Innovation Without Borders: Key Takeaways from ISS Europe 2025
Mar 31, 2025 · By Camden McCrea · Blogs, From Different Dimensions
Latest Posts - Page 14
Advanced Packaging Trends, Part I: Solving PR Strip and UBM/RDL Challenges
Over the years, the semiconductor industry has relentlessly focused on shrinking gate dimensions to drive performance. This focus has now...
European 3D Summit 2018: Fraunhofer Tour and Presentations
This year’s European 3D Summit in Dresden, which highlighted “Heterogeneous Integration Driving 3D”, was led off by presentations and a...
Can We Thank Aristotle for Heterogeneous Integration?
A couple of years ago we may not have predicted that in 2018 there would be a growing demand for...
Breakthroughs in 3D Chip Technology Lead to Cooling With Microfluidics and 3D Printing
2017 saw a clear breakthrough for 3D chip technology in commercial products. Before then, the industry had looked rather...
2018 Industry Outlook: It’s Time to Get Serious about 5G
While the entire semiconductor industry is buzzing about explosive and sustained growth well into the 2020s driven by smart everything...
A Material Solution for the Growing 3D Imaging Market
With emerging markets developing for augmented reality (AR), virtual reality (VR), facial-recognition security systems, advanced human/machine interfaces and other 3D...
2018 Outlook for Advanced Packaging Materials
Advanced packaging is moving mainstream as manufacturers continue to seek ways to improve device performance beyond traditional scaling. The semiconductor...
A Tribute to Gilles Poupon, CEA-Leti’s Advanced Packaging Pope
Sitting in the bus on the way back from Grenoble to Airport Lyon, I am reflecting the last two days...
MCM, SiP, SoC, and Heterogeneous Integration Defined and Explained
Multichip module (MCM), system-in-package (SiP), system-on-chip (SoC), and heterogeneous integration are all important semiconductor packaging technologies. They deserve to have, at...
Warpage Issues in Fan-Out Wafer Level Packaging
As you all know, warpage is a critical issue for fan-out wafer/panel level packaging. Many people like to talk about it,...
Advanced Packaging Adds Value and Reduces Cost for Future Semiconductor Products
Yole Développement (Yole) confirms the consolidation of the advanced packaging industry, that is showing a steady growth in revenue of...
Are Glass Substrates the Next Option for Fan-out Packaging?
As you all may know, in most fan-out wafer level packages (FOWLP) such as embedded wafer level ball grid array...
The Advancement of Device Packaging – A Resume on IMAPS DPC 2017
As part of the organizing committee, we believe this year’s IMAPS Device Packaging Conference really fulfilled what the announcement promised...
Executive Viewpoint: Next-Gen Drone Technologies Rely on Semiconductor Innovation
Robotics and drone technologies are one of the fastest growing end-use markets for integrated sensor technology today. According to a...
Process Control Gains Importance in Advanced Packaging Applications
2016 will be remembered as the year fan-out wafer level packaging (FOWLP) went mainstream, thanks to TSMC’s strategic move in...
Silicon Patents: Repeating the Past
“Those who cannot remember the past are condemned to repeat it” ~ George Santayana Over the past forty years, the presence of legally protected Intellectual...
Addressing Advanced Packaging Challenges in 2017 and Beyond
As the two-dimensional (2D) shrinking of planar circuits (on which Gordon Moore based his famous observation) has become more difficult...
Outlook 2017: Advanced Packaging Technology Takes Center Stage
The era of “More than Moore” was alive and well in 2016 as the semiconductor industry witnessed many new developments...
What the Heterogeneous Integration Technology Roadmap Will Mean for 2017
While it seems that the semiconductor industry has suddenly embraced heterogeneous integration as the next revolutionary innovation to further the...
