Announcing the Winners of the 2025 3D InCites Awards
Feb 04, 2025 · By Francoise von Trapp · Blogs, Francoise in 3D
Latest Posts - Page 33
Collaborate, innovate, and get ready for the rebound
I know where many of the optimistic people in the semiconductor industry were today; giving presentations at the Global Business...The Other 3D Packaging Technologies
While TSV developments continue to attract media attention as the rock star technology of 3D integration, it’s important to remember...Was Moore’s Law really meant to be a law or more of a guideline?
Before I joined the semiconductor industry, I was completely unaware of this guy Gordon Moore, whose observations and predictions set...Following the BrightSpots 3D IC Forum
Day One: I'm not sure if it’s because it was the Monday after a U.S. holiday weekend, or just...
3D InCites: Unveiled
Today, July 6, 2009, is the day a vision becomes a reality. When I first started Françoise in...More about UBM for conformal TSVs
In response to the previous post, Bob Patti of Tezzaron Semiconductors weighed in with a solution to performing under bump...TSV copper fill: is it necessary for UBM?
In response to a recent post about the whether/when it is necessary to completely fill TSVs, or sufficient to...June Events in 3D
As May rolls right into June, so do the 3D events; or should I say events in which 3D topics...“Francoise in 3D” resurfaces in AZ
For the past two weeks, I’ve been slightly preoccupied with relocating from Massachusetts to Arizona. For much of that time,...A Visit to Nexx Systems
It’s easy to see why NEXX is experiencing growth. It’s all about attitude, and the enthusiasm among NEXX’s team...
A Visit to SUSS MicroTec
It’s been...
My Big Fat 3D Obsession
In one of my all-time favorite movies, My Big Fat Greek Wedding, family patriarch, Kosta Portukalo is obsessed with his...Getting the picture in 3D
When you’re totally immersed in any one topic, and therefore listen to nothing but presentations about novel processes, solutions, progress,...Can you hear me thinking?
I wasn’t surprised at how loud my thoughts could be. After all, I have to listen to my own mind...TSVs: just the tip of the 3D ICeberg
At ECTC last week, I counted at least 21 presentations dedicated to TSVs alone, and 13 dedicated to other processes...NEXX Systems: Going Strong in Tough Times
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View slide show of my visit...TGIF 3D Buzz #2A German friend of mine suggested I might want to keep my European readers in mind when I use typically...Can cost-sharing accelerate 3D IC commercialization?I’ve been talking a lot about the collaborative efforts in the form of open and closed consortia and joint development...News from IMEC’s technology forumFrom the looks of my inbox, it’s been a busy week at IMEC, between the 25th anniversary celebration and technology...May Events in 3DI wish I could be everywhere at once, because there are so many events involving 3D coming up well worth...
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