Blogs Archives - Page 51 of 76

3D In Context View all

Sustainability is Busting Out all Over!

Jun 19, 2024 · By Dean Freeman · 3D In Context

When prepping for this month’s sustainability blog, the song, June is Busting Out All Over, from Rogers and Hammerstein’s Carousel, kept running through my head; possibly as it’s in May, June, and July, when the majority of companies sustainability reports are released. Once the reports are released, the sustainability experts...

Semiconductor Industry Collaboration is the Key

Jun 09, 2024 · By Dean Freeman · 3D In Context

40 years ago in 1984, the semiconductor industry was in one of its many transitions. The USA had lost its leadership role in memory and companies were starting to transition out of the DRAM business. Logic chips were gaining in importance as the personal computing business was a few years...

Will AI be Powered by Renewables? Maybe, But Not for Long

May 20, 2024 · By Dean Freeman · 3D In Context

Earth Day has passed. Companies’ ESP/social responsibility reports are beginning to appear and they have been commenting on their progress in their Q1 earnings report. The early data in the semiconductor and microelectronics segment looks encouraging. The percentage of renewables in their energy portfolio is increasing. Water conservation and water-positive...

How Advanced Lithography Evolution Will Impact 3D Packaging

May 14, 2024 · By Dean Freeman · 3D In Context

In 1987, the lithography team I worked with returned from SPIE and presented our findings from the conference. Ultra-violet (UV) lithography was just crossing the 1µm line widths, and the industry was looking for what might be next to replace it. At that time, e-beam lithography was still in contention...

Francoise in 3D View all

ECTC 2024: Advanced Packaging Engineers to the Rescue!

Jun 01, 2024 · By Francoise von Trapp · Blogs

If you were one of the almost 2000 attendees at ECTC 2024, held May 28-31 2024, in Denver, Co, then you must be feeling very important right now; especially if you’re an advanced packaging engineer. Whether you’re improving energy efficiency, increasing yield, delivering innovative process control solutions, designing next-generation advanced...

The Nexus of Innovation for U.S. Semiconductor Manufacturing

May 07, 2024 · By Francoise von Trapp · Blogs

Will Arizona be the nexus of innovation for U.S. semiconductor manufacturing? It certainly looks that way. The speakers and panelists who presented at SEMI’s Arizona Breakfast Forum on May 1, confirmed what those of us who live and work here already know: The sun isn’t the only thing heating up...

IMAPS DPC 2024 Makes Advanced Packaging Fun Again!

Mar 26, 2024 · By Francoise von Trapp · Blogs

At last week’s International Microelectronics and Packaging Society’s Device Packaging Conference, (IMAPS DPC 2024) we didn’t need TrendForce to tell us that advanced packaging is the hottest technology in the semiconductor industry. We just needed to look at the record attendance of more than 700 advanced packaging enthusiasts who turned...

ISS Europe 2024: Succeeding in an Evolving Global Semiconductor Landscape

Mar 11, 2024 · By Francoise von Trapp · Blogs

When I interview members for the 3D InCites Podcast at industry events, I often ask them, “What did you come here to learn?” As this is my first time at ISS Europe, I asked myself that question. Here’s what I came up with. I attended ISS Europe 2024 to learn...

From Different Dimensions View all

Sustainability 101: Employee Action Groups for Sustainability

Jul 10, 2024 · By Julia Freer Goldstein · Blogs

Lofty sustainability goals like becoming carbon neutral by a specific date or committing to science-based targets for greenhouse gas emissions sound good. Making them public can spur progress at your company and with suppliers and customers. However, these goals can also feel overwhelming or too distant to tackle. Employees need...

Generative AI Needs Advanced Packaging Solutions

Jul 07, 2024 · By YES · Blogs

The adoption of Generative AI is growing every day. Apple is the latest to announce the use of Generative AI in its Siri App. With this rapid growth of the use of AI in our day-to-day life, comes the need to train the models behind these tools. This requires a...

June Member News Highlights Semiconductor Design Tools, Collaborations, and More

Jun 26, 2024 · By Avery Gerber · Blogs

This June, we’ve seen exciting strides in AI for semiconductor design, showcasing how AI and Digital Twin technologies are revolutionizing chip design and manufacturing. New software tools are boosting design and verification, and our members are driving innovation through key collaborations and contributions. From product development to workforce initiatives that...

