SEMICON West 2024: Riding the Generative AI Winds of Change Jul 15, 2024 · By Francoise von Trapp · Blogs, Francoise in 3D
ECTC 2024: Advanced Packaging Engineers to the Rescue! Jun 01, 2024 · By Francoise von Trapp · Blogs, Francoise in 3D
The Nexus of Innovation for U.S. Semiconductor Manufacturing May 07, 2024 · By Francoise von Trapp · Blogs, Francoise in 3D
Are Design Tools and Thermal Solutions the Missing Links to 2.5D and 3D IC Production?Jun 10, 2014 · By Francoise von Trapp · 3D Event Coverage On one side of the fence, we have semiconductor device manufacturers (fabs, foundries, and OSATS) claiming to be ready to...
Glass Interposers Take the Stage at ECTC 2014Jun 03, 2014 · By Francoise von Trapp · 3D Event Coverage I have to admit, for some time I’ve been fairly skeptical about glass interposer technology as a viable alternative to...
ECTC 2014: Bridging the Gap to 2.5D and 3DJun 02, 2014 · By Francoise von Trapp · 3D Event Coverage Each year since I first attended the IEEE Electronic Component Technology Conference (ECTC) in 2009, the keynotes, panels and papers...
SSEC: Innovators in Single Wafer Wet Processing ToolsMay 23, 2014 · By Francoise von Trapp · Blogs 49 years ago, Solid State Equipment, LLC (SSEC) opened its doors with its first piece of semiconductor equipment; a seam...
News of 3D NAND Fab Construction: A sign of Progress or a PR Ruse?May 22, 2014 · By Francoise von Trapp · Blogs While I don’t claim to be an expert in 3D NAND technologies, I do keep my eye on what’s happening...
An Open Letter to Chip and System-level Designers Regarding 3D IntegrationMay 07, 2014 · By Francoise von Trapp · Blogs Dear Chip and System-level Designers, Allow me to introduce myself. My name is Françoise von Trapp, and I am known...
Process Improvements Target 3D IC Cost of OwnershipApr 30, 2014 · By Francoise von Trapp · Blogs Customers have asked and suppliers are listening. One sign of progress from last year to this year at SEMICON Singapore’s...
3D IC Adoption: What’s it going to Take?Apr 28, 2014 · By Francoise von Trapp · Blogs If, as we heard at last week’s 3D IC Forum at SEMICON Singapore, that technology challenges and cost are no...
SEMICON Singapore 2014: A Rosy Outlook for 2.5D and 3D ICsApr 27, 2014 · By Francoise von Trapp · Blogs This week, at the invitation of SEMI Southeast Asia, I made the monumental trek from Phoenix, AZ to Singapore to...
GSA Silicon Summit: What’s next for the 2.5D/3D Ecosystem?Apr 16, 2014 · By Francoise von Trapp · 3D Event Coverage Due to schedule conflicts, I was unable to attend this year’s Silicon Summit, which took place April 10, 2014 at...
Oerlikon Systems: Pragmatic and Poised for 3D IC High Volume ManufacturingApr 14, 2014 · By Francoise von Trapp · Blogs In the last 40 years, the Principality of Liechtenstein has evolved from a purely agricultural state into one of the...
Cascade Microtech Breaks Through the Barriers of 3D TestApr 07, 2014 · By Francoise von Trapp · Blogs For quite some time, the lack of cost-effective test solutions for 2.5D interposers and 3D stacked ICs (3D SICs) has...
3D Workshop Panel Discussion Focuses on 3D Standards and EDA Tool ReadinessApr 03, 2014 · By Francoise von Trapp · 3D Event Coverage Are slow standardization and CAD-tool development hindering the progress of 3D IC design and integration? This was the topic of discussion...
Calling for A Collaborative Semiconductor Supply Chain Comes at DATE 2014Mar 31, 2014 · By Francoise von Trapp · 3D Event Coverage Design and Test Europe 2014 (DATE 2014), which took place in Dresden, March 24-28 2014, brought together semiconductor design and test...
The Fraunhofer Cluster for 3D Integration Looks at the Big PictureMar 31, 2014 · By Francoise von Trapp · Blogs Two years ago, I visited to Fraunhofer IZM-ASSID, located in Dresden, Germany; to see first-hand what this particular arm of...
Silicon Saxony: Leading the Charge in More than MooreMar 27, 2014 · By Francoise von Trapp · Blogs Since the days even before the reunification of Germany; Saxony, and particularly Dresden, has been a vital center for microelectronics development...
Fogale Nanotech: Building The Swiss Army Knife of 3D IC Metrology and InspectionMar 25, 2014 · By Francoise von Trapp · Blogs In the world of 3D ICs, where features are becoming finer and submicron accuracy and precision is more important than...
Nimes, France: Influencing 3D Architectures for 2000 YearsMar 23, 2014 · By Francoise von Trapp · Blogs I first visited Nimes, France when I was sixteen, on one of those whirlwind, ten-day, school-organized trips with my French...
Advanced Packaging Alphabet Soup Creates Chaos for IMAPS 3D PanelMar 18, 2014 · By Francoise von Trapp · Blogs All hell broke loose at the 3D Panel discussion at the 2014 IMAPS International Device Packaging Conference. Nobody was hurt,...
Is the Road to 3D ICs Paved with 3D SOC?Mar 14, 2014 · By Francoise von Trapp · Blogs Ladies and Gentlemen of the semiconductor industry, we have a new acronym to add to 3D integration lexicon and its...