Blogs Archives - Page 2 of 81

3D In Context View all

Onshoring Advanced Packaging Update

Apr 08, 2025 · By Dean Freeman · 3D In Context

Rarely a week goes by without Jensen Huang, the CEO of Nvidia, being in the news. In late March, during Nvidia’s GTC developers conference, Huang was in the news daily as he updated the world on how Nvidia was addressing hardware and software needs for AI, as well as starting...

Artificial Intelligence is Driving Panel Level Packaging

Mar 11, 2025 · By Dean Freeman · 3D In Context

An Intel engineer holds a test glass core substrate panel at Intel’s Assembly and Test Technology Development factories in Chandler, Arizona, in July 2023. Intel’s advanced packaging technologies come to life at the company’s Assembly and Test Technology Development factories. (Credit: Intel Corporation) TSMC has announced a roadmap to 9...

Meeting Sustainability Goals Hits Political and Technical Headwinds

Feb 26, 2025 · By Dean Freeman · 3D In Context

Sustainability goals and efforts are starting to hit some headwinds in the world. In the United States the Trump administration has yet again pulled out of the Paris agreement, and has a campaign promise of “Drill baby, drill!”. However, the United States is not alone in the challenges of keeping...

Heterogenous Integration at ISS: A Key Part of High-Performance Compute

Feb 11, 2025 · By Dean Freeman · 3D In Context

Heterogenous integration and AI are currently moving forward hand-in-hand as the demand for greater computing power in theory, reduces the energy and time needed to train models; (although, DeepSeek may now change some of the thinking along these lines). Larger more complex packages are being built to manage the learning...

Francoise in 3D View all

A Tribute to Paul Werbaneth: Friend and Colleague

Mar 26, 2025 · By Francoise von Trapp · Blogs

Earlier this month, in the middle of the IMAPS Device Packaging Conference Welcome Reception, I got an upsetting text from a fellow SemiSister, Jane Evans-Ryan, founder and principal of Genuity PR, telling me that she had just learned of Paul Werbaneth’s unexpected death on February 7. 2025 at his home...

IMAPS Microelectronics Foundation IMAPS Device Packaging 2025

Will the CHIPS ACT Be “DOGE’d?” And Other Musing from IMAPS Device Packaging 2025

Mar 10, 2025 · By Francoise von Trapp · Blogs

There was a lot to be enthusiastic about at IMAPS Device Packaging 2025 (DPC2025). We presented the 2025 3D InCites Awards to eight deserving winners. We donated $70K to the IMAPS Microelectronics Foundation to establish a college fund for women and under-represented minorities seeking a career in microelectronics. Now in...

Announcing the Winners of the 2025 3D InCites Awards

Feb 04, 2025 · By Francoise von Trapp · Blogs

As advanced interconnect and advanced packaging processes take the helm to drive advancements in next generation semiconductor devices, innovation and collaboration across the microelectronics supply chain becomes more important than ever. So, when the 3D InCites Member Advisory Board reviewed this year’s finalists for the 2025 3D InCites Technology Enablement...

Interconnectology Saves the World!

Jan 08, 2025 · By Francoise von Trapp · Blogs

In 2007, when I was managing editor at the now defunct Advanced Packaging Magazine, we went out on a limb in our January Industry Forecast to declare, as our cover story: Advanced Packaging Saves the World! In 2008, we tempered that declaration to Advanced Packaging Drives the Industry! By 2009,...

From Different Dimensions View all

Sustainability 101: Recommitting to the UN SDGs

Apr 16, 2025 · By Julia Freer · Blogs

Last month’s announcement that the United States “rejects and denounces the 2030 Agenda for Sustainable Development and the Sustainable Development Goals” is consistent with the current administration’s isolationist policies. They don’t want to invest any time or money in helping people in other countries, nor do they support the rights...

Innovation Without Borders: Key Takeaways from ISS Europe 2025

Mar 31, 2025 · By Camden McCrea · Blogs

Semiconductors have the power to drive technological breakthroughs and fuel geopolitical tensions. As we stand on the precipice of change, the path we choose will define the industry’s future. I recently attended the Industry Strategy Symposium Europe (ISS Europe 2025) in Sopot Poland, hosted by SEMI. This experience gave me...

