Blogs Archives - Page 4 of 80

3D In Context View all

Meeting Sustainability Goals Hits Political and Technical Headwinds

Feb 26, 2025 · By Dean Freeman · 3D In Context

Sustainability goals and efforts are starting to hit some headwinds in the world. In the United States the Trump administration has yet again pulled out of the Paris agreement, and has a campaign promise of “Drill baby, drill!”. However, the United States is not alone in the challenges of keeping...

Heterogenous Integration at ISS: A Key Part of High-Performance Compute

Feb 11, 2025 · By Dean Freeman · 3D In Context

Heterogenous integration and AI are currently moving forward hand-in-hand as the demand for greater computing power in theory, reduces the energy and time needed to train models; (although, DeepSeek may now change some of the thinking along these lines). Larger more complex packages are being built to manage the learning...

Asia May Still Be the Hottest Spot for Advanced Packaging

Jan 27, 2025 · By Dean Freeman · 3D In Context

When the United States and Europe looked to re-shore semiconductor technology, the primary focus was restoring leading-edge manufacturing and creating more resilient supply chains throughout the ecosystem. Eventually, it emerged that nearly all of the leading-edge advanced packaging took place in Asia, and there was minimal packaging capability in either...

SEMI ISS 2025: Ready, Set, Ramp!

Jan 22, 2025 · By Dean Freeman · 3D In Context

The semiconductor industry has been discussing breaching the 1 trillion-dollar mark as it was coming out of COVID-19 and amid a boom year in 2022. The slowdown in 2023 had some resetting the dates for when the industry would crest the 1 trillion mark. The AI boom of 2024 has...

Francoise in 3D View all

Announcing the Winners of the 2025 3D InCites Awards

Feb 04, 2025 · By Francoise von Trapp · Blogs

As advanced interconnect and advanced packaging processes take the helm to drive advancements in next generation semiconductor devices, innovation and collaboration across the microelectronics supply chain becomes more important than ever. So, when the 3D InCites Member Advisory Board reviewed this year’s finalists for the 2025 3D InCites Technology Enablement...

Interconnectology Saves the World!

Jan 08, 2025 · By Francoise von Trapp · Blogs

In 2007, when I was managing editor at the now defunct Advanced Packaging Magazine, we went out on a limb in our January Industry Forecast to declare, as our cover story: Advanced Packaging Saves the World! In 2008, we tempered that declaration to Advanced Packaging Drives the Industry! By 2009,...

The 3D InCites Podcast Backtrack – 2024 in Review

Dec 18, 2024 · By Francoise von Trapp · Blogs

Buzzsprout, the platform where the 3D InCites podcast lives, does a cool thing at the end of the year. It provides the podcast backtrack – a recap of your stats, including the top performing episodes. So we thought we’d share it with you, our listeners and sponsors, to give you...

Catching Up on The Latest in Advanced Packaging at SEMICON Europa 2024

Dec 03, 2024 · By Francoise von Trapp · Blogs

Now that imec’s Luc Van den hove declared advanced packaging is key to the advancement of semiconductors, everyone in the industry needs to catch up to those who have been following the course of these technologies while they were in development. The Advanced Packaging Conference (APC) at SEMICON Europa 2024...

From Different Dimensions View all

Figure 1: Henkel team networking in the Henkel hospitality suite at Industry Trade Shows - SEMICON Taiwan, 2024.

Industry Trade Shows and Conferences Strengthen Partnerships and Influence Product Innovation

Mar 03, 2025 · By Ramachandran Trichur · Blogs

Conferences and industry trade shows have been the cornerstone of professional networking and educational advancement for as long as I can remember. More than 20 years ago, I attended my first semiconductor event, the Solid State Sensors & Actuators Conference (called Hilton Head 2002), and have been participating ever since....

February Member News: Expansion, Collaborations, and Events Galore

Feb 27, 2025 · By Camden McCrea · Blogs

February member news shows dynamic activity for semiconductor industry, with exciting advancements in technology, strategic expansions, key industry events, and notable leadership updates. From breakthrough product launches and major acquisitions to industry collaborations, here’s a look at what our members achieved this month. Technology Innovation and Product Developments Nordson Electronics...

