SEMICON West 2024: Riding the Generative AI Winds of Change Jul 15, 2024 · By Francoise von Trapp · Blogs, Francoise in 3D
ECTC 2024: Advanced Packaging Engineers to the Rescue! Jun 01, 2024 · By Francoise von Trapp · Blogs, Francoise in 3D
The Nexus of Innovation for U.S. Semiconductor Manufacturing May 07, 2024 · By Francoise von Trapp · Blogs, Francoise in 3D
GSA 3D IC Working Group Looks at 3D IC Readiness from Design through ManufacturingOct 24, 2014 · By Francoise von Trapp · Blogs At the recent GSA 3D IC Working Group Meeting (October 22, 2014), where speakers from BroadPak, Amkor, and Invensas presented...
3D Technology Snapshots from IMAPS 2014Oct 22, 2014 · By Francoise von Trapp · Blogs This year’s IMAPS International Symposium purported to have “the most interposer and 3D content under one roof.” I’m not sure...
IMAPS 2014: The Future of Packaging is System IntegrationOct 19, 2014 · By Francoise von Trapp · Blogs The annual International Microelectronics and Packaging Society (IMAPS) International Symposium has always focused more on advancements in mainstream packaging technologies,...
What are the Major Trends Shaping the Future of the IC Industry?Sep 18, 2014 · By Francoise von Trapp · Blogs Last week, I caught IC Insights’ Bill McClean’s talk at the IMAPS Arizona luncheon. In addition to predicting a steady...
Are we Getting Mixed Messages on 3D IC Production?Sep 03, 2014 · By Francoise von Trapp · Blogs While 3D IC production is underway for memory devices, some say demand for 3D ICs is still years away. Could...
Will 2.5D and 3D Stacking Save the Semiconductor Industry?Aug 27, 2014 · By Francoise von Trapp · Blogs Year’s ago, when I was managing editor of Advanced Packaging Magazine, each January issue featured an industry forecast cover story....
Are Chip Architects Finally Climbing on the 2.5D and 3D Bandwagon?Aug 15, 2014 · By Francoise von Trapp · Blogs Ever since SEMICON West 2014, I’ve been seeing a lot of coverage of the 2.5D and 3D adoption question on...
Are there still Gaps in 3D IC Readiness?Aug 01, 2014 · By Francoise von Trapp · Blogs Good news! At last week’s GSA 3D IC Packaging Working Group Meeting, July 23, 2014, Jan Vardaman uttered the words...
GlobalFoundries and IBM: Stuck on the Rumor Mill?Jul 30, 2014 · By Francoise von Trapp · Blogs There’s nothing like a little industry gossip to get the juices flowing. I love it when the media churns out...
Semiconductor Equipment Manufacturer Consolidation UpdateJul 23, 2014 · By Francoise von Trapp · Blogs It was a much-talked-about topic this year at SEMICON West 2014 (SW2014) – this trend of semiconductor equipment manufacturer consolidation....
SEMICON West 2014: Supplier Updates for 2.5D and 3D ProcessesJul 21, 2014 · By Francoise von Trapp · Blogs SEMICON West 2014 brought its usual flurry of supplier announcements on new equipment and process improvements; but there weren’t as...
Does 3D Integration Need to Go to HVM To be Real?Jul 16, 2014 · By Francoise von Trapp · Blogs Consider for a moment that the ultimate goal of 3D integration is not to achieve high volume manufacturing (HVM) in...
Mark Adams Keynote Calls for Partnership in a Changing Semiconductor LandscapeJul 15, 2014 · By Francoise von Trapp · 3D Event Coverage The winds of change are blowing in the semiconductor industry. And while some cling tightly to the way things have...
Highlights of the 2014 3D InCites Awards BreakfastJul 11, 2014 · By Francoise von Trapp · 3D Event Coverage For the second consecutive year, a sizable group of 3D integration enthusiasts gathered at the Impress Lounge to honor the...
SEMICON West 2014: Are 3D ICs Getting the Squeeze?Jul 11, 2014 · By Francoise von Trapp · 3D In-Depth With the continued innovations in packaging technologies and 2.5D interposers pushing 3D ICs further out from one end, and 16/14nm...
Announcing the Winners of the 2014 3D InCites Awards Online PollJul 04, 2014 · By Francoise von Trapp · Blogs The judge’s votes are in and the online poll is closed, and I’m not telling you who won the 2014...
Having the Courage to Design in 3D TSVsJul 01, 2014 · By Francoise von Trapp · Blogs I don’t know why it still surprises me to read conflicting reports on the progress of 3D TSVs. But I...
Intel’s Next-Gen Xeon Phi processor to have Micron 3D Memory InsideJun 25, 2014 · By Francoise von Trapp · Blogs Somehow in all my preparations for the 2014 3D InCites Awards and planning the schedule for SEMICON West this week,...
2014 3D InCites Guide to 3D at SEMICON WestJun 24, 2014 · By Francoise von Trapp · 3D Event Coverage I can’t believe it’s already been a year since I last posted my annual guide to 3D at SEMICON West. ...
Time to Cast Your Votes for the 2014 3D InCites Awards!Jun 23, 2014 · By Francoise von Trapp · 3D Event Coverage The nominations are officially closed for the 2014 3D InCites Awards; and now comes the fun part. This year, while the industry...