Sustainability 101: How Green is Your Electricity?
Dec 11, 2024 · By Julia Freer Goldstein · Blogs, From Different Dimensions
Latest Posts - Page 10
Virtual SEMICON WEST: A Kiterocket Perspective
The current pandemic is wreaking havoc across the globe and forcing organizations, employees, and volunteers to either cancel events or...
What A Difference a Quarter Makes!
At the end of the 1st quarter and into early June, the thinking was that the semiconductor and packaging industry...
SEMICON West 2020: Sentiment, Sustainability, Diversity and Pandemic
Another SEMICON West has come and gone. Well almost gone, this one will be with us virtually until mid-September. SEMI’s...
How we Helped a Customer Deliver a GEM-compliant Equipment using CCF
Welcome to the first posting in the Cimetrix CIMControlFramework (CCF) Services blog series! While Cimetrix has been providing professional services...
Semiconductor Back End Processes: Selective GEM300 Adoption
GEM and GEM300 Adoption In a previous blog, I shared how the relatively new SEMI task force in North America called...
How to Create a Vibrant Semiconductor Manufacturing Industry in the United States
Having spent the last 30 years working in semiconductor manufacturing, it is both exciting and unsettling to see renewed political...
SEMICON China – An Exhibitor Perspective
After the cancellation of SEMICON Korea in January, not many were surprised to learn that SEMICON China would not take...
SEMICON China 2020 at a Glance
SEMICON China 2020, collocated with FPD China, was successfully held June 27-29, 2020. SEMICON China was the first big semiconductor...
VLSI 2020: 3D Continues to Dominate Advanced Semiconductor Technology
As a process geek, The Symposia on VLSI Technology and Circuits has long been one of my favorite conferences. The...
Industry Outlook: What Goes Down Must Come Up
The GDP is down, the stock market is up, unemployment, at least in the USA, is confused, so what is...
Semiconductor Backend Processes: Additional SEMI Standards Related to GEM
Background In a few previous blogs, I shared how the relatively new SEMI Advanced Backend Factory Integration (ABFI) task force...
Stay Virtually Connected with Your Industry Colleagues and Favorite Topics at ECTC 2020
On behalf of the entire Program and Executive Committees, it is my pleasure to invite and welcome all of you...
I’m Not Thrilled to Write this Blog Post
One of the ongoing travesties in public relations? Press release quotes. Looked upon as a necessary evil by most writers,...
TSMC Tales: Building 5nm Fab in Arizona; Cancelling New Huawei Orders
Lots of news over the weekend regarding TSMC. The big news is that TSMC is projected to build its first...
Temporary Wafer Bonding System Is Based On Electrostatics, Not Adhesives
Temporary wafer bonding is widely employed in semiconductor device fabrication and in semiconductor device packaging applications, particularly now that changes...
Chiplets: The New Era Begins
The semiconductor industry has entered a new era and the role of design including the package has become increasingly important....
Chiplets Promise to put Moore’s Law Back on Track
Moore’s Law may not be dead, but at 55 years old, it’s certainly feeling its age, with the pace of...
Commerce Department Tightens the Screws on the US Semiconductor Industry
On April 28, the commerce department issued the following news release that could deeply impact the US semiconductor industry: “The...
SemiSister Success Story: A Woman on the Edge of 3D Technology
Severine Cheramy has devoted her career to developing 3D integration technologies and bringing them to market. She was the first...