March Member News: Shaping the Future of Technology

Mar 27, 2025 · By Camden McCrea · Blogs

In the month of March, the semiconductor industry saw significant advancements, strategic expansions, and key industry events shaping the future of technology. New innovations in microelectronics, packaging, and automotive systems highlighted the industry’s focus on efficiency and performance. Major acquisitions reinforced the growing emphasis on secure manufacturing and connectivity, while...

The Growing Importance of Advanced Packaging in Europe – Recap of ERS TechTalk

Mar 24, 2025 · By Sophia Oldeide · Blogs

Advanced packaging has emerged as a critical enabler of next-generation applications for artificial intelligence (AI), high-performance computing, wearables, 6G communication, and defense technologies. As traditional scaling approaches face increasing limitations, Advanced packaging enables further miniaturization and improved performance through heterogeneous integration, chip stacking, and high-density interconnects. In Europe, advanced packaging...

Interconnectology 101 View all

An Update on AI Development From IMAPS DPC 2025

Mar 17, 2025 · By Jillian McNichol · Interconnectology 101

This year’s IMAPS Device Packaging Conference (DPC) had much to say about AI. As the industry’s golden child, it’s well-known that AI is driving many of the innovations we’re seeing in the advanced packaging space. In my opinion, the biggest takeaway from the event was how AI is creating a...

The Role of AI-Powered 3D X-Rays for Advanced Packaging Test Applications

Feb 18, 2025 · By Jillian McNichol · Interconnectology 101

Semiconductors power AI, AI powers semiconductor manufacturing, and the cycle continues indefinitely. But one area where AI is making a particularly noteworthy contribution is for the test phase of advanced packaging. With advancements in AI, manufacturers can find and address defects within their processes faster than ever, allowing them to...

Navigating the Shortage of Semiconductor Engineers: Tips from the Experts

Jan 29, 2025 · By Jillian McNichol · Interconnectology 101

You may have heard that for the semiconductor industry to reach $1 trillion, it needs around one million new workers globally. This includes entry level talent, technicians, supporting roles like accounting and human resources, and of course, semiconductor engineers. As it stands, no single industry has ever reached $1 trillion...

How Arizona is Growing its Advanced Packaging Capabilities

Jan 20, 2025 · By Jillian McNichol · Blogs

An inside look at how ASU, local governments, and private sector companies are working together to make Arizona a hub for advanced packaging innovation. The year 2022 was monumental for the semiconductor industry. That year, the Biden-Harris administration committed to making the U.S. a world leader in semiconductor manufacturing by...

Packaging IFTLE View all

IFTLE 624: TSMC widens lead on Samsung, Leads in 2nm Chip Production

Apr 07, 2025 · By Phil Garrou · Blogs

TSMC widens edge over Samsung The Taipai Times recently offered the following interesting discussion concerning the TSMC versus Samsung rivalry: “As US semiconductor giant Intel Corp. has faced continuous delays developing its advanced processes, the world’s two major wafer foundries, TSMC and Samsung, have overtaken it and become the main...

IFTLE 623: TSMC Advanced Packaging Coming to the U.S.A.

Apr 01, 2025 · By Phil Garrou · Blogs

TSMC Invests Further in Arizona Taiwan Semiconductor Manufacturing Corporation (TSMC) plans to make a $100B investment in the United States that involves building five additional chip facilities there in coming years. TSMC said the expansion plans included three new chip fabrication plants, two advanced packaging facilities and a major research...

IFTLE 622: US Joint Consortium; Intel Rumors

Mar 18, 2025 · By Phil Garrou · Blogs

When I was first asked why I had not yet covered the “US Joint Consortium” I responded “tongue in cheek” that I would leave that for Cheech and Chong. However, with the recent announcement of 3M joining the consortium and my subsequent understanding of the involvement of my old friend,...

IFTLE 621: TSMC Chip and Package Activity in the U.S.

Mar 04, 2025 · By Phil Garrou · Blogs

Commercial Times reports that TSMC’s Arizona wafer fab, Fab 21 Phase 1, has officially entered mass production on its 4nm process. Monthly capacity is expected to reach 30,000 wafers by mid-year. Construction of Fab 21 Phase 2 and Phase 3 are set to proceed this year and next, with fab...