SEMICON West 2024: Riding the Generative AI Winds of Change
Jul 15, 2024 · By Francoise von Trapp · Blogs, Francoise in 3D
Latest Posts - Page 19
IWLPC 2013: Will the Changing Mobile World Usher in 3D ICs?
…For while the tired waves, vainly breaking, Seem here no painful inch to gain, Far back, through creeks and inlets...
The Back Story on Besang’s True 3D ICs
BeSang Inc, a fabless semiconductor company in Beaverton, OR, has been on my 3D IC radar since 2008, when I...
Friday’s Blog is brought to you by the Internet of Things
The Internet of Things, or “IoT” certainly seems to be the social media buzz phrase of the week. It seems... A Breakfast of Cu Pillars, Wafer-level Packaging the Internet of Things, and more
I took a detour to work on Friday (Oct 18, 2013), stopping in at Freescale Semiconductor (Tempe AZ) to attend...
The Many Flavors of 3D DRAM
Micron’s recent announcement that they will be shipping samples of the Hybrid Memory Cube (HMC) and ramping to production in...
Motivation for 3D IC and other Key Take-Aways from the IEEE 3D IC Conference
The IEEE 3D Systems Integration Conference (IEEE 3D IC) is a unique event that is a truly international effort in assembling all...
Donning my 3D Glasses at the MEPTEC Semiconductor Roadmap Symposium
I admit, I always have my 3D glasses on at conferences. But even though the title of this week’s MEPTEC...
Probing Questions at the IEEE 3D IC Test Workshop
As this year’s 3D IC Test Workshop unfolded (September 12 & 13, 2012), one thing became increasingly clear to me:...
3D Test Community Addresses Requirements for 3D Volume Production Testing
Don’t let the skeptics fool you, contrary to popular belief, the 3D test community has been hard at work on...
3D IC Commercialization: Glimmers of Progress and Push for Collaboration and Choices to Make
Recent signs that we’re getting closer to commercialization of 3D ICs? For one, analog and sensor IC company, ams AG,...
Moore’s Law is Dead (or Dying) Again?
All good things must come to an end, and apparently Moore’s Law is one of them. But I have to...
Understanding The Complexity of Cleans
There is nothing like a little hands-on experience to help someone understand a particular technology better and more fully. Last...
Playing the 3D IC Glad Game
I admit it. I have always been a card-carrying member of the Pollyanna Club. What’s wrong with approaching challenges with...
How will the 450mm Transition Affect Advanced Packaging and 3D ICs?
That was my kick-off question for Manish Ranjan, Vice President, Product Marketing, Advanced Packaging/Nanotechnology Segment at Ultratech, during our annual...
Interview with Fraunhofer IZM-ASSID’s Juergen Wolf: The Collaboration Grows
A few months ago, Juergen Wolf, director of the 3D program at Fraunhofer IZM-ASSID, shared with me a beautifully photographed...
Interview with imec’s Ludo Deferm: Packaging Design Kits and Debond Solutions
For me, SEMICON West involves a careful balance of attending sessions, keynotes and panels, combined with one-on-one interviews with thought...
Silicon Photonics: the Next Killer App for 3D ICs? and more from the R&D Community
First it was going to be memory stacks, then it was Wide I/O DRAM on Memory, and now, as commercialization...
It Takes an Ecosystem to Launch 2.5D and 3D Integration
As 2.5D and 3D IC technologies round the ten-year development mark and volume manufacturing keeps getting pushed just beyond our...
And a Good Time was had by All – 3D InCites Awards Breakfast, 2013
Despite the chilly San Francisco morning temperatures, a sizable crowd of 2.5D and 3D enthusiasts gathered at the Impress Lounge...
