IFTLE 617: SK Hynix considers 2.5D packaging business with Amkor
Jan 15, 2025 · By Phil Garrou · Blogs, Packaging IFTLE
Latest Posts - Page 2
IFTLE 594: TSMC’s Foundry Market Share; UMC 3DIC for RFSOI
TSMC takes 61% of global foundry market share Counterpoint has released its global foundry market share ranking for 4Q 2023,...
IFTLE 593: Deep in the Heart of Texas
IFTLE has spent a lot of time recently focusing on the availability of U.S. government funds for the “onshoring” of...
IFTLE 592: DIBC Hosts Advanced PCBs and Electronic Substrates Industry Day
In early April the Defense Industrial Base Consortium (DIBC) held an “Industry Day for Advanced Printed Circuit Boards (PCBs) and...
IFTLE 591: TSMC AZ & Samsung get CHIPS Money; IMAPS Hosts 2nd Annual Onshoring Conference
We all knew it was coming….it was just a matter of time until it was announced. The Department of Commerce...
IFTLE 590: The NHanced Semiconductors Roadmap
If you have been following the announcements from Bob Patti and his company, NHanced Semiconductors, it would not be surprising...
IFTLE 589: Intel Gets CHIPS Act Funding; Raytheon and AMD Partner on Multi-Chip Package
The Department of Commerce (DoC) has announced Intel as the fourth program it will fund under the CHIPS and Science...
IFTLE 588: CHIPS NAPMP Materials & Substrates Program
The Creating Helpful Innovations in the Production of Semiconductors (CHIPS) workforce initiatives are shown in Figure 1: The CHIPS vision...
IFTLE 587: Intel Glass Core Substrate Update
In late Feb INEMI hosted a Packaging Tech Topic Webinar: Glass Substrates for Advanced Packaging which was presented by Dr....
IFTLE 586: US CHIPS Act Monies Begin to Flow
US Chip Fabrication, Packaging & Assembly Industry In August 2023, one year after the U.S. CHIPs Act was signed into...
IFTLE 585: Lincoln Labs Chiplet Technology for ELAICs
The February issue of Chip Scale Review contained an interesting article entitled “Heterogeneous Chiplet Integration to Make Megachips” authored by...
IFTLE 584: SK hynix HBM Is Coming to the US; Intel Pushes Back Ohio Chip Fab
Onshoring SK hynix HBM Multiple reports indicate that SK Hynix is poised to announce its first major U.S. investment: A...
IFTLE 583: DoD funding for U.S. Based Substrate Manufacturing
IFTLE has spent significant time discussing the lack of U.S.-based substrate manufacturing. Although packages such as the ball-grid array (BGA)...
IFTLE 582: SK hynix Looks at the Future of Memory Packaging for AI
At this year’s IEEE International Electron Device Meeting, [IEDM] (December in San Francisco) SK hynix gave an interesting look at...
IFTLE 581: The National Advanced Packaging Manufacturing Program
As IFTLE has explained previously, Investments in semiconductors will not succeed without investments in advanced packaging. The CHIPS for America...
IFTLE 580: NIST Chiplet Interfaces Technology Standards Workshop
NIST held the “Chiplet Interfaces Technical Standards Workshop” at the NIST National Cybersecurity Center of Excellence in December 2023. During this...
IFTLE 579: Workforce Development – SCALE
The Scalable Asymmetric Lifecycle Engagement (SCALE) program is the nation’s preeminent workforce development effort, funded by the Department of Defense’s...
IFTLE 578: Why Are TSMC’s Offshore Fabs Progressing Differently?
Also: US CHIPS Seeking < $300M Proposals TSMC’s Offshore Fabs Nikkei Asia is reporting that TSMC’s $8B Japan chip project...
IFTLE 577: Amkor Announces US Packaging Facility; IBAS RESHAPE Winners Announced
Amkor Technology’s announcement to build a high-volume facility in the US, as well as the award winner announcements for the...
IFTLE 576: TSMC Launches 3DFabric Alliance at OIP 2023
TSMC recently introduced its “3DFabric Alliance”, as part of its Open Innovation Platform (OIP), to help customers with the challenges...
