IFTLE 599: Prismark’s 30-Year Perspective of the Electronics Industry
Jul 17, 2024 · By Phil Garrou · Blogs, Packaging IFTLE
Latest Posts - Page 42
IMAPS DPC 2017 Covers Range of High-tech Topics, Including EDA
The WeKoPa Resort near Phoenix was the venue for the latest IC packaging focused conference, IMAPS DPC 2017, which took...
The Advanced Packaging Times, they are A-Changing…or Are They?
It’s been a nearly a month since the 2017 IMAPS Device Packaging Conference and Global Business Council, so I’ve had...
MEMS Ascendant at IMAPS Device Packaging 2017
Semiconductor device fabrication and packaging is rife with acronyms, and by my estimate, the Top 3 trafficked by speakers at...
Highlights of the 23rd TSMC Symposium
On March 15, 2017, TSMC held its 23rd Symposium, based on popular request, at the Santa Clara Convention Center. I...
Executive Viewpoint: Next-Gen Drone Technologies Rely on Semiconductor Innovation
Robotics and drone technologies are one of the fastest growing end-use markets for integrated sensor technology today. According to a...
Dev Gupta Disrupts the Fan-out Panel at IMAPS DPC, You Won’t Believe What Else Happened!
Here we go again! One thing is for sure, there is never a dull moment at the IMAPS Device Packaging...
The FAST route to the Top of the TSV Mountain
. While on a recent visit to UnitySC in Grenoble, France, I spent some time visiting with a semiconductor process...
What’s in Store For You at IMAPS DPC 2017
Just under a week away, the agenda for the 2017 IMAPS Device Packaging Conference and co-located Global Business Council is...
Finding The Next Switch for Semiconductor Scaling
The data traffic explosion, fueled by the Internet of Things (IoT), social media and server applications, has created a need...
Panel Level Packaging: One Size Fits All?
There is an active and robust supply chain currently supporting these wafer sizes in the semiconductor manufacturing industry: 3”; 4”;...
Using 3D Integration to Get the Heat Out
Thermal management is one of the last vestiges of 3D integration challenges. As such, the European 3D Summit (Jan 23-25,...
Highlights from the 2017 European 3D Summit
The 5th Annual European 3D Summit drew 220 attendees from 18 countries who gathered to understand the latest advanced packaging,...
Process Control Gains Importance in Advanced Packaging Applications
2016 will be remembered as the year fan-out wafer level packaging (FOWLP) went mainstream, thanks to TSMC’s strategic move in...
The Edge of 3D: 3D SoC VLSI and Si Photonics
Last week, I posted an executive summary of this year’s European 3D Summit, touching on the highlights and general takeaways...
Welcome to a New Era of Predictive Yield Process Control for Advanced Packaging
In April 2016, Fogale Nanotech Group acquired the assets of Altatech Semiconductor from Soitec in order to combine the metrology...
Silicon Patents: Repeating the Past
“Those who cannot remember the past are condemned to repeat it” ~ George Santayana Over the past forty years, the presence of legally protected Intellectual...
2017 European 3D Summit: Making Advanced Packaging Great Again
Every year, I attend most of the events that are focused on 3D integration and related approaches to semiconductor advanced...
Addressing Advanced Packaging Challenges in 2017 and Beyond
As the two-dimensional (2D) shrinking of planar circuits (on which Gordon Moore based his famous observation) has become more difficult...
Outlook 2017: Advanced Packaging Technology Takes Center Stage
The era of “More than Moore” was alive and well in 2016 as the semiconductor industry witnessed many new developments...
