Interconnectology Saves the World!
Jan 08, 2025 · By Francoise von Trapp · Blogs, Francoise in 3D
Latest Posts - Page 34
Live, from Dobson Ranch, it’s MEPTEC’s Southwest Luncheon
While I’m clearly a huge believer of leveraging the Internet for interactive communication (heck, 3D InCItes was founded on that)...3D from all angles at DATE 2009 3D workshop
As I was unable to attend Design Automation Test in Europe (DATE 2009) myself, but felt the information being shared...ALLVIA – A TSV Success Story
Is ALLVIA ahead of the pack? While the rest of us wonder when through silicon via (TSV) will be ready...A funny thing happened on the way to IMAPS 2009
This is not a story about 3D integration technologies (although I’m sure I can figure out a way to work...Alchimer: A Growing Concept
In an understated research lab and recently upgraded demo facility located just outside Paris in Massy, France, Alchimer scientists...
My 3D IC Blog-venture
While most of my blogging will be devoted to talking about what's happening in the world of 3D integration technologies,...Soitec Unleashes the Power of Three
A walk across the impressive Bernin, France campus that is home to two of Soitec Group’s three divisions takes...
What’s your semi lingo IQ?
I’ve long been fascinated with the vernacular of the semiconductor industry, which is riddled with acronyms that can often mean...Happy Birthday, IMEC!
I finally realized why I find the semiconductor industry so compelling, and why the people are so great to work...Interview with Steve Lerner: 3D Start-up Alchimer Poised for Success
Talk about good timing. It’s been a whirlwind year of accomplishments for Alchimer, a French semiconductor start-up whose product portfolio...
Even the Magic 8 Ball couldn’t have called it
In my last editorial as managing editor of Advanced Packaging magazine, I suggested we should turn to the Magic...CEA-Leti: A visit to the mother ship
If your company is located in France, and/or is involved in micro and nanotechnologies for microelectronics, chances are it’s...
