Advanced packaging has emerged as a critical enabler of next-generation applications for artificial intelligence (AI), high-performance computing, wearables, 6G communication,...
February member news shows dynamic activity for semiconductor industry, with exciting advancements in technology, strategic expansions, key industry events, and...
The European Chips Act (ECA) is pivotal to Europe’s strategy for technological sovereignty, aiming to strengthen the continent’s semiconductor supply...
By Juliana Panchenko and Frank Windrich, Fraunhofer IZM-ASSID 15 years ago, Fraunhofer established the “White House of microelectronics packaging”— a...
As global semiconductor demand continues to surge, international collaboration has become essential for driving technological innovation. The US-JOINT consortium represents...
January Member News celebrates major developments in semiconductor technology, strategic partnerships, industry expansions, and workforce growth. Companies introduced cutting-edge packaging,...
This month has been full of exciting advancements and milestones for our members. From cutting-edge technological breakthroughs and prestigious award...