AI and VLSI
Jul 16, 2024 · By Dean Freeman · 3D In Context, Blogs
Latest Posts - Page 26
3D ICs Tear Down the Dreaded Memory Wall and Save Power
About 50 years ago, I started my career as a system-level designer, focused on an interface card for the Siemens...
How to Create a Vibrant Semiconductor Manufacturing Industry in the United States
Having spent the last 30 years working in semiconductor manufacturing, it is both exciting and unsettling to see renewed political...
IFTLE 455: Advanced Microelectronics is Coming Home
In IFTLE 441, (published in February before we were paying attention to the pandemic and the devastation to the world...
SEMICON China – An Exhibitor Perspective
After the cancellation of SEMICON Korea in January, not many were surprised to learn that SEMICON China would not take...
SEMICON China 2020 at a Glance
SEMICON China 2020, collocated with FPD China, was successfully held June 27-29, 2020. SEMICON China was the first big semiconductor...
VLSI 2020: 3D Continues to Dominate Advanced Semiconductor Technology
As a process geek, The Symposia on VLSI Technology and Circuits has long been one of my favorite conferences. The...
FCC-approved BLE and LoRa module includes Antenna in Package
In engineering school, I learned that different laws of physics apply when the widely used electricity with 50/60 Hertz gets...
IFTLE 454: TSMC Exhibits Packaging Prowess at Virtual ECTC 2020
I cannot say I enjoyed this year’s COVID 19 version of ECTC 2020, but I guess it was better than...
Social Distancing Spotlight: How KLA Keeps Looking Ahead
Over the past few years, we’ve seen KLA evolving from its origins as a process control company focused on front-end...
3D InCites’ Mural Project Raised $4000 For IMAPS Foundation
If you’ve attended the IMAPS Device Packaging Conference over the past three years, you probably noticed a hand-drawn mural coming...
IFTLE 453: No, This Ain’t Your Father’s Microelectronic Packaging
In a recent IMAPS webinar, John Park (Figure 1), product management director of Cadence Design Systems, gave a tutorial entitled...
An EDA Perspective on Today’s Advanced Packaging
In my alliance management roles at electronic design automation (EDA) companies, I arranged many presentations to convey the benefits of...
3D System Integration – It Takes a Village
Actually, 3D System integration takes more than a village. It takes a global effort. As Virtual ECTC 2020 continues this...
Industry Outlook: What Goes Down Must Come Up
The GDP is down, the stock market is up, unemployment, at least in the USA, is confused, so what is...
IFTLE 452: Samsung Foundry SRAM on Logic 3DIC
Samsung Foundry SAINT-S Samsung Foundry revealed their SAINT-S technology for SRAM on logic 3DIC, at the recent IMAPS Device Packaging Conference,...
Semiconductor Backend Processes: Additional SEMI Standards Related to GEM
Background In a few previous blogs, I shared how the relatively new SEMI Advanced Backend Factory Integration (ABFI) task force...
ECTC 2020 Online is Accessible at No Charge
When I switched my focus from single-die SoCs to multi-die ICs, I had to learn a lot about IC packaging...
Social Distancing Spotlight: ERS Celebrates 50 Years of Thermal Solutions
50 years of providing specialized thermal solutions to the semiconductor industry is a significant accomplishment. It means your company is...
ECTC 2020 Keynote: Moore’s Law 2.0 Brought to You by HIT
If TSMC’s Doug Yu wrote a rap song, the title would be “HIT IT!” He’s been on a roll lately,...
