Blogs Archives - Page 51 of 81

3D In Context View all

Onshoring Advanced Packaging Update

Apr 08, 2025 · By Dean Freeman · 3D In Context

Rarely a week goes by without Jensen Huang, the CEO of Nvidia, being in the news. In late March, during Nvidia’s GTC developers conference, Huang was in the news daily as he updated the world on how Nvidia was addressing hardware and software needs for AI, as well as starting...

Artificial Intelligence is Driving Panel Level Packaging

Mar 11, 2025 · By Dean Freeman · 3D In Context

An Intel engineer holds a test glass core substrate panel at Intel’s Assembly and Test Technology Development factories in Chandler, Arizona, in July 2023. Intel’s advanced packaging technologies come to life at the company’s Assembly and Test Technology Development factories. (Credit: Intel Corporation) TSMC has announced a roadmap to 9...

Meeting Sustainability Goals Hits Political and Technical Headwinds

Feb 26, 2025 · By Dean Freeman · 3D In Context

Sustainability goals and efforts are starting to hit some headwinds in the world. In the United States the Trump administration has yet again pulled out of the Paris agreement, and has a campaign promise of “Drill baby, drill!”. However, the United States is not alone in the challenges of keeping...

Heterogenous Integration at ISS: A Key Part of High-Performance Compute

Feb 11, 2025 · By Dean Freeman · 3D In Context

Heterogenous integration and AI are currently moving forward hand-in-hand as the demand for greater computing power in theory, reduces the energy and time needed to train models; (although, DeepSeek may now change some of the thinking along these lines). Larger more complex packages are being built to manage the learning...

Francoise in 3D View all

Arizona: The Epicenter of Semiconductor Resurgence

May 05, 2025 · By Francoise von Trapp · Blogs

Whether we start calling it Chip Canyon, the Silicon Zone, or Silicon Diyógí (say Dare-yo-ghee), it looks like Arizona is on track for becoming the epicenter of semiconductor resurgence, not just in the U.S. but in all of North America. And we have the collective visions of Governor Katie Hobbs,...

A Tribute to Paul Werbaneth: Friend and Colleague

Mar 26, 2025 · By Francoise von Trapp · Blogs

Earlier this month, in the middle of the IMAPS Device Packaging Conference Welcome Reception, I got an upsetting text from a fellow SemiSister, Jane Evans-Ryan, founder and principal of Genuity PR, telling me that she had just learned of Paul Werbaneth’s unexpected death on February 7. 2025 at his home...

IMAPS Microelectronics Foundation IMAPS Device Packaging 2025

Will the CHIPS ACT Be “DOGE’d?” And Other Musing from IMAPS Device Packaging 2025

Mar 10, 2025 · By Francoise von Trapp · Blogs

There was a lot to be enthusiastic about at IMAPS Device Packaging 2025 (DPC2025). We presented the 2025 3D InCites Awards to eight deserving winners. We donated $70K to the IMAPS Microelectronics Foundation to establish a college fund for women and under-represented minorities seeking a career in microelectronics. Now in...

Announcing the Winners of the 2025 3D InCites Awards

Feb 04, 2025 · By Francoise von Trapp · Blogs

As advanced interconnect and advanced packaging processes take the helm to drive advancements in next generation semiconductor devices, innovation and collaboration across the microelectronics supply chain becomes more important than ever. So, when the 3D InCites Member Advisory Board reviewed this year’s finalists for the 2025 3D InCites Technology Enablement...

From Different Dimensions View all

What is Agentic AI and What Role Can it Play in (Semiconductor) Logistics?

May 06, 2025 · By Stefan Paul · Blogs

Editor’s note: Stefan Paul, CEO of Kuehne+Nagel attended the 2025 World Economic Forum in Davos in January with a focus on emergin technologies. In this blog post, he shares how the company is implementing agentic AI into their digital capabilities to stay on the leading edge of logistics. While his...

April Member News: A More Connected and Sustainable Future

May 01, 2025 · By Camden McCrea · Blogs

April 2025 marked a dynamic month for the semiconductor industry, with major developments across technology, sustainability, and global collaboration. Companies announced new partnerships, facility expansions, product innovations, and industry recognitions, reflecting strong momentum and strategic growth. From keynotes at international conferences to advancements in manufacturing and packaging, the month underscored...

Sustainability 101: Recommitting to the UN SDGs

Apr 16, 2025 · By Julia Freer · Blogs

Last month’s announcement that the United States “rejects and denounces the 2030 Agenda for Sustainable Development and the Sustainable Development Goals” is consistent with the current administration’s isolationist policies. They don’t want to invest any time or money in helping people in other countries, nor do they support the rights...

