The 3D InCites Podcast Backtrack – 2024 in Review
Dec 18, 2024 · By Francoise von Trapp · Blogs, Francoise in 3D
Latest Posts - Page 18
SEMICON Singapore 2014: A Rosy Outlook for 2.5D and 3D ICs
This week, at the invitation of SEMI Southeast Asia, I made the monumental trek from Phoenix, AZ to Singapore to...
GSA Silicon Summit: What’s next for the 2.5D/3D Ecosystem?
Due to schedule conflicts, I was unable to attend this year’s Silicon Summit, which took place April 10, 2014 at...
Oerlikon Systems: Pragmatic and Poised for 3D IC High Volume Manufacturing
In the last 40 years, the Principality of Liechtenstein has evolved from a purely agricultural state into one of the...
Cascade Microtech Breaks Through the Barriers of 3D Test
For quite some time, the lack of cost-effective test solutions for 2.5D interposers and 3D stacked ICs (3D SICs) has...
3D Workshop Panel Discussion Focuses on 3D Standards and EDA Tool Readiness
Are slow standardization and CAD-tool development hindering the progress of 3D IC design and integration? This was the topic of discussion...
Calling for A Collaborative Semiconductor Supply Chain Comes at DATE 2014
Design and Test Europe 2014 (DATE 2014), which took place in Dresden, March 24-28 2014, brought together semiconductor design and test...
The Fraunhofer Cluster for 3D Integration Looks at the Big Picture
Two years ago, I visited to Fraunhofer IZM-ASSID, located in Dresden, Germany; to see first-hand what this particular arm of...
Silicon Saxony: Leading the Charge in More than Moore
Since the days even before the reunification of Germany; Saxony, and particularly Dresden, has been a vital center for microelectronics development...
Fogale Nanotech: Building The Swiss Army Knife of 3D IC Metrology and Inspection
In the world of 3D ICs, where features are becoming finer and submicron accuracy and precision is more important than...
Nimes, France: Influencing 3D Architectures for 2000 Years
I first visited Nimes, France when I was sixteen, on one of those whirlwind, ten-day, school-organized trips with my French...
Advanced Packaging Alphabet Soup Creates Chaos for IMAPS 3D Panel
All hell broke loose at the 3D Panel discussion at the 2014 IMAPS International Device Packaging Conference. Nobody was hurt,...
Is the Road to 3D ICs Paved with 3D SOC?
Ladies and Gentlemen of the semiconductor industry, we have a new acronym to add to 3D integration lexicon and its...
Interconnectology Revisited: Pizza Anyone?
Interconnectology returned as a topic of discussion to the 2014 BiTS Workshop through a keynote discussion delivered by Invensas’ president,...
Magic Chip-powered SuperPoP offers Near-term Alternative to TSVs
When I saw that Dev Gupta, Ph.D, of Advanced Packaging & Systems Technology Laboratories, LLC (APSTL) was presenting at the...
Fraunhofer EMFT: 25 years of 3D Integration in Munich
Wouldn’t it be great to get a text notification that you are almost out of toilet paper at home rather...
Triple I Prevails at EV Group
Invent, Innovate, Implement continues to be the mantra at EV Group, supplier of wafer bonding and lithography equipment for the MEMS,...
The 411 on CEA Leti’s Interposer Roadmap
When is an active die not an active die? When it’s an active interposer, of course! Ever since Nicolas Sillon,...
2.5D and 3D IC Technologies: Application Ready but Cost Limited?
Two schools of thought clearly emerged at last week’s European 3D TSV Summit, which took place on January 20 and...
Lessons Learned From the Trenches of 3D IC Manufacturing for Sensor Applications
The technologies are ready, the target high volume applications for 3D IC manufacturing have been identified, and now it’s about...
