SEMICON West 2024: Riding the Generative AI Winds of Change Jul 15, 2024 · By Francoise von Trapp · Blogs, Francoise in 3D
ECTC 2024: Advanced Packaging Engineers to the Rescue! Jun 01, 2024 · By Francoise von Trapp · Blogs, Francoise in 3D
The Nexus of Innovation for U.S. Semiconductor Manufacturing May 07, 2024 · By Francoise von Trapp · Blogs, Francoise in 3D
Following Brightspots 3D IC Panel – Part 2Dec 12, 2012 · By Francoise von Trapp · Blogs We currently have 14 separate discussions going on (with much more to come) across 3 forums addressing technology progress...
Mark your 3D event calendarsDec 12, 2012 · By Francoise von Trapp · Blogs A few months back when Ziptronix first revealed details about its direct bond interconnect(DBI), CEO Dan Donabedian told me...
La La La La – I can’t HEAR you, I’m not listeningDec 12, 2012 · By Francoise von Trapp · Blogs That's what I feel like saying everytime I see yet another report on the gloomy forecast for the semiconductor industry....
SEMIspice: Five reasons to exhibit during a recessionDec 12, 2012 · By Francoise von Trapp · Blogs Be sure to check out SEMIspice: Five Reasons to Exhibit During A Recession. Tom really hits the nail on...
3D technology research gets another shot in the armDec 12, 2012 · By Francoise von Trapp · Blogs It looks like it's 3D to the rescue again. I love it. Yesterday, a collaboration was announced by Semiconductor...
Oerlikon streamlines for 3D and solarDec 12, 2012 · By Francoise von Trapp · Blogs Oerlikon’s double-barrel news about the sale of its Oerlikon Esec business unit to BESI, and expected management buyout of...
What’s holding up TSV adoption now?Dec 12, 2012 · By Francoise von Trapp · Blogs One of the questions plaguing all of us waiting for the adoption of TSVs for 3D IC stacking is what's...
The TGIF 3D BuzzDec 12, 2012 · By Francoise von Trapp · Blogs As my first official week blogging about 3D IC packaging technologies winds down, I'm thinking a Friday wrap-up is in...
Endlich Freitag! 3D BuzzDec 12, 2012 · By Francoise von Trapp · Blogs Guten Tag! It’s Friday already? I’m not sure where that week went, but I managed to gather some interesting 3D...
EDA Tool Addresses 3D Design LimitationsDec 12, 2012 · By Francoise von Trapp · Blogs One by one, it looks like to-do items are being checked off the list of TSV adoption limitations for 3D...
Talking the 3D TalkDec 12, 2012 · By Francoise von Trapp · Blogs I was happy to share the 3D stage as a contributing editor in this week’s issue of AP Semi-monthly....
Bluebird: A project in 3D Equipment DevelopmentDec 12, 2012 · By Francoise von Trapp · Blogs I consider myself to be fairly savvy when it comes to knowing who the players are in 3D IC technology...
Weekend 3D BuzzDec 12, 2012 · By Francoise von Trapp · Blogs I know - I KNOW! I missed my first Friday, and I felt just terrible about it. But hey, I...
The Skinny on 1st Lighten the Load Inc.Dec 12, 2012 · By Francoise von Trapp · Blogs First of all – I LOVE the name of this company. For that reason alone, I was intrigued enough to...
3D EDA Tools – Coming out of the WoodworkDec 12, 2012 · By Francoise von Trapp · Blogs That didn’t take long. A post about one EDA tool introduction inspired a comment about a 3D layout editor that’s...
The Other 3Ds: Occam ProcessDec 12, 2012 · By Francoise von Trapp · Blogs The brainchild of Joe Fjeldstad, Verdant Electronics, Occam Process got a lot of ink in the press when it was...
IMAPS Global Business Council and Device Packaging Symposium in ReviewDec 12, 2012 · By Francoise von Trapp · Blogs Last week’s event s, held back-to-back at the picturesque Fort McDowell Resort and Casino, Scottsdale, AZ, brought together industry experts,...
IMEC’s Latest Contribution to 3DSiPDec 12, 2012 · By Francoise von Trapp · Blogs Last week, at the Smart Systems Integration conference in Brussels IMEC announced it’s latest 3D SiP technology – the...
Notes from the Exhibition HallDec 12, 2012 · By Francoise von Trapp · Blogs I have to admit that this year at IMAPS Device Packaging Conference, I spent more time attending technical sessions and...
Léti and Brewer Science: sharing a common lab and a common goalDec 12, 2012 · By Francoise von Trapp · Blogs With the recent announcement of CEA-Léti and Brewer Science's agreement to create a common lab for further development...