconductor industry to reach $1 trillion, it needs around one million new workers globally. This includes entry level talent, technicians, supporting roles like accounting and human resources, and of course, semiconductor engineers. As it stands, no single industry has ever reached $1 trillion...

How Arizona is Growing its Advanced Packaging Capabilities

Jan 20, 2025 · By Jillian McNichol · Blogs

An inside look at how ASU, local governments, and private sector companies are working together to make Arizona a hub for advanced packaging innovation. The year 2022 was monumental for the semiconductor industry. That year, the Biden-Harris administration committed to making the U.S. a world leader in semiconductor manufacturing by...

It’s Time to Put AI’s Growth Into Perspective

Dec 16, 2024 · By Jillian McNichol · Interconnectology 101

These days, it seems like artificial intelligence (AI) is taking over the world. In the last two years alone, we’ve seen the rise of ChatGPT, autonomous vehicles, Google Gemini, deep fakes, and my least favorite – soulless AI art. With so many new applications coming into focus, it can feel...

What to Know Before Buying an IMAPS Academy Course

Nov 04, 2024 · By Jillian McNichol · Interconnectology 101

If you’re new to the advanced packaging industry, it may have crossed your mind to invest in a professional development course. IMAPS, or the International Microelectronics Assembly and Packaging Society, offers exactly that. Their packaging-specific, IMAPS Academy courses are aimed at promoting a stronger understanding of key parts of the...

Packaging IFTLE View all

IFTLE 618: UCIe Standard vs. UCIe Advanced vs. UCIe 3

Jan 28, 2025 · By Phil Garrou · Blogs

Multi-die systems are driving the need for standardized die-to-die interconnects. Several industry alliances have come together to define such standards: Optical Interface Forum (OIF) – The XSR and USR physical layer specifications optimized for die-to-die connectivity Chips Alliance – The AIB specification which was originally introduced by Intel Open Compute...

IFTLE 617: SK Hynix considers 2.5D packaging business with Amkor

Jan 15, 2025 · By Phil Garrou · Blogs

Will TSMC, SK Hynix, and Amkor be an Onshore Source for Nvidia? SK Hynix learned to package its own stacked dynamic random access memories (DRAMs) for high bandwidth memory (HBM) components. According to reports, the company is now considering entering the OSAT market by way of a strategic partnership with...

IFTLE 616: Broadcom eXtreme Dimension System in Package (XDSiP™)

Jan 07, 2025 · By Phil Garrou · Blogs

Broadcom has recently announced the availability of its 3.5D eXtreme Dimension System in Package (XDSiP™) platform technology, enabling consumer AI customers to develop next-generation custom accelerators (XPUs). The new platform relies on TSMC’s CoWoS and other advanced packaging technologies. It will allow designers to build system-in-packages (SiPs) of 3D-stacked logic,...

CoWoS technology 9X Reticle - Source TSMC

IFTLE 615: TSMC Evolves CoWoS Technology Promising 9x Reticle Size by 2027

Dec 24, 2024 · By Phil Garrou · Blogs

TSMC recently announced at its Open Innovation Platform (OIP) Ecosystem Forum in Europe that its chip-0n-wafer-on=substrate (CoWoS) packaging technology will achieve certification by 2027, introducing a version with 9x reticle size. This will allow twelve HBM4 memory stacks, providing unprecedented performance enhancements for artificial intelligence (AI) and high-performance computing (HPC)...

Blogs

US-JOINT Consortium: Strengthening Advanced Packaging Innovation Across Borders

Announcing the Winners of the 2025 3D InCites Awards

Empowering the Future: New York’s Semiconductor Industry Surge

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From Different Dimensions View all

Interconnectology 101 View all

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