From Different Dimensions

Latest Posts - Page 18

Atoms Don’t Scale: What is Beyond 7nm (2019)?

Jul 30, 2013 · By Iulia Morariu · Blogs

We have a guest contribution today from Brian Cronquist, MonolithIC 3D Inc.’s VP of Technology & IP. Brian discusses about...

2013 SUSS MicroTec Technology Forum Focuses on 3D TSV infrastructure

Jul 12, 2013 · By Kamal Karimanal · 3D Event Coverage

SUSS, being an equipment maker addressing various manufacturing challenges faced by 3D IC enablement, definitely has a lot riding on...

Bumps are the Elephant in the Wafer Stress Room: NCCAVS Joint User Group Meeting On 3D Packaging

Jul 03, 2013 · By Paul Werbaneth · 3D Event Coverage

The Northern California Chapter of the America Vacuum Society has, for years, run a very strong program of ongoing User...

Waiting For Godot? Report from D43D 2013, Grenoble, France

Jul 01, 2013 · By Marco Casale-Rossi · 3D Event Coverage

Last week, as I have been doing for the last few years, I went to the D43D Workshop. This year,...

Managing 3D IC Supply Chain Complexity and Cost: A Conversation with WWK – Part 2

Jun 19, 2013 · By Paul Werbaneth · Blogs

“The time has come when we have to understand that we can only compete WHEN we collaborate.” (Sudipto Roy, SMIC,...

Managing 3D IC Supply Chain Complexity and Cost: A Conversation with WWK

Jun 17, 2013 · By Paul Werbaneth · Blogs

“Challenges that need addressing in 2.5D / 3D IC are supply-chain related. The current cost structure for 2.5D / 3D...

ASMC 2013 and 3D IC: Time to Volume, Time to Via

May 28, 2013 · By Paul Werbaneth · Blogs

What is today’s biggest threat to continued growth in the semiconductor industry? Subramani Kengeri, Vice President, Advanced Technology Architecture, GLOBALFOUNDRIES,...

More than Moore and 3D IC: Decoding the Code at the GSA Silicon Summit 2013

Apr 26, 2013 · By Paul Werbaneth · 3D Event Coverage

There’s probably no more fitting venue for discussing future directions for processing and packaging technology in integrated circuit fabrication than...