Innovation Without Borders: Key Takeaways from ISS Europe 2025

Mar 31, 2025 · By Camden McCrea · Blogs

Semiconductors have the power to drive technological breakthroughs and fuel geopolitical tensions. As we stand on the precipice of change, the path we choose will define the industry’s future. I recently attended the Industry Strategy Symposium Europe (ISS Europe 2025) in Sopot Poland, hosted by SEMI. This experience gave me...

Interconnectology 101 View all

Mitigating Semiconductor Supply Chain Risks in an Unpredictable World

Apr 21, 2025 · By Jillian McNichol · Interconnectology 101

Without a global supply chain, many of the microelectronics industry’s innovations wouldn’t have come to fruition. Although we often talk about the technical aspects of the advanced packaging industry at 3D InCites, at the end of the day, we need access to equipment to create the packages of the future....

An Update on AI Development From IMAPS DPC 2025

Mar 17, 2025 · By Jillian McNichol · Interconnectology 101

This year’s IMAPS Device Packaging Conference (DPC) had much to say about AI. As the industry’s golden child, it’s well-known that AI is driving many of the innovations we’re seeing in the advanced packaging space. In my opinion, the biggest takeaway from the event was how AI is creating a...

The Role of AI-Powered 3D X-Rays for Advanced Packaging Test Applications

Feb 18, 2025 · By Jillian McNichol · Interconnectology 101

Semiconductors power AI, AI powers semiconductor manufacturing, and the cycle continues indefinitely. But one area where AI is making a particularly noteworthy contribution is for the test phase of advanced packaging. With advancements in AI, manufacturers can find and address defects within their processes faster than ever, allowing them to...

Navigating the Shortage of Semiconductor Engineers: Tips from the Experts

Jan 29, 2025 · By Jillian McNichol · Interconnectology 101

You may have heard that for the semiconductor industry to reach $1 trillion, it needs around one million new workers globally. This includes entry level talent, technicians, supporting roles like accounting and human resources, and of course, semiconductor engineers. As it stands, no single industry has ever reached $1 trillion...

Packaging IFTLE View all

IFTLE 626: Rumors Swirl about Intel and TSMC; Update on Panel Level Processing (PLP)

Apr 29, 2025 · By Phil Garrou · Blogs

Is TSMC Acquiring 20% of Intel fabs? Reports are that Intel and TSMC have reached a preliminary agreement to form a joint venture that will operate Intel’s manufacturing facilities. TSMC will hold a 20% stake in the new company. The news comes from Reuters, which cites a report from “The...

An aerial view from February 2024 shows construction progress at Intel's Ohio One campus of nearly 1,000 acres in Licking County, Ohio. Intel announced plans in January 2022, to invest more than $20 billion in the construction of two new leading-edge chip factories in Ohio. The company broke ground in September 2022. The investment will serve the needs of Intel Foundry customers as part of the company’s IDM 2.0 strategy. (Credit: Intel Corporation)

IFTLE 625: If Intel Ohio is on Hold – Do They Still Get CHIPS Act Funds?

Apr 22, 2025 · By Phil Garrou · Blogs

An aerial view from February 2024 shows construction progress at Intel’s Ohio One campus of nearly 1,000 acres in Licking County, Ohio. Intel announced plans in January 2022, to invest more than $20 billion in the construction of two new leading-edge chip factories in Ohio. The company broke ground in...

IFTLE 624: TSMC widens lead on Samsung, Leads in 2nm Chip Production

Apr 07, 2025 · By Phil Garrou · Blogs

TSMC widens edge over Samsung The Taipai Times recently offered the following interesting discussion concerning the TSMC versus Samsung rivalry: “As US semiconductor giant Intel Corp. has faced continuous delays developing its advanced processes, the world’s two major wafer foundries, TSMC and Samsung, have overtaken it and become the main...

IFTLE 623: TSMC Advanced Packaging Coming to the U.S.A.

Apr 01, 2025 · By Phil Garrou · Blogs

TSMC Invests Further in Arizona Taiwan Semiconductor Manufacturing Corporation (TSMC) plans to make a $100B investment in the United States that involves building five additional chip facilities there in coming years. TSMC said the expansion plans included three new chip fabrication plants, two advanced packaging facilities and a major research...

Blogs

TSMC 2025 Technology Symposium: A Commitment to Customers

The Possibilities and Challenges of E-waste Recycling

IFTLE 627: Amkor Studying Hybrid Panel Level Technology