Interconnectology Saves the World!
Jan 08, 2025 · By Francoise von Trapp · Blogs, Francoise in 3D
Latest Posts - Page 53
Taking 3D Integration to the Next Level
There is no rest for the weary. Just because we can finally declare that 3D ICs are in production doesn’t...
Semiconductor Supplier Updates from SEMICON West 2015
No SEMICON West would be complete without a few laps around Moscone North and South, and some one-on-one chats with...
At AMD, Die Stacking Hits the Big Time
It’s official. Die stacking and interposer integration have been implemented in a high volume consumer application. AMD officially launched the...
SEMICON West 2015 Demonstrates the Powerful IC Manufacturing Base
A few weeks ago, San Francisco’s Moscone Center hosted the Design Automation Conference (DAC 2015), with many EDA experts and...
SEMICON West Keynote Panel: Semiconductor Manufacturing is a Team Sport
I almost didn’t attend the keynote panel titled, Scaling the Walls of Sub 14nm Manufacturing, at SEMICON West last week,...
The IoT at SEMICON West 2015: We Just Can’t Get Enough
As a topic of much discussion and debate, the Internet of Things (IoT) stole the show once again, this time...
Congratulations to the Winners of the 2015 3D InCites Awards
For the third consecutive year, 3D integration enthusiasts gathered at the Impress Lounge at SEMICON West for the 2015 3D...
Executive Viewpoint: Providing A Golden Boat of Wafers
As 3D integration technologies become established in low volume manufacturing, the supply chain is gearing up to address high volume...
aveni: The New Name and Face of Alchimer
I’ve been following the Alchimer story as it unfolds ever since I first started following the course of 3D integration...
Heterointegration, Friend or Foe: Opening the Door for Technologies Beyond Moore’s Law Silicon
What is heterogeneous integration, and is it my friend, or is it my foe? Why does it seem everywhere one...
The 2015 3D InCites Guide to 3D at SEMICON West
2015 will go down in history as the year 3D finally got real. It’s not an emerging technology anymore, and...
Will the Internet of Everything Really Make the World a Better Place?
I recently started watching the HBO sitcom, Silicon Valley. If you haven’t seen it, it’s a great parody of what...
Path Finding and 3DPF
In the past year, I have written short pieces explaining how Path Finding methodology can proactively help identify viable solutions...
DAC 2015 Focuses on the Automotive Market
By attracting 7011 EDA and IP developers and users, the 52 Design Automation Conference, held in the South Hall of San...
Amkor Execs Outline Strategy for the Future of Advanced Packaging
I was invited to attend Amkor’s bi-annual customer symposium, which was held in Santa Clara two weeks ago. It was...
Sensors Expo 2015 and The Internet Of Messy Things
What are the implications for the Internet of Things when the “Things” are human beings? As was said in a...
Diverse Technology Selections Served at CS MANTECH 2015
What were all these silicon people doing at a compound semiconductor conference? CS MANTECH 2015 was the 30th anniversary version...
ECTC 2015 Supplier Update
While Herb Reiter dove deep into the technology sessions at ECTC 2015, I spent most of my time picking the brains of suppliers...
Who Should Win the First 3D InCites Individual Achievement Award?
The journey to the commercialization of 3D integration technologies has been long – longer than most expected – an arduous....
