The 3D InCites Podcast Backtrack – 2024 in Review
Dec 18, 2024 · By Francoise von Trapp · Blogs, Francoise in 3D
Latest Posts - Page 8
Talking Nerdy with Exhibitors at IWLPC 2018
With heterogeneous integration, 3D, and advanced wafer-level packaging technologies officially declared the rising stars of the semiconductor industry, materials, process...
Bridging the Interconnect Pitch Gap Calls for 3D Technologies
Last week at IWLPC, keynote speaker, Doug Yu, TSMC, kicked off the event with a similar storyline used by ASE’s...
Hello, Microelectronics and Packaging? Your Opportunities are Calling
There’s no doubt about it. This is a good time to be in the microelectronics and packaging sector of the...
How Do We Create Smart Cities Without Exploiting Personal Data?
Creating smart cities while also protecting the personal data of its citizens is no easy task these days, particularly with...
Dr. Phil Garrou Makes the Move to 3D InCites
Yes. You read that right. It is my great pleasure to announce that Dr. Phil Garrou is joining 3D InCites...
Ain’t No Mountain High Enough to Keep Rozalia Beica From Success
“Driven” doesn’t even begin to describe Romanian-born Rozalia Beica, global director, strategic marketing, DowDupont. Neither rain, nor sleet, nor whizzing...
3D VLSI is the New Active Interposer
3D very large system integration (3D VLSI) has many aliases. This high-density approach to 3D system integration first appeared on...
Will Fully-Autonomous Vehicles Ever Take Over Our Roads?
At the 2018 European MEMS, Imaging and Sensors Summits, I detected a shift in sentiment around the likelihood (and the...
MEMS, Imaging, and Sensors Summits Show The Power of Collaboration
Last week, at the co-located 2018 European MEMS and Sensors/Imaging and Sensors Summits, held in Grenoble, France, I had the...
Why Today’s Advanced Packages Need Better Inspection and What’s Being Done About It
It’s almost ironic. As CMOS scaling (aka: Moore’s Law) has slowed due to the increased complexity and cost of achieving...
Research Scientist, Maaike M. Visser Taklo, Rises to Her Own Challenge
Throughout my years of writing about the semiconductor industry, I’ve met women from all over the world. I’ve often wondered...
Diversification of Markets Calls for Hybrid Metrology with Multi-Sensor Technology
It used to be that people thought about metrology for front-end process control and inspection for advanced packaging. As wafer...
How Jessica Gomez Short-Circuited Her Way to CEO: A SemiSister Success Story
The number is sobering: according to the U.S. Bureau of Labor of Statistics, 16.9% of chemical engineers and 12.3% of...
It’s not the Data, it’s what you DO with it; and Other Conversations from SEMICON West 2018
Emerging technologies like artificial intelligence (AI), machine learning (ML) are driving more than just the semiconductor market. They also drove...
Volumes Matter and Other Conversations from SEMICON West 2018
The world wants intelligence in everything, especially things that aren’t nailed down like autonomous cars, and the internet of things...
Why We need Lower Cost TSVs and How to Get Them
Through-silicon vias (TSVs) have been firmly established as a method of interconnect that enables high bandwidth and low latency between...
What Should Replace “2.5D” in the Heterogeneous Integration Nomenclature?
The people have spoken! The results of last week’s poll are in, and it looks like the majority of those...
SEMICON West 2018: Smart Starts Where?
Well, that was interesting. SEMICON West 2018 just wrapped up, and I’m not quite sure what just happened. This year’s...
3D InCites Top Picks for SEMICON West 2018
Ok folks. It’s that time of year again. SEMICON West 2018 is upon us. By the time you read this...
