Blogs Archives - Page 3 of 79

3D In Context View all

Semiconductor Industry Forecast: Looking Forward to Balanced Growth in 2025

Dec 10, 2024 · By Dean Freeman · 3D In Context

As the semiconductor industry moves into the last month of 2024, industry pundits are looking back and then looking forward to seeing what they missed in 2024 and preparing their assumptions for 2025. This post looks at what they are predicting to bring you the 3D InCites Semiconductor Industry Forecast....

Nuclear is Out. How Do We Solve the High Tech Sustainability Problem?

Nov 20, 2024 · By Dean Freeman · 3D In Context

The past 2 weeks have been a whirlwind of activity in high tech sustainability. We’ve moved from using nuclear power for data centers to only some nuclear power for data centers. A change of administration where support for renewables and sustainability will not be as strong as under the previous...

Installation of High NA EUV at Intel - Source Intel

The Funds Keep on Rolling for CHIPS for America R&D

Nov 12, 2024 · By Dean Freeman · 3D In Context

The CHIPS Act continues to issue grants to help advance the United States position in semiconductor and advanced technology. Two CHIPS for America R&D facilities were announced in late October and early November. First announced was an $825 million dollar grant to Albany Nanotech in upstate New York to develop...

Johnstown, PA, USA - June 12, 2008: Mixed coal and nuclear power plant in Appalachian wilderness under light blue sky. Chimneys and cool towers spew white vapor clouds. Green foliage up front.

My How the Pendulum Swings

Oct 21, 2024 · By Dean Freeman · 3D In Context

Why the AI Energy Crisis is Driving Us back to Coal and Nuclear Energy When I was an undergrad in Eastern Washington, my Physics professor and Geology professor, both had strong links to energy companies. With a strong coal industry in the region and the Hanford Nuclear facilities within field-trip...

Francoise in 3D View all

Catching Up on The Latest in Advanced Packaging at SEMICON Europa 2024

Dec 03, 2024 · By Francoise von Trapp · Blogs

Now that imec’s Luc Van den hove declared advanced packaging is key to the advancement of semiconductors, everyone in the industry needs to catch up to those who have been following the course of these technologies while they were in development. The Advanced Packaging Conference (APC) at SEMICON Europa 2024...

Making Connections at SEMICON Europa 2024

Nov 18, 2024 · By Francoise von Trapp · Blogs

Let’s be honest. When we get home from a trade show like SEMICON Europa 2024, it’s not all the presentations that we remember. It’s the connections we’ve made – new and old – with industry colleagues around the globe that stand out. You can go to any SEMICON Event around...

Picking up the Pace of Panel-level Advanced Packaging at Onto Innovation

Nov 07, 2024 · By Francoise von Trapp · Blogs

How A Collaborative Partnership Is Accelerating PLP Innovation Panel-level advanced packaging technologies have been in development for more than a decade. They began as a way to reduce costs and improve yields for fan-out wafer-level applications. Smartphone applications – particularly fingerprint sensors – promised the volumes that would make the...

Leaning Into Interconnectology – Musings from IMAPS Symposium 2024

Oct 08, 2024 · By Francoise von Trapp · Blogs

Call me crazy, but after spending three days at the 2024 International Microelectronics and Packaging Society (IMAPS) Symposium in Boston learning about the latest industry trends and technology advancements, I think it’s time for the entire advanced packaging world to fully adopt the concepts of “Interconnectology” and “Interconnectologist”. The inspiration...

From Different Dimensions View all

Sustainability 101: How Green is Your Electricity?

Dec 11, 2024 · By Julia Freer Goldstein · Blogs

Where does the energy come from to power your facilities? Even if your company claims to be 100% renewable energy, you might be surprised to learn that much of your power comes from natural gas or even coal. Keep reading to understand this paradox. Renewable Energy Certificates Just as there...

November 3D InCites Member News: Advancements and Milestones

Nov 27, 2024 · By Avery Gerber · Blogs

This month has been full of exciting advancements and milestones for our members. From cutting-edge technological breakthroughs and prestigious award recognitions to innovative partnerships, impactful collaborations, and significant company developments, our members continue to make remarkable strides in their fields. Here’s a closer look at the highlights and achievements they’ve...

