The 3D InCites Podcast Backtrack – 2024 in Review
Dec 18, 2024 · By Francoise von Trapp · Blogs, Francoise in 3D
Latest Posts - Page 16
3D ASIP 2014 Sparks Mixed Reactions from the Media
Isn’t it interesting how different people attending the same event can come away with different perspectives? I attended last week’s...
Live Long and Prosper in an IoT World enabled by 3D ICs
Wait – was that a Klingon I just saw walking through the lobby? Are those two people wearing Star Trek...
3D ASIP Pre-Conference Symposium brings together Design and Process for 3D ICs
Despite efforts to leverage the one hour time difference from Phoenix to San Francisco to my advantage, I arrived on...
What does 3D Integration mean for your Company in 2015?
As December rolls in and 2014 comes to a close, I find myself reflecting on the past 11 months, and the predictions...
Putting Their Money on Glass Interposers
While the jury is still out on whether glass interposers will play a large or niche role in the interposer...
Congratulations Alexis Corona! Recipient of the 1st 3D InCites Awards Scholarship
I’m pretty sure the time I got to spend last week at the SEMI High Tech U Graduation ceremonies was the most...
Will a Sensor-based Revolution Enable a World of Abundance?
When I was a little kid, my (much older) brothers had to have PF Flyers, because according to the commercial...
Topics of Discussion at GIT 2014
In my previous post I talked a bit about the ongoing debate that went on during last week’s Global Interposer...
GIT 2014: “Call them Interposers, as God Intended”
Subu: “I find the whole concept of 2.5D fairly atrocious. I have banned its use.” Rao: “what are you going...
GLOBALFOUNDRIES has its 3D Ducks in a Row
The news about 3D readiness just keeps getting better. Last week I tuned into a GLOBALFOUNDRIES webcast, featuring speaker Rama...
Putting 3D Integration to the Test
3D stacking is “already old hand”; or so declared Brion Keller, Cadence, in his keynote talk at last week’s 5th...
GSA 3D IC Working Group Looks at 3D IC Readiness from Design through Manufacturing
At the recent GSA 3D IC Working Group Meeting (October 22, 2014), where speakers from BroadPak, Amkor, and Invensas presented...
3D Technology Snapshots from IMAPS 2014
This year’s IMAPS International Symposium purported to have “the most interposer and 3D content under one roof.” I’m not sure...
IMAPS 2014: The Future of Packaging is System Integration
The annual International Microelectronics and Packaging Society (IMAPS) International Symposium has always focused more on advancements in mainstream packaging technologies,...
What are the Major Trends Shaping the Future of the IC Industry?
Last week, I caught IC Insights’ Bill McClean’s talk at the IMAPS Arizona luncheon. In addition to predicting a steady...
Are we Getting Mixed Messages on 3D IC Production?
While 3D IC production is underway for memory devices, some say demand for 3D ICs is still years away. Could...
Will 2.5D and 3D Stacking Save the Semiconductor Industry?
Year’s ago, when I was managing editor of Advanced Packaging Magazine, each January issue featured an industry forecast cover story....
Are Chip Architects Finally Climbing on the 2.5D and 3D Bandwagon?
Ever since SEMICON West 2014, I’ve been seeing a lot of coverage of the 2.5D and 3D adoption question on...
