IFTLE 614: What’s in Store for Intel’s Future? Update on NAPMP Proposers Day
Dec 11, 2024 · By Phil Garrou · Blogs, Packaging IFTLE
Latest Posts - Page 2
IFTLE 591: TSMC AZ & Samsung get CHIPS Money; IMAPS Hosts 2nd Annual Onshoring Conference
We all knew it was coming….it was just a matter of time until it was announced. The Department of Commerce...
IFTLE 590: The NHanced Semiconductors Roadmap
If you have been following the announcements from Bob Patti and his company, NHanced Semiconductors, it would not be surprising...
IFTLE 589: Intel Gets CHIPS Act Funding; Raytheon and AMD Partner on Multi-Chip Package
The Department of Commerce (DoC) has announced Intel as the fourth program it will fund under the CHIPS and Science...
IFTLE 588: CHIPS NAPMP Materials & Substrates Program
The Creating Helpful Innovations in the Production of Semiconductors (CHIPS) workforce initiatives are shown in Figure 1: The CHIPS vision...
IFTLE 587: Intel Glass Core Substrate Update
In late Feb INEMI hosted a Packaging Tech Topic Webinar: Glass Substrates for Advanced Packaging which was presented by Dr....
IFTLE 586: US CHIPS Act Monies Begin to Flow
US Chip Fabrication, Packaging & Assembly Industry In August 2023, one year after the U.S. CHIPs Act was signed into...
IFTLE 585: Lincoln Labs Chiplet Technology for ELAICs
The February issue of Chip Scale Review contained an interesting article entitled “Heterogeneous Chiplet Integration to Make Megachips” authored by...
IFTLE 584: SK hynix HBM Is Coming to the US; Intel Pushes Back Ohio Chip Fab
Onshoring SK hynix HBM Multiple reports indicate that SK Hynix is poised to announce its first major U.S. investment: A...
IFTLE 583: DoD funding for U.S. Based Substrate Manufacturing
IFTLE has spent significant time discussing the lack of U.S.-based substrate manufacturing. Although packages such as the ball-grid array (BGA)...
IFTLE 582: SK hynix Looks at the Future of Memory Packaging for AI
At this year’s IEEE International Electron Device Meeting, [IEDM] (December in San Francisco) SK hynix gave an interesting look at...
IFTLE 581: The National Advanced Packaging Manufacturing Program
As IFTLE has explained previously, Investments in semiconductors will not succeed without investments in advanced packaging. The CHIPS for America...
IFTLE 580: NIST Chiplet Interfaces Technology Standards Workshop
NIST held the “Chiplet Interfaces Technical Standards Workshop” at the NIST National Cybersecurity Center of Excellence in December 2023. During this...
IFTLE 579: Workforce Development – SCALE
The Scalable Asymmetric Lifecycle Engagement (SCALE) program is the nation’s preeminent workforce development effort, funded by the Department of Defense’s...
IFTLE 578: Why Are TSMC’s Offshore Fabs Progressing Differently?
Also: US CHIPS Seeking < $300M Proposals TSMC’s Offshore Fabs Nikkei Asia is reporting that TSMC’s $8B Japan chip project...
IFTLE 577: Amkor Announces US Packaging Facility; IBAS RESHAPE Winners Announced
Amkor Technology’s announcement to build a high-volume facility in the US, as well as the award winner announcements for the...
IFTLE 576: TSMC Launches 3DFabric Alliance at OIP 2023
TSMC recently introduced its “3DFabric Alliance”, as part of its Open Innovation Platform (OIP), to help customers with the challenges...
IFTLE 575: Intel’s Interest in Glass Core Substrates
Intel recently announced that it would use glass core substrates for advanced packaging in the second half of this decade....
IFTLE 574: Arizona Talks Packaging with TSMC
Also STEAMPIPE winners and are Japan’s semiconductor materials companies acquisition targets? Arizona talks packaging with TSMC Ever since TSMC announced...
IFTLE 573: CHIPS Act Microelectronics Commons Regional Innovation Hub Winners
Microelectronics Commons The Microelectronics Commons is a Department of Defense (DoD) initiative that aims to create direct pathways to commercialization...