Sustainability 101: Let’s Talk Supply Chain

Nov 13, 2024 · By Julia Freer Goldstein · Blogs

My blog post for November is about supply chains and sustainability. I’ll get to that, but first, I want to get a bit personal. I opened LinkedIn at 6 am Pacific time on November 6 and saw multiple posts from contacts around the world saying, “America, what have you done?”...

The Evolution of Interconnects in Microelectronics Packaging

Nov 11, 2024 · By Dr. Dongkai Shangguan · Blogs

Semiconductor packaging is a complex and evolving field, involving multiple disciplines. As a microelectronics packaging engineer, I focus on the “interconnect thread” from the chip to the system (Figure 1). To me, packaging is about interconnectivity (essentially). The primary function of packaging is to provide the interconnection from the IC...

Interconnectology 101 View all

What to Know Before Buying an IMAPS Academy Course

Nov 04, 2024 · By Jillian Carapella · Interconnectology 101

If you’re new to the advanced packaging industry, it may have crossed your mind to invest in a professional development course. IMAPS, or the International Microelectronics Assembly and Packaging Society, offers exactly that. Their packaging-specific, IMAPS Academy courses are aimed at promoting a stronger understanding of key parts of the...

What Are Glass Core Substrates?

Oct 01, 2024 · By Jillian Carapella · Interconnectology 101

You may be familiar with organic substrates, but as of recently, glass core substrates have been gaining traction in the world of semiconductor manufacturing. Glass core substrates are emerging as a possible solution for achieving the interconnect density needed to power applications like artificial intelligence (AI) and high-performance computing (HPC)....

Chiplet integration and adhesive solutions

The Basics of Chiplet Integration and Importance of Adhesive Solutions

Sep 03, 2024 · By Jillian Carapella · Interconnectology 101

What You Need to Know as an Industry Newcomer If you’re a regular reader of 3D InCites, you’ve probably seen the word “chiplets” before, but you may not know what they are. To put it simply, chiplets are small “chips” that perform singular functions really well, but they can’t perform...

Interconnectology 101: Before Switching to PVD, Consider Liquid Metal Ink

Jul 23, 2024 · By Jillian Carapella · Blogs

You may have heard of the company, Averatek. Founded in 2009 out of the Stanford Research Institute, it developed and licensed chemistries and advanced interconnect technologies for electronics. Although the company specialized in printed circuit boards (PCBs), Averatek’s new leadership saw an opportunity to apply its technology to advanced packaging....

Packaging IFTLE View all

IFTLE 614: What’s in Store for Intel’s Future? Update on NAPMP Proposers Day

Dec 11, 2024 · By Phil Garrou · Blogs

Intel Reaches The Fork in the Road Digitimes had some interesting recent opinions about the future of Intel. Let’s take a look. With Intel struggling to make its foundry business profitable, Digitimes questions whether Intel should consider abandoning its IDM model and separate its product design and manufacturing divisions. The...

IFTLE 613: Solder Joint Reliability of Glass Core Substrate Assemblies

Nov 26, 2024 · By Phil Garrou · Blogs

We have seen considerable global activity focused on developing glass core substrate assemblies and interposers, yet, as some of us have often mentioned, we have seen little in the way of reliability data for any modules built from these substrates. IFTLE considers the work of Absolics (the US division of...

IFTLE 612: Congratulations to the IMAPS 2024 Society Award Winners

Nov 25, 2024 · By Phil Garrou · Blogs

Figure 1 shows a listing of the 2024 IMAPS Society Award winners and the feature photo above are some of the winners who attended the the gala event at IMAPS Symposium 2024. They are, from left to right: Brandon Hamilton, BAE Systems; Casey Kraweic, StratEdge; Gary Hemphill, Retired; Phil Garrou,...

IFTLE 611: Amkor Clarifies Arizona Facility Activity

Nov 19, 2024 · By Phil Garrou · Blogs

Wolfspeed & Hemlock Semiconductor Get Their CHIPS Act Share Arizona Facility to Focus on High Performance Computing In IFTLE 577 we reported that Amkor had announced plans to build an advanced packaging and test facility in Peoria, Arizona. In IFTLE 603 we reported that Amkor Technology had signed a preliminary...