IFTLE 619: CHIP Flagship Facilities include Albany NY, Sunnyvale CA and Tempe AZ
Feb 12, 2025 · By Phil Garrou · Blogs, Packaging IFTLE
Latest Posts
IFTLE 616: Broadcom eXtreme Dimension System in Package (XDSiP™)
Broadcom has recently announced the availability of its 3.5D eXtreme Dimension System in Package (XDSiP™) platform technology, enabling consumer AI...
IFTLE 615: TSMC Evolves CoWoS Technology Promising 9x Reticle Size by 2027
TSMC recently announced at its Open Innovation Platform (OIP) Ecosystem Forum in Europe that its chip-0n-wafer-on=substrate (CoWoS) packaging technology will...
IFTLE 614: What’s in Store for Intel’s Future? Update on NAPMP Proposers Day
Intel Reaches The Fork in the Road Digitimes had some interesting recent opinions about the future of Intel. Let’s take...
IFTLE 613: Solder Joint Reliability of Glass Core Substrate Assemblies
We have seen considerable global activity focused on developing glass core substrate assemblies and interposers, yet, as some of us...
IFTLE 612: Congratulations to the IMAPS 2024 Society Award Winners
Figure 1 shows a listing of the 2024 IMAPS Society Award winners and the feature photo above are some of...
IFTLE 611: Amkor Clarifies Arizona Facility Activity
Wolfspeed & Hemlock Semiconductor Get Their CHIPS Act Share Arizona Facility to Focus on High Performance Computing In IFTLE 577...
IFTLE 610: Looking for Silicon Interposers? Try GlobalFoundries!
If you have been looking for reliable, dependable sources of silicon interposers in anything beyond prototype quantities – like I...
IFTLE 609: TSMC/Amkor U.S. Advanced Packaging Partnership; Reshoring at IMAPS 2024
TSMC/Amkor agreement Will Put U.S. Advanced Packaging on The Map TSMC has signed a memorandum of understanding (MoU) with Amkor...
IFTLE 608: Is Chip Packaging the New Front on the US-China CHIP WARS?
US-China CHIP WARS Now Encompass Advanced Packaging In the Aug 21st issue of Asia Times, Scott Foster wrote an interesting...
IFTLE 607: Why Nvidia’s Blackwell is Having Issues with TSMC CoWoS-L Technology
Plus: UCIe 2.0 for 3D stacking; Samsung slows down Texas expansion Nvidia’s Blackwell Experiences...
IFTLE 606: Is Intel CHIPS Act Money Being Delayed?
Also: hynix Advanced Packaging in Indiana; Fraunhofer Chiplet Center; Call to Unify Advanced Packaging Standards Is the U.S. Government Becoming...
IFTLE 605: Helping Lead the Way for Chip Packaging in India
India is a rapidly growing consumer of semiconductors. Its market was $22 billion in 2019 and is expected to nearly...
IFTLE 604: Aspencore’s Virtual Chiplet Conference
In July, Aspencore held a two-day virtual chiplet conference through its publications EE Times and embedded, Chiplets: Building a Future...
IFTLE 603: Amkor’s Slice of the CHIPS Pie for its HVM OSAT; Samsung Texas Update
HVM OSAT In Peoria, AZ Commerce Secretary Gina M. Raimondo has identified advanced packaging as a major area of focus...
IFTLE 602: Dr. Dev Palmer in at NAPMP; A New Player in Glass Core Substrates
Dr. Dev Palmer Takes over the Reins CHIPS NAPMP The Department of Commerce has announced that Dr. Dev Palmer has...
IFTLE 601: Glass Substrates for CPUs; Silicon Interposers; and 300mm Wafer Production in the U.S.
AMD to Adopt Glass Substrates for CPUs Business Korea reports that AMD intends to adopt glass substrates for its ultra-high-performance...
IFTLE 600: A Notice of Intent from the CHIPS NAPMP
The National Advanced Packaging Manufacturing Program (NAPMP) is one of multiple CHIPS R&D initiatives that seek to create United States...
IFTLE 599: Prismark’s 30-Year Perspective of the Electronics Industry
Prismark Partners consultants, based in Cold Spring Harbor NY, is having its 30-year anniversary this year. As part of that...
IFTLE 598: NSTC Update
In February 2024, CHIPS announced that $5B would be spent in the National Semiconductor Technology Center (NSTC) to drive innovation...