Sustainability 101: PFAS-Free Filters

Jun 12, 2024 · By Julia Freer Goldstein · Blogs

Fluoropolymers are excellent materials for filters. Polytetrafluoroethylene (PTFE), the same polymer used in Teflon coatings, is inert, stable, hydrophobic, and durable, making it an ideal filtration media. Except for one potential problem. PTFE is a member of the PFAS (per- and polyfluoroalkyl substances) class. Even though PTFE no longer contains...

Packaging IFTLE View all

IFTLE 598: NSTC Update

Jul 02, 2024 · By Phil Garrou · Blogs

In February 2024, CHIPS announced that $5B would be spent in the National Semiconductor Technology Center (NSTC) to drive innovation in the United States. As a public-private consortium, NSTC members will have access to an investment fund, facilities, partners, and additional funding opportunities to research, test, and scale up semiconductor...

IFTLE 597: Samsung Glass Substrates; Samsung SAINT

Jun 24, 2024 · By Phil Garrou · Blogs

Samsung Announced Glass Substrates Effort Samsung Group’s electronics subsidiaries have announced a joint research and development effort between Samsung Electro-Mechanics and the group’s major electronics affiliates, including Samsung Electronics and Samsung Display to accelerate the commercialization of glass substrates to commercialize faster than semiconductor rival Intel in the U.S. Samsung...

IFTLE 596: Advanced Packaging Reshaping the Chip Ecosystem

Jun 17, 2024 · By Phil Garrou · Blogs

The Boston Consultant Group (BCG) recently took a look at the impact that advanced packaging is having on the microelectronics chip ecosystem. Let’s take a look at some of the points that they make. Advanced packaging is replacing simple “scaling”, which had been the traditional way to achieve advancements in...

IFTLE 595: Updates On U.S. Chips Funding Awards

Jun 05, 2024 · By Phil Garrou · Blogs

We’ve been following several stories on U.S. base expansion stories made possible by U.S. Chips Funding Awards. Here is an update on three of them. NHanced Terminates Bloomington IND Expansion Plans We recently discussed NHanced Semiconductors‘ plans for expansion in Morrisville NC, Bloomington IND and Odon IND. This past week...

SemiSisters View all

Wear A Dress To Work and Other Ways to Foster Gender Gap Allyship

Nov 09, 2023 · By Francoise von Trapp · Blogs

I have attended my share of DEI and allyship-focused events in the past few years attended by both women and men. In fact, I have moderated a few and recorded several for the 3D InCites podcast. But this was my first SEMI Women in Semiconductors (SEMI WIS) event, and it...

Why Men Should Attend Women-Focused Events like Women in Semiconductors

Sep 25, 2023 · By Margaret Kindling · Blogs

In a recent LinkedIn post about The Barbie Movie, former Women in Semiconductors (WiS) committee co-chair Garima Gautam wrote that “every year there are multiple industry conferences that have topics like gender bias, women in the workplace and women in the semiconductor industry. We have struggled to get the other half of our workforce...

Hiring and Retaining a Diverse Workforce

May 31, 2023 · By DECA · Blogs

The CHIPS and Science Act aims to bring semiconductor research & development and manufacturing back to U.S. soil. Not only will this make the U.S. less reliant on the international supply chain, but it is estimated that this investment in onshore semiconductor and research facilities will create over half a...

SEMI Foundation WIS Event Focuses on Bridging the Gender Gap Through Allyship

May 03, 2023 · By Emerald Greig · Blogs

I attended my first SEMI Foundation-organized Women in Semiconductors (WIS) event on May 1st. It was held in conjunction with the Advanced Semiconductor Manufacturing Conference (ASMC) in Saratoga Springs, NY. I really didn’t know what to expect but I know I wasn’t expecting standing-room-only with 200 people attending. The other...

Blogs

IFTLE 599: Prismark’s 30-Year Perspective of the Electronics Industry

AI and VLSI

SEMICON West 2024: Riding the Generative AI Winds of Change

3D In Context View all

Francoise in 3D View all

From Different Dimensions View all

Packaging IFTLE View all

SemiSisters View all

Latest Posts - Page 51