Bridging the Semiconductor Talent Gap – The Role of the European Chips Act and Beyond

Feb 24, 2025 · By Isabella Drolz · Blogs

The European Chips Act (ECA) is pivotal to Europe’s strategy for technological sovereignty, aiming to strengthen the continent’s semiconductor supply chain and foster innovation. However, a key obstacle remains: the projected shortfall of 350,000 semiconductor professionals by 2030. Addressing this semiconductor talent gap is critical for the ECA’s success and...

What You Need to Know About PFAS

Feb 19, 2025 · By Julia Freer · Blogs

You have probably heard about health and environmental concerns related to per- or polyfluoroalkyl substances (PFAS). Companies are being pressured to replace PFAS with safer alternatives for nonstick coatings, water-resistant fabrics, firefighting foams, and more to meet upcoming restrictions. For manufacturers, including those in the semiconductor industry, PFAS replacement is...

Interconnectology 101 View all

The Role of AI-Powered 3D X-Rays for Advanced Packaging Test Applications

Feb 18, 2025 · By Jillian McNichol · Interconnectology 101

Semiconductors power AI, AI powers semiconductor manufacturing, and the cycle continues indefinitely. But one area where AI is making a particularly noteworthy contribution is for the test phase of advanced packaging. With advancements in AI, manufacturers can find and address defects within their processes faster than ever, allowing them to...

Navigating the Shortage of Semiconductor Engineers: Tips from the Experts

Jan 29, 2025 · By Jillian McNichol · Interconnectology 101

You may have heard that for the semiconductor industry to reach $1 trillion, it needs around one million new workers globally. This includes entry level talent, technicians, supporting roles like accounting and human resources, and of course, semiconductor engineers. As it stands, no single industry has ever reached $1 trillion...

How Arizona is Growing its Advanced Packaging Capabilities

Jan 20, 2025 · By Jillian McNichol · Blogs

An inside look at how ASU, local governments, and private sector companies are working together to make Arizona a hub for advanced packaging innovation. The year 2022 was monumental for the semiconductor industry. That year, the Biden-Harris administration committed to making the U.S. a world leader in semiconductor manufacturing by...

It’s Time to Put AI’s Growth Into Perspective

Dec 16, 2024 · By Jillian McNichol · Interconnectology 101

These days, it seems like artificial intelligence (AI) is taking over the world. In the last two years alone, we’ve seen the rise of ChatGPT, autonomous vehicles, Google Gemini, deep fakes, and my least favorite – soulless AI art. With so many new applications coming into focus, it can feel...

Packaging IFTLE View all

IFTLE 620: Micross Acquires Integra; Hynix HBM booked through 2025

Feb 25, 2025 · By Phil Garrou · Blogs

Micross, a portfolio company of Behrman Capital, announced on January 15, that it has acquired Integra Technologies, headquartered in Wichita, KS. Since both are privately owned, the exact amount that Micross paid to acquire Integra Technologies hasn’t been publicly disclosed in the available sources. Micross Components makes microelectronic components for...

CHIP Flagship Facilities -Researchers work inside the clean room area at the MacroTechnology Works facility in the ASU Research Park in Tempe, Arizona. Photo by Deanna Dent/Arizona State University

IFTLE 619: CHIP Flagship Facilities include Albany NY, Sunnyvale CA and Tempe AZ

Feb 12, 2025 · By Phil Garrou · Blogs

CHIPS for America has announced three anticipated CHIPS for America research and development (R&D) flagship facilities. These state-of-the-art CHIP flagship facilities will establish world-class advanced semiconductor R&D in the United States. “They will address critical gaps in the current ecosystem, offering unparalleled value to a diverse array of stakeholders across...

IFTLE 618: UCIe Standard vs. UCIe Advanced vs. UCIe 3

Jan 28, 2025 · By Phil Garrou · Blogs

Multi-die systems are driving the need for standardized die-to-die interconnects. Several industry alliances have come together to define such standards: Optical Interface Forum (OIF) – The XSR and USR physical layer specifications optimized for die-to-die connectivity Chips Alliance – The AIB specification which was originally introduced by Intel Open Compute...

IFTLE 617: SK Hynix considers 2.5D packaging business with Amkor

Jan 15, 2025 · By Phil Garrou · Blogs

Will TSMC, SK Hynix, and Amkor be an Onshore Source for Nvidia? SK Hynix learned to package its own stacked dynamic random access memories (DRAMs) for high bandwidth memory (HBM) components. According to reports, the company is now considering entering the OSAT market by way of a strategic partnership with...