IFTLE 617: SK Hynix considers 2.5D packaging business with Amkor
Jan 15, 2025 · By Phil Garrou · Blogs, Packaging IFTLE
Latest Posts - Page 4
IFTLE 554: Are TMD Materials the Future of the Transistor?
In a recent report, Semianalysis examines the migration from planar to finFET to nanosheet to complementary FET to 2D transistor...
IFTLE 553: Samsung Foundry Update; Amkor/ GlobalFoundries Venture
Samsung Foundry Forum Moonsoo Kang, Head of Business Development at Samsung Foundry, at the 2022 Samsung Foundry Forum (SFF) explained...
IFTLE 552: CHIPS Industrial Advisory Council (IAC) Update
CHIPS Announces Details on Funding Opportunity Timing The Department of Commerce (DoC) has announced details regarding funding opportunities and application...
IFTLE 551: SK Hynix Advanced Packaging; Integra Expansion in Kansas
SK Hynix Advanced Packaging Ki-ill Moon, head of Packaging Technology Development at SK Hynix recently wrote an article for EE...
IFTLE 550: Government Agencies Supporting Advanced Packaging
IPC Expo – Defense Electronics Supplier Roundtable The 16th Defense Electronics Supplier Roundtable at the recent IPC APEX EXPO in...
IFTLE 549: Penn State CHIMES In
As IFTLE has been reporting for the past few months, monies continue to be poured into the onshore advanced packaging...
IFTLE 548: TSMC’s Off-Shore Production; STEAM PIPE
TSMC Off-shore Production Digitimes reports that when it comes to the production capacity of 28nm and below, TSMC has stated...
IFTLE 547: IBAS RESHAPE is Onshoring Advanced Microelectronic Packaging
In IFTLE 541 I mentioned funding from the government organization known as the Industrial Base Analysis and Sustainment Program (IBAS)....
IFTLE 546: AMAT buys into Absolics; Samsung’s AP Team; Update on the CHIPS program under NIST
Last year (IFTLE 512) we discussed the SKC formation of the US subsidiary Absolics, and its glass core substrate manufacturing...
IFTLE 545: Chiplet Definition and Standardization
I wanted this blog to cover the recent whitepaper by Siemens’ EDA division on chiplet model standardization, and it will,...
IFTLE 544: IPC Advanced Packaging Symposium Part 3: Intel, IBM and AMD
This week we continue our look at the IPC Advanced Packaging Symposium: Building the IC-Substrate and Package Assembly Ecosystem, held...
IIFTLE 542: What We Need to Know about the US IC Substrate Infrastructure
The IPC Advanced Packaging Symposium: “Building the IC Substrate and Package Assembly Ecosystem” was held in Washington, DC in October....
IFTLE 541: Predicted Locations for CHIPS Innovation Hubs; Skywater/BRIDG IBAS Funding
CHIPS Act Innovation Hubs SEMI has published an interesting article where they predict 10 likely locations for CHIPS Act Innovation...
IFTLE 540: IMAPS Symp 2022: Nano-porous Copper; Adaptive Formed Glass
IMAPS 2022 Continued… This year’s IMAPS Symposium in Boston drew 925 attendees and featured: 20 technical and poster sessions 11...
IFTLE 539: IMAPS On-Shore Packaging & Assembly Workshop; TSMC 3DFabric Alliance
As we mentioned in IFTLE 537, IMAPS held the Onshoring: Packaging and Assembly Workshop prior to the traditional IMAPS fall...
IFTLE 538: Kyocera Details HDBU and HDI Processing and Looks at US On-shoring
As we noted in IFTLE 537, prior to the 2022 IMAPS conference in Boston earlier this month, IMAPS hosted a...
IFTLE 537: 2022 IMAPS Society Awards Go to Advanced Packaging Superstars
IMAPS held its 55th International Symposium on Microelectronics in Boston, October 4-6 2022. The conference drew some 900+ attendees hungry for some...
IFTLE 536: Government-sponsored Advanced Packaging Programs Taking Shape
In IFTLE 534 we discussed the DARPA Next Generation Microelectronics Manufacturing (NGMM) program which will attempt to establish a domestic...
IFTLE 535: The Resurgence of U.S. Semiconductor Fabs
Leading-edge semiconductor fabs haven’t been built in the U.S. for a while but that’s about to change. Let’s look at...
