SEMICON West 2024: Riding the Generative AI Winds of Change Jul 15, 2024 · By Francoise von Trapp · Blogs, Francoise in 3D
ECTC 2024: Advanced Packaging Engineers to the Rescue! Jun 01, 2024 · By Francoise von Trapp · Blogs, Francoise in 3D
The Nexus of Innovation for U.S. Semiconductor Manufacturing May 07, 2024 · By Francoise von Trapp · Blogs, Francoise in 3D
Interconnectology Revisited: Pizza Anyone?Mar 13, 2014 · By Francoise von Trapp · Blogs Interconnectology returned as a topic of discussion to the 2014 BiTS Workshop through a keynote discussion delivered by Invensas’ president,...
Magic Chip-powered SuperPoP offers Near-term Alternative to TSVsMar 03, 2014 · By Francoise von Trapp · 3D Event Coverage When I saw that Dev Gupta, Ph.D, of Advanced Packaging & Systems Technology Laboratories, LLC (APSTL) was presenting at the...
Fraunhofer EMFT: 25 years of 3D Integration in MunichFeb 14, 2014 · By Francoise von Trapp · Blogs Wouldn’t it be great to get a text notification that you are almost out of toilet paper at home rather...
Triple I Prevails at EV GroupFeb 11, 2014 · By Francoise von Trapp · Blogs Invent, Innovate, Implement continues to be the mantra at EV Group, supplier of wafer bonding and lithography equipment for the MEMS,...
The 411 on CEA Leti’s Interposer RoadmapFeb 04, 2014 · By Francoise von Trapp · 3D Event Coverage When is an active die not an active die? When it’s an active interposer, of course! Ever since Nicolas Sillon,...
2.5D and 3D IC Technologies: Application Ready but Cost Limited?Jan 31, 2014 · By Francoise von Trapp · 3D Event Coverage Two schools of thought clearly emerged at last week’s European 3D TSV Summit, which took place on January 20 and...
Lessons Learned From the Trenches of 3D IC Manufacturing for Sensor ApplicationsJan 30, 2014 · By Francoise von Trapp · Blogs The technologies are ready, the target high volume applications for 3D IC manufacturing have been identified, and now it’s about...
The 2014 European 3D TSV Summit: Get Ready for the Domino EffectJan 27, 2014 · By Francoise von Trapp · 3D Event Coverage I just boarded my flight home after attending the 2014 European 3D TSV Summit. Three days, 332 attendees from 21...
TSVs for MEMS vs. TSVs for 3D ICSJan 24, 2014 · By Francoise von Trapp · 3D Event Coverage The 2013 European 3D TSV Summit (January 20-22, Grenoble, France) kicked off with a pre-conference symposium on 3D TSVs for...
Europe in 3D: The EV Group Story Continues…Jan 20, 2014 · By Francoise von Trapp · Blogs Rarely do I have the opportunity to visit a company two times and find something new to write about, never mind...
Europe in 3D: The Brains behind e-BRAINSJan 16, 2014 · By Francoise von Trapp · Blogs After so many years covering 3D technologies, I love finding a new angle to write about. Yesterday’s visit to Fraunhofer...
Europe in 3D: Nordson DAGE Sets Out to Measure the InvisibleJan 15, 2014 · By Francoise von Trapp · Blogs What better place for the Queen of 3D to start out her Europe in 3D tour than a late lunch...
Europe in 3D: The 2014 Winter TourJan 07, 2014 · By Francoise von Trapp · Blogs This winter, I’ve been invited to moderate panels at two 3D industry events. The first will be at the European...
Happy Holidays from 3D InCites!Dec 19, 2013 · By Francoise von Trapp · Blogs It’s that time of year again! Each year, we select different members of the 2.5D and 3D industry to feature in...
3D ASIP 2013: Jan Vardaman’s 3D Readiness Report CardDec 18, 2013 · By Francoise von Trapp · 3D Event Coverage While other presenters for the 2013 3D ASIP session, “Evolution of 3D Technologies and Market Trends” took a more conventional...
3D ASIP 2013: Coming Down The Home Stretch to 3D IC CommercializationDec 16, 2013 · By Francoise von Trapp · 3D Event Coverage For years, we’ve been talking about the performance and power benefits of 2.5D and 3D ICs. We’ve also been talking...
Si Photonics: 3D ASIP’s Pre-game ShowDec 13, 2013 · By Francoise von Trapp · 3D Event Coverage Is Si photonics the vehicle that will finally catapult 2.5D and 3D IC to stardom? While that was the story...
3D ASIP 2013: A 10th Anniversary RetrospectiveDec 05, 2013 · By Francoise von Trapp · Blogs Nothing says “Christmas is coming” to me like the annual 3D ASIP Conference that has taken place each December for...
Introducing the 3D InCites Technical Advisory BoardNov 27, 2013 · By Francoise von Trapp · Blogs Ever since 3D InCites was first launched in 2009, it has had an official technical advisory board of 2.5D and...
SemiSisters: Factoring in the XNov 22, 2013 · By Francoise von Trapp · Blogs This blog post has nothing to do with 3D technologies. But since I run this website and the Françoisein3D blog,...